TMS320C6657
- One (C6655) or Two (C6657) TMS320C66x™ DSP Core Subsystems
(CorePacs), Each With
- 850 MHz (C6657 only), 1.0 GHz, or 1.25 GHz C66x Fixed- and Floating-Point CPU
Core
- 40 GMAC per Core for Fixed Point @ 1.25 GHz
- 20 GFLOP per Core for Floating Point @ 1.25 GHz
- 850 MHz (C6657 only), 1.0 GHz, or 1.25 GHz C66x Fixed- and Floating-Point CPU
Core
- Multicore Shared Memory
Controller (MSMC)
- 1024KB MSM SRAM Memory
(Shared by Two DSP C66x CorePacs for C6657) - Memory Protection Unit for Both MSM SRAM and DDR3_EMIF
- 1024KB MSM SRAM Memory
- Multicore Navigator
- 8192 Multipurpose Hardware Queues with Queue Manager
- Packet-Based DMA for Zero-Overhead Transfers
- Hardware Accelerators
- Two Viterbi Coprocessors
- One Turbo Coprocessor Decoder
- Peripherals
- Four Lanes of SRIO 2.1
- 1.24, 2.5, 3.125, and 5 GBaud Operation Supported Per Lane
- Supports Direct I/O, Message Passing
- Supports Four 1×, Two 2×, One 4×, and Two 1× + One 2× Link Configurations
- PCIe Gen2
- Single Port Supporting 1 or 2 Lanes
- Supports up to 5 GBaud Per Lane
- HyperLink
- Supports Connections to Other KeyStone Architecture Devices Providing Resource Scalability
- Supports up to 40 Gbaud
- Gigabit Ethernet (GbE) Subsystem
- One SGMII Port
- Supports 10-, 100-, and 1000-Mbps Operation
- 32-Bit DDR3 Interface
- DDR3-1333
- 4GB of Addressable Memory Space
- 16-Bit EMIF
- Universal Parallel Port
- Two Channels of 8 Bits or 16 Bits Each
- Supports SDR and DDR Transfers
- Two UART Interfaces
- Two Multichannel Buffered Serial Ports (McBSPs)
- I2C Interface
- 32 GPIO Pins
- SPI Interface
- Semaphore Module
- Up to Eight 64-Bit Timers
- Two On-Chip PLLs
- Four Lanes of SRIO 2.1
- Commercial Temperature:
- 0°C to 85°C
- Extended Temperature:
- –40°C to 100°C
The C665x are high performance fixed- and floating-point DSPs that are based on TIs KeyStone multicore architecture. Incorporating the new and innovative C66x DSP core, this device can run at a core speed of up to 1.25 GHz. For developers of a broad range of applications, both C665x DSPs enable a platform that is power-efficient and easy to use. In addition, the C665x DSPs are fully backward compatible with all existing C6000™ family of fixed- and floating-point DSPs.
TIs KeyStone architecture provides a programmable platform integrating various subsystems (C66x cores, memory subsystem, peripherals, and accelerators) and uses several innovative components and techniques to maximize intradevice and interdevice communication that lets the various DSP resources operate efficiently and seamlessly. Central to this architecture are key components such as Multicore Navigator that allows for efficient data management between the various device components. The TeraNet is a nonblocking switch fabric enabling fast and contention-free internal data movement. The multicore shared memory controller allows access to shared and external memory directly without drawing from switch fabric capacity.
For fixed-point use, the C66x core has 4× the multiply accumulate (MAC) capability of C64x+ cores. In addition, the C66x core integrates floating-point capability and the per-core raw computational performance is an industry-leading 40 GMACS per core and 20 GFLOPS per core (@1.25 GHz operating frequency). The C66x core can execute 8 single precision floating-point MAC operations per cycle and can perform double- and mixed-precision operations and is IEEE 754 compliant. The C66x core incorporates 90 new instructions (compared to the C64x+ core) targeted for floating-point and vector math oriented processing. These enhancements yield sizeable performance improvements in popular DSP kernels used in signal processing, mathematical, and image acquisition functions. The C66x core is backward code-compatible with TIs previous generation C6000 fixed- and floating-point DSP cores, ensuring software portability and shortened software development cycles for applications migrating to faster hardware.
The C665x DSP integrates a large amount of on-chip memory. In addition to 32KB of L1 program and data cache, 1024KB of dedicated memory can be configured as mapped RAM or cache. The device also integrates 1024KB of Multicore Shared Memory that can be used as a shared L2 SRAM and/or shared L3 SRAM. All L2 memories incorporate error detection and error correction. For fast access to external memory, this device includes a 32-bit DDR-3 external memory interface (EMIF) running at a rate of 1333 MHz and has ECC DRAM support.
This family supports a number of high-speed standard interfaces including RapidIO ver 2, PCI Express Gen2, and Gigabit Ethernet. This family of DSPs also includes I2C, UART, Multichannel Buffered Serial Port (McBSP), Universal Parallel Port (uPP), and a 16-bit asynchronous EMIF, along with general-purpose CMOS IO. For high throughput, low latency communication between devices or with an FPGA, a 40-Gbaud full-duplex interface called HyperLink is included.
The C665x devices have a complete set of development tools, which includes: an enhanced C compiler, an assembly optimizer to simplify programming and scheduling, and a Windows® debugger interface for visibility into source code execution.
TI’s KeyStone Multicore Architecture provides a high performance structure for integrating RISC and DSP cores with application-specific coprocessors and I/O. The KeyStone architecture is the first of its kind that provides adequate internal bandwidth for nonblocking access to all processing cores, peripherals, coprocessors, and I/O. This internal bandwidth is achieved with four main hardware elements: Multicore Navigator, TeraNet, Multicore Shared Memory Controller, and HyperLink.
Multicore Navigator is an innovative packet-based manager that controls 8192 queues. When tasks are allocated to the queues, Multicore Navigator provides hardware-accelerated dispatch that directs tasks to the appropriate available hardware. The packet-based system on a chip (SoC) uses the two Tbps capacity of the TeraNet switched central resource to move packets. The Multicore Shared Memory Controller lets processing cores access shared memory directly without drawing from the capacity of TeraNet, so packet movement cannot be blocked by memory access.
HyperLink provides a 40-Gbaud chip-level interconnect that lets SoCs work in tandem. The low-protocol overhead and high throughput of HyperLink make an ideal interface for chip-to-chip interconnections. Working with Multicore Navigator, HyperLink dispatches tasks to tandem devices transparently and executes tasks as if they are running on local resources.
技術文件
設計與開發
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TMDSEVM6657 — TMS320C6657 Lite 評估模組
The TMS3206657 Lite Evaluation Module (EVM), is an easy-to-use, cost-efficient development tool that helps developers quickly get started with designs using the C6657 or C6655 or C6654 family of DSPs. The EVM includes an on-board, single C6657 processor with robust connectivity options that allows (...)
SHELD-3P-DSP-SOMS — Sheldon DSP-FPGA 主機板
Learn more about Sheldon Instruments at (...)
TMDSEMU200-U — XDS200 USB 偵錯探測器
XDS200 是為 TI 嵌入式裝置偵錯的偵錯探測器(模擬器)。對於大多數裝置,建議使用較新、成本較低的 XDS110 (www.ti.com/tool/TMDSEMU110-U)。XDS200 支援單一 Pod 中廣泛的標準(IEEE1149.1、IEEE1149.7、SWD)。所有 XDS 偵錯探針在所有配備嵌入式追蹤緩衝器 (ETB) 的 Arm® 與 DSP 處理器中均支援核心與系統追蹤。
XDS200 透過 TI 20 接腳連接器(配備適用 TI 14 接腳、Arm Cortex® 10 接腳和 Arm 20 接腳的多重轉接器)連接到目標電路板,並透過 USB2.0 高速 (...)
TMDSEMU560V2STM-U — XDS560™ 軟體 v2 系統追蹤 USB 偵錯探測器
XDS560v2 是 XDS560™ 系列偵錯探測器中性能最高的,且同時支援傳統 JTAG 標準 (IEEE1149.1) 與 cJTAG (IEEE1149.7)。 請注意,其不支援序列線偵錯 (SWD)。
所有 XDS 偵錯探測器均在所有配備嵌入式追蹤緩衝器 (ETB) 的 ARM 與 DSP 處理器中支援核心與系統追蹤。 對於針腳上的追蹤,則需要 XDS560v2 PRO TRACE。
XDS560v2 透過 MIPI HSPT 60 針腳接頭 (具有用於 TI 14 針腳、TI 20 針腳和 ARM 20 針腳的多轉接器) 連接到目標電路板,並透過 USB2.0 高速 (...)
TMDSEMU560V2STM-UE — XDS560v2 System Trace USB 與乙太網路偵錯探測器
The XDS560v2 is the highest performance of the XDS560™ family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).
All XDS debug probes support Core and System Trace in all ARM and DSP processors (...)
LB-3P-TRACE32-DSP — 適用於數位訊號處理器 (DSP) 的 Lauterbach TRACE32 偵錯和追蹤系統
Lauterbach‘s TRACE32® tools are a suite of leading-edge hardware and software components that enables developers to analyze, optimize and certify all kinds of single- or multi-core Digital Signal processors (DSPs) which are a popular choice for audio and video processing as well as radar data (...)
BIOSMCSDK-C66X — SYS/BIOS MCSDK for C66x
NOTE: K2x, C665x and C667x devices are now actively maintained on the Processor-SDK release stream. See links above.
Our Multicore Software Development Kits (MCSDK) provide highly-optimized bundles of foundational, platform-specific drivers to enable development on selected TI ARM and DSP devices. (...)
