BOOSTXL-CC2650MA
SimpleLink™ Bluetooth® 低功耗 CC2650 模組 BoosterPack™ 外掛程式模組
BOOSTXL-CC2650MA
概覽
SimpleLink™ Bluetooth® 低功耗 CC2650 模組 BoosterPack 外掛程式模組可快速輕鬆地將藍牙低功耗新增至 LaunchPad™ 開發套件。只要將 CC2650 模組 BoosterPack 套件插入 MSP432™ 微控制器 (MCU) LaunchPad 套件即可開始使用!在這裡可找到開始著手開發的軟體範例。
CC2650 模組 BoosterPack 套件是使用無線網路處理器軟體進行編程,可讓您透過簡易 UART 介面在任何應用中加入藍牙低功耗連線功能。模組 BoosterPack 套件也包括編程和偵錯 CC2650 模組所用的 JTAG 連接。如此可讓您在 CC2650 模組上開發任何藍牙低功耗應用。
附註:若要使用軟體範例和 CC2650 模組 BoosterPack,也需要搭配 MSP432 LaunchPad 套件。提供兩個 EVM 的搭售產品。
特點
- 藍牙低功耗模組 BoosterPack 套件,使用 CC2650 模組與整合式天線
- 包含做為應用處理器使用的 MSP432 MCU 軟體範例
- 符合 FCC/IC、CE 及 ARIB 無線電標準的預先認證
- 用來開發模組上任何藍牙低功耗應用的偵錯介面
- 取得 Bluetooth 4.2 規格認證
- 1 個 CC2650 模組 BoosterPack
- 10 接腳 JTAG 偵錯纜線
- 1 個附加的 CC2650 模組範例
- 若要下載於 MSP432 LaunchPad 執行的主機程式碼範例,請造訪此頁面
低耗電 2.4GHz 產品
訂購並開始開發
BOOSTXL-CC2650MA — TI SimpleLink™ 低功耗藍牙® CC2650 模組 BoosterPack™ 插入式模組
BOOSTXL-CC2650MA — TI SimpleLink™ 低功耗藍牙® CC2650 模組 BoosterPack™ 插入式模組
SIMPLELINK-SDK-BLUETOOTH-PLUGIN — Bluetooth Plug-in for SimpleLink™ MCU SDK
支援產品和硬體
產品
Arm Cortex-M4 MCU
Wi-Fi 產品
低耗電 2.4GHz 產品
硬體開發
開發套件
開發板
SIMPLELINK-SDK-BLUETOOTH-PLUGIN — Bluetooth Plug-in for SimpleLink™ MCU SDK
Windows Installer for SimpleLink SDK BLE Plugin
macOS Installer for SimpleLink SDK BLE Plugin
Linux Installer for SimpleLink SDK BLE Plugin
產品
Arm Cortex-M4 MCU
Wi-Fi 產品
低耗電 2.4GHz 產品
硬體開發
開發套件
開發板
文件
SimpleLink SDK BLE Plugin User's Guide
新功能
- This version of the SimpleLink Bluetooth Plugin now enables a BLE two-chip solution to act as a GAP Central role. Previous versions of this plugin only included support for GAP Peripheral role. This new functionality is showcased through the addition of the new simple_central example, which uses the MSP432E401Y as the Host device and the CC26x2R1 as the NWP. The simple_central example demonstrates the following features:
- Host: MSP432E401Y
- NWP: CC26X2R1
- GAP Central role support
- Host Controller Interface (HCI) protocol used for communication with the NWP
- BLE5 support
- Power management
- Low Energy Secure Connection (LESC) Pairing
- Tested with up to 4 peripherals connected simultaneously (but can support more than 4 connections)
- Supports a subset of TI Vendor Specific HCI commands and Bluetooth LE HCI commands/events. More information on these APIs can be found BLE Vendor Specific API Guide.
- Works out-of-box with the Sensors BoosterPack and Project Zero examples that are also in the SimpleLink SDK Bluetooth Plugin.
- The GAP Central source code is also showcased in a separate downloadable: the SimpleLink BLE Plugin Azure Gateway Example Pack. This example pack demonstrates enabling a user’s BLE two-chip solution to become a gateway to the Azure IoT cloud. The SimpleLink BLE Plugin Azure Gateway Example Pack can be found on www.ti.com.
版本資訊
The SimpleLink™ SDK BLE Plugin is a companion software package that enables the use of a Bluetooth radio on any standard MSP432P4 platform, MSP432E4 or CC32XX platform, and enables this two-chip solution to act as either a GAP Peripheral role or a GAP Central role. By having the ability to seamlessly and modularly add Bluetooth functionality (more specifically Bluetooth Low Energy/BLE) to an embedded system, a programmer can enable their embedded device to become a gateway to various IOT infrastructures.
For examples demonstrating the two-chip solution in a peripheral role, the plugin leverages the use of the TI Simple Application Processor (SAP) driver connected to a CC26xx Simple Network Processor (SNP) to provide a highly customizable hardware configuration. For software connectivity between the SAP and the SNP, an architecture agnostic HAL/Drivers layer is used to promote software portability and maximize collateral reuse.
