ZHCSQC3B april   2019  – march 2023 DLP470TE

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Capacitance at Recommended Operating Conditions
    8. 6.8  Timing Requirements
      1. 6.8.1 Timing Diagrams
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Micromirror Array Physical Characteristics
    11. 6.11 Micromirror Array Optical Characteristics
    12. 6.12 Window Characteristics
    13. 6.13 Chipset Component Usage Specification
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Interface
      2. 7.3.2 Timing
    4. 7.4 Device Functional Modes
    5. 7.5 Optical Interface and System Image Quality Considerations
      1. 7.5.1 Numerical Aperture and Stray Light Control
      2. 7.5.2 Pupil Match
      3. 7.5.3 Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 DMD Die Temperature Sensing
  9. Power Supply Recommendations
    1. 9.1 DMD Power Supply Power-Up Procedure
    2. 9.2 DMD Power Supply Power-Down Procedure
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
      1. 10.2.1 Layers
      2. 10.2.2 Impedance Requirements
      3. 10.2.3 Trace Width, Spacing
        1. 10.2.3.1 Voltage Signals
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
      2. 11.1.2 Device Markings
    2. 11.2 第三方产品免责声明
    3. 11.3 Documentation Support
      1. 11.3.1 Related Documentation
      2. 11.3.2 支持资源
      3. 11.3.3 Receiving Notification of Documentation Updates
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

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Pin Configuration and Functions

