TMP103
- Multiple Device Access (MDA):
- Global Read/Write Operations
- I2C™ and SMBus™-Compatible Interface
- Resolution: 8 Bits
- Accuracy: ±1°C Typical (–10°C to 100°C)
- Low Quiescent Current:
- 3-µA Active IQ at 0.25 Hz
- 1-µA Shutdown
- Supply Range: 1.4 V to 3.6 V
- Digital Output
- 4-Ball WCSP (DSBGA) Package
The TMP103 is a digital output temperature sensor in a four-ball wafer chip-scale package (WCSP). The TMP103 is capable of reading temperatures to a resolution of 1°C.
The TMP103 features a two-wire interface that is compatible with both I2C and SMBus interfaces. In addition, the interface supports multiple device access (MDA) commands that allow the master to communicate with multiple devices on the bus simultaneously, eliminating the need to send individual commands to each TMP103 on the bus.
Up to eight TMP103s can be tied together in parallel and easily read by the host. The TMP103 is especially suitable for space-constrained, power-sensitive applications with multiple temperature measurement zones that must be monitored.
The TMP103 is specified for operation over a temperature range of –40°C to 125°C.
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技術文件
| 重要文件 | 類型 | 標題 | 格式選項 | 日期 |
|---|---|---|---|---|
| * | Data sheet | TMP103 Low-Power, Digital Temperature Sensor With Two-Wire Interface in WCSP datasheet (Rev. D) | PDF | HTML | 2018年 12月 21日 |
| Application note | How to Read and Interpret Digital Temperature Sensor Output Data (Rev. A) | PDF | HTML | 2025年 1月 21日 | |
| Product overview | Ultra-Small Temperature Sensor Comparison Guide (Rev. A) | PDF | HTML | 2025年 1月 21日 | |
| Application brief | Improving System Reliability in Auto and Ind. Cameras w/ AccurateTemp. Sensing | PDF | HTML | 2022年 1月 3日 | |
| Technical article | Interface to sensors in seconds with ASC Studio | PDF | HTML | 2020年 11月 12日 | |
| Application note | Temperature sensors: PCB guidelines for surface mount devices (Rev. A) | 2019年 1月 18日 | ||
| Technical article | Real-time temperature sensing with dual-mode connectivity | PDF | HTML | 2016年 11月 3日 | |
| User guide | SM-USB-DIG Platform User Guide | 2011年 1月 14日 |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中的可靠性監測
- 晶圓廠位置
- 組裝地點