ZHCSC33A February   2014  – December 2023 CSD88539ND

PRODUCTION DATA  

  1.   1
  2. 1特性
  3. 2应用范围
  4. 3说明
  5. 4Specifications
    1. 4.1 Electrical Characteristics
    2. 4.2 Thermal Information
    3. 4.3 Typical MOSFET Characteristics
  6. 5Device and Documentation Support
    1. 5.1 Trademarks
    2. 5.2 静电放电警告
  7. 6Revision History
  8. 7Mechanical Data

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

Thermal Information

(TA = 25°C unless otherwise stated)
THERMAL METRICMINTYPMAXUNIT
RθJLJunction-to-Lead Thermal Resistance(1)20°C/W
RθJAJunction-to-Ambient Thermal Resistance(1)(2)75
RθJC is determined with the device mounted on a 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu pad on a 1.5-inch × 1.5-inch (3.81-cm × 3.81-cm), 0.06-inch (1.52-mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board design.
Device mounted on FR4 material with 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu.