TMDS64DC01EVM is a prototype evaluation module and is available in limited quantities.
TMDS64DC01EVM
AM64x IO 링크 및 고속 분리 카드
TMDS64DC01EVM
개요
The AM64x IO-Link and high speed expansion board is an add-on module for the AM64x GP EVM. This board includes eight (8) IO-Link ports and general purpose signal breakout. The Breakout board section provides the test access to all the IO signals included on the High Speed Expansion connector from AM64x EVM.
This design helps build a universal and scalable IO-Link master. This IO link board/breakout board shall have 150 pin HSE connector and 20 pin ADC connector to mate with General Processor EVM board and eight M12 connectors to execute IO-Link functionality.
특징
- Provides access to all signals on AM64x GP EVM HSE connector
- x8 M12 IO-Link ports with fault protection
- Precision current monitoring with onboard INA253
- x16 individually addressable LEDs
- Assembled HSE IO-link expansion board
Not included
- AM64x GP EVM (purchase here: https://www.ti.com/tool/TMDS64GPEVM)
- 24 V DC power supply, M12 IO-Link connectors/ cabling
멀티미디어 및 산업용 네트워킹 SoC
주문 및 개발 시작
평가 보드
TMDS64DC01EVM — AM64x IO 링크 및 고속 분리 카드
TMDS64DC01EVM — AM64x IO 링크 및 고속 분리 카드
설계 툴
SPRR457 — TMDS64DC01EVM Design File Package
지원되는 제품 및 하드웨어
SPRR457 — TMDS64DC01EVM Design File Package
출시 정보
The design resource accessed as www.ti.com/lit/zip/sprr457 or www.ti.com/lit/xx/sprr457/sprr457.zip has been migrated to a new user experience at www.ti.com/tool/download/SPRR457. Please update any bookmarks accordingly.
기술 자료
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2개 모두 보기
| 유형 | 직함 | 최신 영어 버전 다운로드 | 날짜 | ||
|---|---|---|---|---|---|
| 사용 설명서 | TMDS64DC01EVM User's Guide | PDF | HTML | 2021. 10. 26 | ||
| 인증서 | TMDS64DC01EVM EU RoHS Declaration of Conformity (DoC) | 2021. 3. 23 |