For examples demonstrating the two-chip solution in a central role, communication between the NWP and the Host occurs through a UART serial interface using the Host Controller Interface (HCI) protocol. TI Vendor Specific HCI commands and a limited subset of Bluetooth LE HCI commands/events to implement a Bluetooth application. By using TI Vendor Specific commands and events, the application can communicate with and access the BLE stack.
CC26XX-REPORTS — CC26xx Regulatory Certification Reports
支援產品和硬體
產品
低耗電 2.4GHz 產品
硬體開發
開發板
CC26XX-REPORTS — CC26xx Regulatory Certification Reports
產品
低耗電 2.4GHz 產品
硬體開發
開發板
文件
Link to FCC, ISED, CE, & Japan Certification Reports
Link to FCC, ISED, CE, & UK, Japan, Korea, and Taiwan Certification Reports
Link to FCC, ISED, CE, & UK Certification Reports
Link to FCC, ISED, CE, & UK Certification Reports
Link to CC3230x-CC26x2EM-7ID Reference-Only CE & FCC Certification Reports
版本資訊
This page provides access to the CC26XX certification reports. Here you will find certification reports for both modules and EVMs. Note that module certification reports can be reused by the customer for regulatory compliance. However the customer should consult with their regulatory house to ensure they meet the requirements for certification at their product level. EVM certification reports are provided for reference only. When using a chip down version, the customer is responsible for their own certification.
新功能
- Updated CC2651R3SIPAT0MOUR with Japan, Korea, and Tiawan reports
- Updated CC2652RSIPMOT CE with missing safety report
BLE-STACK-2-X — BLE-STACK - V2.2 (Support for CC2640/CC2650)
支援產品和硬體
產品
低耗電 2.4GHz 產品
硬體開發
開發套件
開發板
BLE-STACK-2-X — BLE-STACK - V2.2 (Support for CC2640/CC2650)
產品
低耗電 2.4GHz 產品
硬體開發
開發套件
開發板
文件
Archive Installers for Simplelink BLE 2 x SDK
版本資訊
This is version 2.2.8 of the TI Bluetooth® low energy protocol stack Software Development Kit (SDK). The BLE-Stack SDK allows for the development of single-mode Bluetooth low energy (BLE) applications on TI's first generation SimpleLink Bluetooth low energy CC2640 and Multi-Standard CC2650 wireless microcontroller units (MCUs) supporting version 5.1 of the Bluetooth specification with features defined by version 4.2 of the Bluetooth specification. The CC26x0 family of wireless MCUs includes a 32-bit Arm® Cortex™-M3 as the main application CPU running at 48 MHz, a dedicated Cortex-M0 processor for the radio / Physical Layer (PHY), and an autonomous Sensor Controller Engine for low-power sensing applications. The BLE protocol stack is built on top of the TI Real-time Operating System (TI-RTOS) which provides advanced power management and flexible peripheral driver capabilities allowing the development of highly optimized and power efficient standalone or network processor applications. The TI-RTOS SDK is installed during the BLE-Stack SDK installation.
Version 2.2.8 of the BLE-Stack is a maintenance update to TI's existing royalty-free Bluetooth low energy software protocol stack which is certified for Bluetooth specification version 5.1. This release includes support for all core specification version 4.2 Low Energy (LE) features as well as several development kits. This protocol stack update is in addition to support of all major Bluetooth LE core specification version 4.1 features, including support for up to 8 master or slave BLE connections. Please note that no Bluetooth 5 or Bluetooth 5.1 features are supported. A few examples of what can be created using the sample applications in this SDK and/or the additional resources found in the Examples section below include Bluetooth beacons incorporating the popular Apple iBeacon® and Eddystone™ formats, glucose, heart rate and fitness monitors, dongles for cable replacement via a BLE Serial Port Bridge and industrial motor monitors.
See What's New section for an overview of the changes included in this release. The Bluetooth core specification version 4.2 features supported in this release allow development of the most secure and power efficient products incorporating the Bluetooth low energy specification.
新功能
- [PSIRT-129] The generate key functions (ECCROMCC26XX_genKeys, and ECC_generateKey) shall now validate the ECC key pair
設計檔案
技術文件
| 類型 | 標題 | 下載最新的英文版本 | 日期 | |||
|---|---|---|---|---|---|---|
| 證書 | BOOSTXL-CC2650MA EU Declaration of Conformity (DoC) | 2019/1/2 | ||||
| 電子書 | TI-RSLK modules 1 - 20 (Rev. A) | 2018/5/30 | ||||
| 更多文件說明 | Lab: Sensor Integration | 2017/11/17 | ||||
| 更多文件說明 | Jacki Project Lecture | 2017/11/17 | ||||
| 更多文件說明 | Introduction: Sensor Integration | 2017/11/17 | ||||
| 白皮書 | SimpleLink™ MSP432™ MCU for electronic lock and intrusion HMI keypad | 2017/9/18 | ||||
| 應用說明 | Running Standalone Bluetooth® low energy Applications on CC2650 Module (Rev. A) | PDF | HTML | 2017/6/7 | |||
| 使用指南 | CC2650 Module BoosterPack™ Getting Started Guide (Rev. A) | 2016/6/29 |