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CC2564C

現行

符合 Bluetooth 核心 5.1 標準的 Bluetooth® 雙模式收發器

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CC2564C

現行
產品規格表 立即訂購

產品詳細資料

Type Transceiver Technology 2.4 GHz, Bluetooth® Classic, Bluetooth® Dual-Mode, Bluetooth® LE Protocols Qualified against Bluetooth® Core 5.1 Operating system FreeRTOS, Linux Features Advanced audio distribution profile, Classic audio, Hands-free profile Security Secure communication Rating Catalog Operating temperature range (°C) -40 to 85
Type Transceiver Technology 2.4 GHz, Bluetooth® Classic, Bluetooth® Dual-Mode, Bluetooth® LE Protocols Qualified against Bluetooth® Core 5.1 Operating system FreeRTOS, Linux Features Advanced audio distribution profile, Classic audio, Hands-free profile Security Secure communication Rating Catalog Operating temperature range (°C) -40 to 85
VQFNP-MR (RVM) 76 64 mm² 8 x 8
  • TI’s Single-Chip Bluetooth® Solution With Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) Support
  • Bluetooth 5.1 Delaration ID D049226
  • Highly Optimized for Size-Constrained and Low-Cost Designs:
    • Single-Ended 50-Ω RF Interface
    • VQFNP-MR Package Family, RVM Footprint: 76 Terminals, 0.6-mm Pitch, 8-mm × 8-mm
  • BR and EDR Features Include:
    • Up to Seven Active Devices
    • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
    • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
    • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, Modified Subband Coding (mSBC), and Transparent (Uncoded)
    • Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    • Support of Multiple Bluetooth Profiles With Enhanced QoS
  • Low Energy Features Include:
    • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
    • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
    • Capabilities of Link Layer Topology Scatternet—Can Act Concurrently as Peripheral and Central
    • Network Support for up to 10 Devices
    • Time Line Optimization Algorithms to Achieve Maximum Channel Utliization
  • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    • Class 1 TX Power up to +12 dBm
    • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
    • Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
  • Advanced Power Management for Extended Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct Connection to Battery
    • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
    • Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
  • Flexibility for Easy Stack Integration and Validation Into MCUs and MPUs
  • HCI Tester Tool to Evaluate RF Performance of the Device and Configure Service Pack
  • TI’s Single-Chip Bluetooth® Solution With Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) Support
  • Bluetooth 5.1 Delaration ID D049226
  • Highly Optimized for Size-Constrained and Low-Cost Designs:
    • Single-Ended 50-Ω RF Interface
    • VQFNP-MR Package Family, RVM Footprint: 76 Terminals, 0.6-mm Pitch, 8-mm × 8-mm
  • BR and EDR Features Include:
    • Up to Seven Active Devices
    • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
    • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
    • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, Modified Subband Coding (mSBC), and Transparent (Uncoded)
    • Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    • Support of Multiple Bluetooth Profiles With Enhanced QoS
  • Low Energy Features Include:
    • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
    • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
    • Capabilities of Link Layer Topology Scatternet—Can Act Concurrently as Peripheral and Central
    • Network Support for up to 10 Devices
    • Time Line Optimization Algorithms to Achieve Maximum Channel Utliization
  • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    • Class 1 TX Power up to +12 dBm
    • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
    • Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
  • Advanced Power Management for Extended Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct Connection to Battery
    • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
    • Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
  • Flexibility for Easy Stack Integration and Validation Into MCUs and MPUs
  • HCI Tester Tool to Evaluate RF Performance of the Device and Configure Service Pack

The CC2564C device from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI level solution, providing high performance and robust Bluetooth solution. Based on TI’s seventh-generation Bluetooth core, the CC2564C device provides a product-proven solution that is Bluetooth 5.1-compliant, adding LE security and enhancing support for complex topologies (dual mode and link layer topologies). This HCI device offers best-in-class RF performance with about twice the throughput of other Bluetooth low-energy solutions, and includes a royalty-free software stack compatible with several host MCUs and MPUs, for a complete Bluetooth solution. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR, EDR, and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for MCUs and MPUs. The iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Multiple profiles and sample applications, including the following, are supported:

Serial port profile (SPP)

Advanced audio distribution profile (A2DP)

Audio/video remote control profile (AVRCP)

Hands-free profile (HFP)

Human interface device (HID)

Generic attribute profile (GATT)

Several Bluetooth low energy profiles and services

 

The CC2564C device from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI level solution, providing high performance and robust Bluetooth solution. Based on TI’s seventh-generation Bluetooth core, the CC2564C device provides a product-proven solution that is Bluetooth 5.1-compliant, adding LE security and enhancing support for complex topologies (dual mode and link layer topologies). This HCI device offers best-in-class RF performance with about twice the throughput of other Bluetooth low-energy solutions, and includes a royalty-free software stack compatible with several host MCUs and MPUs, for a complete Bluetooth solution. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR, EDR, and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for MCUs and MPUs. The iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Multiple profiles and sample applications, including the following, are supported:

Serial port profile (SPP)

Advanced audio distribution profile (A2DP)

Audio/video remote control profile (AVRCP)

Hands-free profile (HFP)

Human interface device (HID)

Generic attribute profile (GATT)

Several Bluetooth low energy profiles and services

 
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技術文件

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類型 標題 日期
* Data sheet CC2564C Dual-Mode Bluetooth® Controller datasheet (Rev. B) 2020年 12月 2日
Cybersecurity advisory CC2564C: BT (BR/EDR) SIG Errata 11838 - LMP Encryption Key Minimum Size Change PDF | HTML 2023年 12月 20日
Application note QFN and SON PCB Attachment (Rev. C) PDF | HTML 2023年 12月 6日
Cybersecurity advisory CC2564C: CC256x and WL18xx Bluetooth Low Energy - LE scan vulnerability PDF | HTML 2023年 11月 12日
User guide CC256x TI Bluetooth Stack SPPLEDemo App PDF | HTML 2023年 8月 8日
User guide CC256x TI’s Bluetooth Stack Basic HFGAGDemo APP PDF | HTML 2023年 8月 8日
User guide TI Bluetooth Stack HIDDemo App PDF | HTML 2023年 8月 4日
Selection guide CC256x Getting Started Selection Guide (Rev. C) PDF | HTML 2022年 5月 13日
Selection guide 無線連線技術選擇指南 (Rev. B) 2022年 3月 7日
User guide CC2564C TI Dual-mode Bluetooth Stack on MSP432 MCUs (Rev. B) PDF | HTML 2021年 12月 20日
More literature Dual-Mode Bluetooth® CC256xCQFNEM Evaluation Board (Rev. C) PDF | HTML 2021年 12月 20日
User guide CC2564C TI Dual-mode Bluetooth Stack on STM32F4 MCUs (Rev. B) PDF | HTML 2021年 12月 2日
User guide CC2564B to CC2564C Migration Guide (Rev. B) PDF | HTML 2021年 12月 1日
Application brief TI Bluetooth CC2564C Solution (Rev. B) PDF | HTML 2021年 12月 1日
User guide Bluetopia Stack Build Guide for Linux PDF | HTML 2021年 1月 15日
User guide CC2564x Demo Applications User's Guide PDF | HTML 2020年 12月 17日
Cybersecurity advisory Bluetooth Low Energy – Invalid Connection Request (SweynTooth) (Rev. A) PDF | HTML 2020年 7月 17日
Cybersecurity advisory Bluetooth Basic Rate/Enhanced Data Rate – Bluetooth Impersonation AttackS (BIAS) PDF | HTML 2020年 5月 18日
Cybersecurity advisory Bluetooth Low Energy, Basic Rate/Enhanced Data Rate – Method Confusion Pairing V PDF | HTML 2020年 5月 18日
Application note Capturing Bluetooth Host Controller Interface (HCI) Logs 2019年 1月 7日
White paper Which TI Bluetooth® solution should I choose? 2017年 5月 5日
White paper White Paper: Why Classic Bluetooth® (BR/EDR)? 2017年 5月 4日
Technical article Introducing TI’s dual-mode Bluetooth® 4.2 CC2564C solution PDF | HTML 2016年 12月 13日
Application note Application Notes for CC2564C Bluetooth® 4.1 and 4.2 2016年 11月 1日

設計與開發

如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

CC256XCQFN-EM — CC2564C 雙模式 Bluetooth® 控制器評估模組

TI CC256xC Bluetooth® 裝置為一套支援基本速率 (BR)、強化資料傳輸速率 (EDR) 及 LE 主機控制器介面 (HCI) 的解決方案，可減少設計工作並加快上市時間。此模組採用 TI 第七代核心架構，是經過產品實證，支援 Bluetooth 5.1 雙模式通訊協定的解決方案。CC256xQFN-EM 電路板用於評估雙模式藍牙 CC2564C 控制器，該控制器支援傳統藍牙和 Bluetooth® 低耗能 (LE) 無線技術。

使用指南: PDF | HTML
TI.com 無法提供
開發板

PIDEU-3P-PAN13X6C — Panasonic Industry PAN13x6C 藍牙射頻 (RF) 模組

Panasonic 的 PAN1326C2 / PAN1316C 系列為主機控制介面 (HCI) Bluetooth® 射頻 (RF) 模組，讓 Texas Instruments™ 第七代藍牙核心積體電路 CC2564C 成為易於使用的模組形式。PAN1326C2/PAN1316C 與 Bluetooth® 5.1 相容，且可提供同級最佳的 RF 性能，涵蓋範圍約為其他藍牙低功耗解決方案的兩倍。此系列提供兩種版本：一種具備整合式晶片天線 (ENW89823A5KF)，可將 RF 設計作業降至最低；另一種具備 RF 底部焊盤 (...)

