ZHCSLH5K August 1998 – June 2020 CD4049UB , CD4050B
PRODUCTION DATA
请参考 PDF 数据表获取器件具体的封装图。
| THERMAL METRIC(1) | CD4049UB | CD4050B | UNIT | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| D (SOIC) | DW (SOIC) | E (PDIP) | NS (SO) | PW (TSSOP) | D (SOIC) | DW (SOIC) | E (PDIP) | NS (SO) | PW (TSSOP) | |||
| 16 PINS | 16 PINS | 16 PINS | 16 PINS | 16 PINS | 16 PINS | 16 PINS | 16 PINS | 16 PINS | 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance(2) | 81.6 | 81.6 | 49.5 | 84.3 | 108.9 | 81.6 | 81.2 | 49.7 | 83.8 | 108.4 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 41.5 | 44.5 | 36.8 | 43 | 43.7 | 41.5 | 44.1 | 37 | 42.5 | 43.2 | °C/W |
| RθJB | Junction-to-board thermal resistance | 39 | 46.3 | 29.4 | 44.6 | 54 | 39 | 45.9 | 29.6 | 44.1 | 53.5 | °C/W |
| ψJT | Junction-to-top characterization parameter | 10.7 | 16.5 | 21.7 | 12.8 | 4.6 | 10.7 | 16.1 | 21.9 | 12.5 | 4.5 | °C/W |
| ψJB | Junction-to-board characterization parameter | 38.7 | 45.8 | 29.3 | 44.3 | 53.4 | 38.7 | 45.4 | 29.5 | 43.8 | 52.9 | °C/W |