ZHCSFA6B June   2016  – July 2018 CC1350

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 功能框图
  2. 2修订历史记录
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram – RSM Package
    2. 4.2 Signal Descriptions – RSM Package
    3. 4.3 Pin Diagram – RHB Package
    4. 4.4 Signal Descriptions – RHB Package
    5. 4.5 Pin Diagram – RGZ Package
    6. 4.6 Signal Descriptions – RGZ Package
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption Summary
    5. 5.5  RF Characteristics
    6. 5.6  Receive (RX) Parameters, 861 MHz to 1054 MHz
    7. 5.7  Receive (RX) Parameters, 431 MHz to 527 MHz
    8. 5.8  Transmit (TX) Parameters, 861 MHz to 1054 MHz
    9. 5.9  Transmit (TX) Parameters, 431 MHz to 527 MHz
    10. 5.10 1-Mbps GFSK (Bluetooth low energy) – RX
    11. 5.11 1-Mbps GFSK (Bluetooth low energy) – TX
    12. 5.12 PLL Parameters
    13. 5.13 ADC Characteristics
    14. 5.14 Temperature Sensor
    15. 5.15 Battery Monitor
    16. 5.16 Continuous Time Comparator
    17. 5.17 Low-Power Clocked Comparator
    18. 5.18 Programmable Current Source
    19. 5.19 DC Characteristics
    20. 5.20 Thermal Characteristics
    21. 5.21 Timing and Switching Characteristics
      1. 5.21.1 Reset Timing
        1. Table 5-1 Reset Timing
      2. 5.21.2 Wakeup Timing
        1. Table 5-2 Wakeup Timing
      3. 5.21.3 Clock Specifications
        1. Table 5-3 24-MHz Crystal Oscillator (XOSC_HF)
        2. Table 5-4 32.768-kHz Crystal Oscillator (XOSC_LF)
        3. Table 5-5 48-MHz RC Oscillator (RCOSC_HF)
        4. Table 5-6 32-kHz RC Oscillator (RCOSC_LF)
      4. 5.21.4 Flash Memory Characteristics
        1. Table 5-7 Flash Memory Characteristics
      5. 5.21.5 Synchronous Serial Interface (SSI) Characteristics
        1. Table 5-8 Synchronous Serial Interface (SSI) Characteristics
    22. 5.22 Typical Characteristics
    23. 5.23 Typical Characteristics – Sub-1 GHz
    24. 5.24 Typical Characteristics – 2.4 GHz
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Main CPU
    3. 6.3  RF Core
    4. 6.4  Sensor Controller
    5. 6.5  Memory
    6. 6.6  Debug
    7. 6.7  Power Management
    8. 6.8  Clock Systems
    9. 6.9  General Peripherals and Modules
    10. 6.10 Voltage Supply Domains
    11. 6.11 System Architecture
  7. 7Application, Implementation, and Layout
    1. 7.1 Application Information
    2. 7.2 TI Design or Reference Design
  8. 8器件和文档支持
    1. 8.1  器件命名规则
    2. 8.2  工具和软件
    3. 8.3  文档支持
    4. 8.4  德州仪器 (TI) 低功耗射频网站
    5. 8.5  其他信息
    6. 8.6  社区资源
    7. 8.7  商标
    8. 8.8  静电放电警告
    9. 8.9  出口管制提示
    10. 8.10 术语表
  9. 9机械、封装和可订购信息
    1. 9.1 封装信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RSM|32
  • RGZ|48
  • RHB|32
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.22 Typical Characteristics

CC1350 D007_SWRS158.gif
Figure 5-4 Active Mode (MCU) Current Consumption vs
Supply Voltage (VDDS)
CC1350 D007_SWRS181.gif
Figure 5-6 SoC ADC, Integral Nonlinearity vs
Digital Output Code
CC1350 D012_SWRS158.gif
Figure 5-8 SoC ADC Output vs Supply Voltage
(Fixed Input, Internal Reference, No Scaling)
CC1350 PER_vs_level_swrs181.png
Figure 5-10 RX, (50-kbps) Packet Error Rate (PER) vs
Input RF Level vs Frequency Offset, 868 MHz
CC1350 D037_stand_current_Temp_SWRS183.gif
Figure 5-5 Standby MCU Current Consumption, 32-kHz Clock, RAM and MCU Retention
CC1350 D008_SWRS181.gif
Figure 5-7 SoC ADC, Differential Nonlinearity vs
Digital Output Code
CC1350 D036_Soc_ADC_out_temp_SWRS181.gif
Figure 5-9 SoC ADC Output vs Temperature
(Fixed Input, Internal Reference, No Scaling)