ZHCSHA9B August   2017  – January 2018 DAC5672A

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     功能框图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Electrical Characteristics
    7. 6.7  Electrical Characteristics: AC Characteristics
    8. 6.8  Electrical Characteristics: Digital Characteristics
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Interfaces
      2. 7.3.2 Dual-Bus Data Interface and Timing
      3. 7.3.3 Single-Bus Interleaved Data Interface and Timing
    4. 7.4 Device Functional Modes
      1. 7.4.1 DAC Transfer Function
      2. 7.4.2 Analog Outputs
      3. 7.4.3 Output Configurations
      4. 7.4.4 Differential With Transformer
      5. 7.4.5 Single-Ended Configuration
      6. 7.4.6 Reference Operation
        1. 7.4.6.1 Internal Reference
        2. 7.4.6.2 External Reference
        3. 7.4.6.3 Gain Setting Option
        4. 7.4.6.4 Sleep Mode
    5. 7.5 Programming
      1. 7.5.1 Digital Inputs and Timing
        1. 7.5.1.1 Digital Inputs
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11.4 静电放电警告

esds-image

ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。