ZHCSSA2C April   2023  – June 2023 CC2340R5

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 功能方框图
  6. 5 Revision History
  7. 6 Device Comparison
  8. 7 Pin Configuration and Functions
    1. 7.1 Pin Diagram – RKP Package (Top View)
    2. 7.2 Signal Descriptions – RKP Package
    3. 7.3 Connections for Unused Pins and Modules – RKP Package
    4. 7.4 Pin Diagram – RGE Package (Top View)
    5. 7.5 Signal Descriptions – RGE Package
    6. 7.6 Connections for Unused Pins and Modules – RGE Package
    7. 7.7 RKP and RGE Peripheral Pin Mapping
    8. 7.8 RKP and RGE Peripheral Signal Descriptions
  9. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  DCDC
    5. 8.5  Global LDO (GLDO)
    6. 8.6  Power Supply and Modules
    7. 8.7  Battery Monitor
    8. 8.8  Temperature Sensor
    9. 8.9  Power Consumption - Power Modes
    10. 8.10 Power Consumption - Radio Modes
    11. 8.11 Nonvolatile (Flash) Memory Characteristics
    12. 8.12 Thermal Resistance Characteristics
    13. 8.13 RF Frequency Bands
    14. 8.14 Bluetooth Low Energy - Receive (RX)
    15. 8.15 Bluetooth Low Energy - Transmit (TX)
    16. 8.16 Proprietary Radio Modes
    17. 8.17 2.4 GHz RX/TX CW
    18. 8.18 Timing and Switching Characteristics
      1. 8.18.1 Reset Timing
      2. 8.18.2 Wakeup Timing
      3. 8.18.3 Clock Specifications
        1. 8.18.3.1 48 MHz Crystal Oscillator (HFXT)
        2. 8.18.3.2 48 MHz RC Oscillator (HFOSC)
        3. 8.18.3.3 32 kHz Crystal Oscillator (LFXT)
        4. 8.18.3.4 32 kHz RC Oscillator (LFOSC)
    19. 8.19 Peripheral Characteristics
      1. 8.19.1 UART
        1. 8.19.1.1 UART Characteristics
      2. 8.19.2 SPI
        1. 8.19.2.1 SPI Characteristics
        2. 8.19.2.2 SPI Controller Mode
        3. 8.19.2.3 SPI Timing Diagrams - Controller Mode
        4. 8.19.2.4 SPI Peripheral Mode
        5. 8.19.2.5 SPI Timing Diagrams - Peripheral Mode
      3. 8.19.3 I2C
        1. 8.19.3.1 I2C
        2. 8.19.3.2 I2C Timing Diagram
      4. 8.19.4 GPIO
        1. 8.19.4.1 GPIO DC Characteristics
      5. 8.19.5 ADC
        1. 8.19.5.1 Analog-to-Digital Converter (ADC) Characteristics
      6. 8.19.6 Comparators
        1. 8.19.6.1 Ultra-low power comparator
  10. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Bluetooth 5.3 Low Energy
      2. 9.3.2 802.15.4 (Thread and Zigbee)
    4. 9.4  Memory
    5. 9.5  Cryptography
    6. 9.6  Timers
    7. 9.7  Serial Peripherals and I/O
    8. 9.8  Battery and Temperature Monitor
    9. 9.9  µDMA
    10. 9.10 Debug
    11. 9.11 Power Management
    12. 9.12 Clock Systems
    13. 9.13 Network Processor
  11. 10Application, Implementation, and Layout
    1. 10.1 Reference Designs
    2. 10.2 Junction Temperature Calculation
  12. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Tools and Software
      1. 11.2.1 SimpleLink™ Microcontroller Platform
    3. 11.3 Documentation Support
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 静电放电警告
    7. 11.7 术语表
  13. 12Mechanical, Packaging, and Orderable Information

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订购信息

11.1 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to all part numbers and/or date-code. Each device has one of three prefixes/identifications: X, P, or null (no prefix) (for example, X is in preview; therefore, an X prefix/identification is assigned).

Device development evolutionary flow:

    XExperimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.
    PPrototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.
    nullProduction version of the silicon die that is fully qualified.

Production devices have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, RHB).

For orderable part numbers of devices in the RHB (5-mm x 5-mm) package type, see the Package Option Addendum of this document, the Device Information in Section 3, the TI website (www.ti.com), or contact your TI sales representative.

GUID-20230426-SS0I-33VN-V01H-9KSZCJKX51HP-low.svg Figure 11-1 Device Nomenclature