TMP110
- Ultra-small, leadless X2SON-5 package
- Package size: 0.8 × 0.8 × 0.4mm
- Wide operating ranges
- V+ operating range: 1.14V to 5.5V
- Temperature range: -40°C to 125°C
- Accuracy holds across temperature
- ±1.0°C (maximum) from -40°C to 125°C
- 12-bit resolution: 0.0625°C (LSB)
- Flexible digital interface
- I2C and SMBus compatible
- I3C Mixed Bus co-existence capable
- Pinout and software compatible upgrades
- ±0.5°C → TMP112 (X2SON package)
- Low supply current
- 55µA Active current (typical)
- 0.15µA Shutdown current (typical)
- 3.2µA Average current (typical) at 1Hz
- Software compatible with Industry-Standard
- Two (2) pinout options available
- ALERT Pin: TMP110D0, TMP110D1, TMP110D2, TMP110D3
- Address Pin: TMP110D
The TMP110 is a I2C-compatible digital temperature sensor in an ultra-small (0.64mm2) 5-pin package. The small size and height package optimizes volume constrained systems where DSBGA packages can be considered unsuitable. Unlike DSBGA packages of comparable size, TMP110 provides a 5th pin that can either be used as an address pin or alert pin, providing flexibility for both scalability of number of sensors or monitoring critical thermal events.
The TMP110 offers an accuracy of ±1.0°C across the temperature range with an on-chip 12-bit analog-to-digital converter (ADC) that provides a temperature resolution of 0.0625°C.
The TMP110 is designed to operate from a supply range as low as 1.14V, with a low average and shutdown current of 3.2µA (at 1Hz) and 0.15µA, respectively, allowing for an on-demand temperature conversion and maximizing of battery life. The supply can also be raised to as high as 5.5V for a range of industrial applications.
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技術文件
| 重要文件 | 類型 | 標題 | 格式選項 | 下載最新的英文版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 資料表 | TMP110 Ultra-Small, ±1.0°C Accurate, I2 C Digital Temperature Sensor for Cost-Sensitive Systems datasheet (Rev. A) | PDF | HTML | 2024/7/30 | ||
| Product overview | Ultra-Small Temperature Sensor Comparison Guide (Rev. A) | PDF | HTML | 2025/1/21 | |||
| 應用說明 | LM75B and TMP1075 Industry-Standard Devices: Design Guidelines and Spec Comparison (Rev. A) | PDF | HTML | 2024/3/7 | |||
| 證書 | TMP110EVM EU Declaration of Conformity (DoC) | PDF | HTML | 2023/10/24 | |||
| 應用說明 | Designing and Manufacturing with TI's X2SON Packages | 2017/8/23 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| X2SON (DPW) | 5 | Ultra Librarian |