ZHCSEO3B April   2012  – January 2016 DAC101C081 , DAC101C081Q , DAC101C085

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 说明 （续）
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 AC and Timing Characteristics
    7. 8.7 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 DAC Section
      2. 9.3.2 Output Amplifier
      3. 9.3.3 Reference Voltage
      4. 9.3.4 Power-On Reset
      5. 9.3.5 Simultaneous Reset
      6. 9.3.6 Additional Timing Information: toutz
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power-Down Modes
    5. 9.5 Programming
      1. 9.5.1 Serial Interface
      2. 9.5.2 Basic I2C™ Protocol
      3. 9.5.3 Standard-Fast Mode
      4. 9.5.4 High-Speed (Hs) Mode
      5. 9.5.5 I2C Slave (Hardware) Address
      6. 9.5.6 Writing to the DAC Register
      7. 9.5.7 Reading from the DAC Register
    6. 9.6 Registers
      1. 9.6.1 DAC Register
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Bipolar Operation
      2. 10.1.2 DSP/Microprocessor Interfacing
        1. 10.1.2.1 Interfacing to the 2-wire Bus
        2. 10.1.2.2 Interfacing to a Hs-mode Bus
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
    1. 11.1 Using References as Power Supplies
      1. 11.1.1 LM4132
      2. 11.1.2 LM4050
      3. 11.1.3 LP3985
      4. 11.1.4 LP2980
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 器件支持
      1. 13.1.1 器件命名规则
        1. 13.1.1.1 技术规格定义
    2. 13.2 相关链接
    3. 13.3 社区资源
    4. 13.4 商标
    5. 13.5 静电放电警告
    6. 13.6 Glossary
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 Layout

12.1 Layout Guidelines

For best accuracy and minimum noise, the printed circuit board containing the DAC101C081 requires separate analog and digital areas. The areas are defined by the locations of the analog and digital power planes. Both of these planes should be located on the same board layer. There should be a single ground plane. A single ground plane is preferred if digital return current does not flow through the analog ground area. Frequently a single ground plane design will use a fencing technique to prevent the mixing of analog and digital ground current. Separate ground planes should only be utilized when the fencing technique is inadequate. The separate ground planes must be connected in one place, preferably near the DAC101C081. Special care is required to ensure that digital signals with fast edge rates do not pass over split ground planes. They must always have a continuous return path below their traces.

The DAC101C081 power supply should be bypassed with a 4.7-µF and a 0.1-µF capacitor as close as possible to the device with the 0.1 µF right at the device supply pin. The 4.7-µF capacitor should be a tantalum type and the 0.1-µF capacitor should be a low ESL, low ESR type. The power supply for the DAC101C081 should only be used for analog circuits.

Avoid crossover of analog and digital signals and keep the clock and data lines on the component side of the board. These clock and data lines require controlled impedances.

12.2 Layout Example

DAC101C081 DAC101C081Q DAC101C085 layout_SNVS801.gif Figure 35. Layout Example