PROCESSOR-SDK-C665X — 適用於 C665x 處理器的處理器 SDK - 支援 TI-RTOS
處理器 SDK (軟體開發套件) 是一套專為 TI 嵌入式處理器所設計的整合軟體平台,提供簡易設定,可迅速且立即執行基準測試與示範。 所有 TI 代表產品的處理器 SDK 版本均相同,開發人員能順暢地在其他裝置上再次使用軟體,與移轉軟體至其他裝置。 有了處理器 SDK 和 TI 嵌入式處理器解決方案,讓開發可調式平台解決方案從此變得更輕鬆簡單。
C66x 的處理器 SDK v.02.xx 版本包含對 TI-RTOS 作業系統的支援。
RTOS 主要特點:
- TI-RTOS 核心、這是一套適用於 TI 裝置的輕量即時嵌入式作業系統
- 晶片支援函式庫、驅動程式和基礎電路板支援公用程式
- (...)
CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)
CCStudio™ IDE is part of TI's extensive CCStudio™ development ecosystem and is an integrated development environment for TI's microcontrollers, processors, wireless connectivity devices, and radar sensors. CCStudio IDE is available as desktop or cloud-based applications. The cloud version (...)
MATHLIB — 用於浮點裝置的 DSP 數學函式庫
SPRC264 — TMS320C5000/6000 映像庫 (IMGLIB)
C5000 6000 影像處理庫 (IMGLIB) 是適合 C 程式設計工具的最佳化影像/影片處理函式庫。此函式庫包括 C 可呼叫通用影像/影片處理常式,這些常式通常用於運算密集型即時應用。相較於同等標準 ANSI C 語言程式碼,使用這些常式可以實現更高性能。IMGLIB 透過立即可用的 DSP 功能與原始程式碼,能夠大幅縮短應用程式開發時間。
查看基準測試:DSP 核心基準測試
SPRC265 — TMS320C6000 DSP 函式庫 (DSPLIB)
TMS320C6000 數位訊號處理器函式庫 (DSPLIB) 是適合 C 編程人員的平台最佳化 DSP 函式庫。此函式庫包括可呼叫 C 語言的通用訊號處理常式,通常用於運算密集的即時應用。相較於同等標準 ANSI C 語言程式碼,使用這些常式可以實現更高性能。DSPLIB 透過立即可用的 DSP 功能與原始程式碼,能夠大幅縮短應用程式開發時間。
查看基準測試:DSP 核心基準測試
TELECOMLIB — 電信和媒體庫 - 用於 TMS320C64x+ 和 TMS320C55x 處理器的 FAXLIB、VoLIB 和 AEC/AER
Voice Library - VoLIB provides components that, together, facilitate the development of the signal processing chain for Voice over IP applications such as infrastructure, enterprise, residential gateways and IP phones. Together with optimized implementations of ITU-T voice codecs, that can be (...)
C66XCODECS — 轉碼器 - 視訊、語音 - 適用於 C66x 架構產品
TI codecs are free, come with production licensing and are available for download now. All are production-tested for easy integration into video and voice applications. In many cases, the C64x+ codecs are provided and validated for C66x platforms. Datasheets and Release Notes are on the download (...)
TIDEP-0099 — 適用於基於語音的應用的音訊預處理系統參考設計
TIDEP0036 — 使用 TMS320C6657 實作高效率 OPUS 轉碼器解決方案的參考設計
TIDEP0036 參考設計提供可在 TMS320C6657 裝置上輕鬆執行的 TI 最佳化 Opus 編碼器/解碼器範例。由於 Opus 支援多種位元率、訊框大小及取樣率(這些全都具有低延遲),因此適用於語音通訊、網路音訊,甚至高性能音訊處理應用。 此設計還特別強調在 DSP 上實作 Opus 編解碼器,相較於通用處理器(例如 ARM)所達成的效能提升。 根據在通用處理器上執行的代碼最佳化程度,在 C66x TI DSP 核心上實作 Opus 編解碼器的性能是實作 ARM CORTEX A-15 的 3 倍。TMS320C66x DSP 同時支援音訊和視訊編解碼器。
TIDEP0045 — 透過 TI C6678 DSP 實作即時合成孔徑雷達 (SAR) 演算法的參考設計
此參考設計展示了在多核心 TMS320C6678 數位訊號處理器 (DSP) 上執行的即時合成孔徑雷達 (SAR)。SAR 的主要挑戰之一是即時產生高解析度影像,因為影像成形涉及運算要求高的訊號處理程序。 我們已在 C6678 八核心定點和浮點 DSP 上實作 SAR 演算法,展現其完整應用性能以及如何在一個、兩個、四個和八個 DSP 核心上進行擴展。此處,距離都卜勒 SAR 處理演算法會從功能角度進行模組化,並將運算工作映射至並聯執行的多個核心。任務映射過程使用 OpenMP 完成。
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| FCBGA (CZH) | 625 | Ultra Librarian |
| FCBGA (GZH) | 625 | Ultra Librarian |
訂購與品質
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。