GUID-D5C0B7B9-2C6B-4D29-986D-994499F0CD2B-low.gif Figure 5-1 Series 410 Package. 257-pin FXJ. Bottom View.
CAUTION: To ensure reliable, long-term operation of the .47-inch 4K UHD S410 DMD, it is critical to properly manage the layout and operation of the signals identified in the table below. For specific details and guidelines, refer to the PCB Design Requirements for TI DLP Standard TRP Digital Micromirror Devices application report before designing the board.
Table 5-1 Pin Functions
PIN I/O(1) SIGNAL DATA
RATE
INTERNAL
TERMINATION
DESCRIPTION TRACE
LENGTH
(mil)
NAME NO.
D_AN(0) C6 I LVDS DDR Differential Data negative 805.0
D_AN(1) C3
D_AN(2) E1
D_AN(3) C4
D_AN(4) D1
D_AN(5) B8
D_AN(6) F4
D_AN(7) E3
D_AN(8) C11
D_AN(9) F3
D_AN(10) K4
D_AN(11) H3
D_AN(12) J3
D_AN(13) C13
D_AN(14) A5
D_AN(15) A3
D_AP(0) C7 I LVDS DDR Differential Data positive 805.0
D_AP(1) C2
D_AP(2) E2
D_AP(3) B4
D_AP(4) C1
D_AP(5) B7
D_AP(6) E4
D_AP(7) D3
D_AP(8) C12
D_AP(9) F2
D_AP(10) J4
D_AP(11) G3
D_AP(12) J2
D_AP(13) C14
D_AP(14) A6
D_AP(15) A4
D_BN(0) N4 I LVDS DDR Differential Data negative 805.0
D_BN(1) Z11
D_BN(2) W4
D_BN(3) W10
D_BN(4) L1
D_BN(5) V8
D_BN(6) W6
D_BN(7) M1
D_BN(8) R4
D_BN(9) W1
D_BN(10) U4
D_BN(11) V2
D_BN(12) Z5
D_BN(13) N3
D_BN(14) Z2
D_BN(15) L4
D_BP(0) M4 I LVDS DDR Differential Data positive 805.0
D_BP(1) Z12
D_BP(2) Z4
D_BP(3) Z10
D_BP(4) L2
D_BP(5) V9
D_BP(6) W7
D_BP(7) N1
D_BP(8) P4
D_BP(9) V1
D_BP(10) T4
D_BP(11) V3
D_BP(12) Z6
D_BP(13) N2
D_BP(14) Z3
D_BP(15) L3
D_CN(0) H27 I LVDS DDR Differential Data negative 805.0
D_CN(1) A20
D_CN(2) H28
D_CN(3) K28
D_CN(4) K30
D_CN(5) C23
D_CN(6) G27
D_CN(7) J30
D_CN(8) B24
D_CN(9) A21
D_CN(10) A27
D_CN(11) C29
D_CN(12) A26
D_CN(13) C25
D_CN(14) A29
D_CN(15) C30
D_CP(0) J27 I LVDS DDR Differential Data positive 805.0
D_CP(1) A19
D_CP(2) H29
D_CP(3) K27
D_CP(4) K29
D_CP(5) C22
D_CP(6) F27
D_CP(7) H30
D_CP(8) B25
D_CP(9) B21
D_CP(10) B27
D_CP(11) C28
D_CP(12) A25
D_CP(13) C24
D_CP(14) A28
D_CP(15) B30
D_DN(0) V25 I LVDS DDR Differential Data negative 805.0
D_DN(1) V28
D_DN(2) T30
D_DN(3) V27
D_DN(4) U30
D_DN(5) W23
D_DN(6) R27
D_DN(7) T28
D_DN(8) V20
D_DN(9) R28
D_DN(10) L27
D_DN(11) N28
D_DN(12) M28
D_DN(13) V18
D_DN(14) Z26
D_DN(15) Z28
D_DP(0) V24 I LVDS DDR Differential Data positive 805.0
D_DP(1) V29
D_DP(2) T29
D_DP(3) W27
D_DP(4) V30
D_DP(5) W24
D_DP(6) T27
D_DP(7) U28
D_DP(8) V19
D_DP(9) R29
D_DP(10) M27
D_DP(11) P28
D_DP(12) M29
D_DP(13) V17
D_DP(14) Z25
D_DP(15) Z27
SCTRL_AN G1 I LVDS DDR Differential Serial control negative(2) 805.0
SCTRL_AP F1 I LVDS DDR Differential Serial control negative(2) 805.0
SCTRL_BN V5 I LVDS DDR Differential Serial control negative(2) 805.0
SCTRL_BP V4 I LVDS DDR Differential Serial control negative(2) 805.0
SCTRL_CN C26 I LVDS DDR Differential Serial control negative(2) 805.0
SCTRL_CP C27 I LVDS DDR Differential Serial control positive(2) 805.0
SCTRL_DN P30 I LVDS DDR Differential Serial control negative(2) 805.0
SCTRL_DP R30 I LVDS DDR Differential Serial control positive(2) 805.0
DCLK_AN H2 I LVDS Differential Clock negative(2) 805.0
DCLK_AP H1 I LVDS Differential Clock positive(2) 805.0
DCLK_BN V6 I LVDS Differential Clock negative(2) 805.0
DCLK_BP V7 I LVDS Differential Clock positive(2) 805.0
DCLK_CN D27 I LVDS Differential Clock negative(2) 805.0
DCLK_CP E27 I LVDS Differential Clock positive(2) 805.0
DCLK_DN N29 I LVDS Differential Clock negative(2) 805.0
DCLK_DP N30 I LVDS Differential Clock positive(2) 805.0
SCPCLK A10 I LVCMOS Pulldown Serial communications port clock. Active only when SCPENZ is logic low(2)
SCPDI A12 I LVCMOS SDR Pulldown Serial communications port data input. Synchronous to SCPCLK rising edge(2)
SCPENZ C10 I LVCMOS Pulldown Serial communications port enable active low(2)
SCPDO A11 O LVCMOS SDR Serial communications port output
RESET_ADDR(0) Z13 I LVCMOS Pulldown Reset driver address select(2)
RESET_ADDR(1) W13
RESET_ADDR(2) V10
RESET_ADDR(3) W14
RESET_MODE(0) W9 I LVCMOS Pulldown Reset driver mode select(2)
RESET_SEL(0) V14 Reset driver level select(2)
RESET_SEL(1) Z8 Reset driver level select(2)
RESET_STROBE Z9 I LVCMOS Pulldown Rising edge latches in RESET_ADDR, RESET_MODE, and RESET_SEL.(2)
PWRDNZ A8 I LVCMOS Pulldown Active low device reset.(2)
RESET_OEZ W15 I LVCMOS Pullup Active low output enable for internal reset driver circuits.(2)
RESET_IRQZ V16 O LVCMOS Active low output interrupt to the DLP® display controller
EN_OFFSET C9 O LVCMOS Active high enable for external VOFFSET regulator
PG_OFFSET A9 I LVCMOS Pullup Active low fault from external VOFFSET regulator(2)
TEMP_N B18 Analog Temperature sensor diode cathode
TEMP_P B17 Analog Temperature sensor diode anode
RESERVED **MUST VERIFY WITH SRC DATA SHEET D12, D13, D14, D15, D16, D17, D18, D19, U12, U13, U14, U15 NC Analog Pulldown Do not connect on the DLP system board. No connect. No electrical connections from CMOS bond pad to package pin
No Connect U16, U17, U18, U19 NC No connect. No electrical connection from the CMOS bond pad to package pin
RESERVED_BA W11 O LVCMOS Do not connect on the DLP system board.
RESERVED_BB B11
RESERVED_BC Z20
RESERVED_BD C18
RESERVED_PFE A18 I LVCMOS Pulldown Connect to ground on the DLP system board.
RESERVED_TM C8
RESERVED_TP0 Z19 I Analog Do not connect on the DLP system board.
RESERVED_TP1 W20
RESERVED_TP2 W19
VBIAS(3) C15, C16, V11, V12 P Analog Supply voltage for positive bias level of micromirror reset signal
VRESET(3) G4, H4, J1, K1 P Analog Supply voltage for negative reset level of micromirror reset signal
VOFFSET(3) A30, B2, M30, Z1, Z30 P Analog Supply voltage for HVCMOS logic. Supply voltage for positive offset level of micromirror reset signal. Supply voltage for stepped high voltage at micromirror address electrodes
VCC(3) A24, A7, B10, B13, B16, B19, B22, B28, B5, C17, C20, D4, J29, K2, L29, M2, N27, U27, V13, V15, V22, W17, W21, W26, W29, W3, Z18, Z23, Z29, Z7 P Analog Supply voltage for LVCMOS core. Supply voltage for positive offset level of micromirror reset signal during power down. Supply voltage for normal high level at micromirror address electrodes
VSS(4) A13, A22, A23, B12, B14, B15, B20, B23, B26, B29, B3, B6, B9, C19, C21, C5, D2, G2, J28, K3, L28, L30, M3, P27, P29, U29, V21, V23, V26, W12, W16, W18, W2, W22, W25, W28, W30, W5, W8, Z21, Z22, Z24 G Device ground. Common return for all power
I = Input, O = Output, P = Power, G = Ground, NC = No connect
These signals are very sensible to noise or intermittent power connections, which can cause irreversible DMD micromirror array damage or, to a lesser extent, image disruption. Consider this precaution during DMD board design and manufacturer handling of the DMD subassemblies.
VBIAS, VCC, VOFFSET, and VRESET power supplies must be connected for proper DMD operation.
VSS must be connected for proper DMD operation.