ZHCSCA4B January   2014  – June 2014

PRODUCTION DATA.  

  1. 特性
  2. 应用范围
  3. 说明
  4. 简化图表
  5. 修订历史记录
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  A6 Coil Specification
      2. 8.3.2  EMI Shield
      3. 8.3.3  I2C Interface
      4. 8.3.4  Active or Passive Wake-up State
      5. 8.3.5  Smart Key or Immobilizer Handling
      6. 8.3.6  Option Select Pins
      7. 8.3.7  LED Modes
      8. 8.3.8  Foreign Object Detection (FOD) and Parasitic Metal Object Detect (PMOD) CalibrationForeign Object Detection (FOD) and Parasitic Metal Object Detect (PMOD) Calibration description.
      9. 8.3.9  Shut Down via External Thermal Sensor or Trigger
      10. 8.3.10 Fault Handling and Indication
      11. 8.3.11 Power Transfer Start Signal
      12. 8.3.12 Power-On Reset
      13. 8.3.13 External Reset, RESET Pin
      14. 8.3.14 Trickle Charge and CS100
        1. 8.3.14.1 Over-Current Protection Over-Current Protection description.
      15. 8.3.15 Over-Voltage Protection Over-Voltage Protection section.
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power Transfer
      2. 8.4.2 Communication
      3. 8.4.3 Power Trains
      4. 8.4.4 Signal Processing Components
  9. Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Capacitor Selection
        2. 9.2.1.2 Current Monitoring Requirements
        3. 9.2.1.3 All Unused Pins
        4. 9.2.1.4 Input Regulators
        5. 9.2.1.5 Input Power Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Active or Passive Wake-up State
        2. 9.2.2.2 EMI Shield
        3. 9.2.2.3 LED mode
        4. 9.2.2.4 Number of Transmitter Coils
      3. 9.2.3 Application Performance Plots
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 术语表
  13. 13机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 修订历史记录

Changes from * Revision (January 2014) to A Revision

  • 已将预览文档更新为完整版。Go

Changes from A Revision (March 2014) to B Revision

  • Deleted 关于无线电源联盟 (WPC) A19 和 A21 发射器类型技术规范的全部参考内容。Go
  • Changed 增强型寄生金属物体检测 (PMOD) 要点 Go
  • Changed bq500414Q 说明。Go
  • Changed Pin Functions Table EMI_SHIELD pin from O to I. Go
  • Changed Pin Functions Table COIL_SEL pin from I/O to I.Go
  • Changed JEDEC document JEP157 Handling Ratings note.Go
  • Changed Foreign Object Detection (FOD) and Parasitic Metal Object Detect (PMOD) Calibration description. Go
  • Changed Over-Current Protection description.Go
  • Changed Over-Voltage Protection section.Go