從：Panasonic Industrial Devices Europe GmbH
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子卡

BDE-3P-BD2564CX — BDE BD2564Cx 無線模組

BDE-3P-BD2564Cx 模組為 Bluetooth 5.1 基本速率 (BR)、增強資料速率 (EDR) 以及低功耗 (LE) 雙模式收發器模組，以 TI 的 CC2564C 為基礎。.這些模組具備高達 +10dBm 的傳輸功率，以及及高達 -93dBm 的接收靈敏度，提供同級最佳的 RF 性能。通過認證且免權利金的雙模式 Bluetooth 5.1 通訊協定軟體堆疊和設定檔，以及各種範例應用，有助於減少設計心力，並確保加快上市時間。此模組提供兩種不同天線選項的變體：適用於外部天線的 ANT 針腳，以及和整合式 PCB 追蹤天線。

從：BDE Technology Inc.
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驅動程式或資料庫

CC2564CMSP432BTBLESW — MSP432 MCU 的 CC2564C TI 雙模式 Bluetooth® 堆疊

TI 在 MSP432 MCU 上的 CC2564C 雙模式 Bluetooth® 堆疊軟體，適用於 Bluetooth + Bluetooth 低功耗，支援 MSP432 MCU，並包含實作 Bluetooth 5.1 規格的單模式與雙模式產品。Bluetooth 堆疊已完全通過認證（QDID172096 和 QDID172097），提供簡易的命令行範例應用程式以加速開發，並且根據需求提供 MFI 功能。

如需完整的評估解決方案，CC2564C 雙模式 Bluetooth 堆疊可直接與 TI 硬體開發套件配合使用：EXP432P401R、BOOST-CCEMADAPTER 和 (...)
使用指南: PDF | HTML
使用指南: PDF | HTML
下載
驅動程式或資料庫

CC2564CSTBTBLESW — STM32F4 MCU 的 CC2564C TI 雙模式 Bluetooth® 堆疊

TI 在 STM32F4 MCU 上的 CC2564C 雙模式 Bluetooth® 堆疊軟體，適用於 Bluetooth + Bluetooth 低功耗，支援 STM32 ARM Cortex M4 MCU，並包含實作 Bluetooth 5.1 規格的單模式與雙模式產品。Bluetooth 堆疊已完全通過認證（QDID172096 和 QDID172097），提供簡易的命令行範例應用程式以加速開發，並且根據需求提供 MFI 功能。

如需完整的評估解決方案，CC2564C 雙模式 Bluetooth 堆疊可直接與 TI 硬體開發套件配合使用：STM3240G-EVAL。此外，適用於 (...)

使用指南: PDF | HTML
使用指南: PDF | HTML
下載
驅動程式或資料庫

CC256XC-BT-SP — 適用於 CC256xC 的 Bluetooth® Service Pack

CC256xC Bluetooth Service Pack (SP) 包含具有平台特定配置和錯誤修復的強制初始化指令碼（BTS 檔案）。

此外，Bluetooth Service Pack 也包含 CC2564C 裝置的搭配檔案，可用於測試與偵錯。Service Pack 由以下檔案組成：

  • 初始指令碼 BTS 檔案 (initscripts-TIInit_6.12.26.bts)
  • 初始指令碼附加元件
    • 音訊/語音處理附加元件 (initscripts-TIInit_6.12.26_avpr_add-on.bts)
    • BLE 附加元件 (...)
使用指南: PDF | HTML
下載
驅動程式或資料庫

TI-BT-STACK-LINUX-ADDON — 適用於 AM335x EVM、AM437x EVM 以及具有 WL18xx 和 CC256x 之 BeagleBone 的 TI Bluetooth Linux 外掛程式

本套件包含 TI Bluetooth 堆疊與 Platform Manager 的安裝套件、預編譯物件與原始碼，可輕鬆升級 AM437x EVM、AM335x EVM 或 BeagleBone 上的預設 LINUX EZSDK 二進位。該軟體使用 Linaro GCC 4.7 建置，可以新增到其他平台上使用類似工具鏈的 Linux SDK 中。

Bluetooth 堆疊已完全通過認證（QDID172096 和 QDID172097），提供簡易的命令行範例應用程式以加速開發，並且根據需求提供 MFI 功能。

有關授權資訊、發行說明和支援的設定檔，請下載套件。如需 TI Bluetooth 堆疊和 (...)

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IDE、配置、編譯器或偵錯程式

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize embedded applications. Code Composer Studio is available across Windows®, Linux® and macOS® platforms.

(...)

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檢查產品詳細資料頁面以確認支援。
啟動 下載選項
認證

CC2564MODN-DESIGN-FILES — CC2564MODN Design Information for Regulatory Compliance

Are you looking for CC256x module certification support? CC256x-CERTIFCATION provides the relevant information and support for successful certification of your product. Within this page you will find the latest certification reports of our Modules as well as our evaluation boards.
支援產品和硬體

支援產品和硬體

產品
Wi-Fi 產品
CC2564C — 符合 Bluetooth 核心 5.1 標準的 Bluetooth® 雙模式收發器
要求
認證

CC256X-CERTIFICATION — 雙模式藍牙的無線電認證

您是否正在尋找 CC256x 模組認證支援？CC256x 認證可為您的產品成功認證提供相關資訊和支援。在此頁面中，您會找到我們模組及評估電路板的最新認證報告。
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認證

CC256X-REPORTS — Reports: CC256x Regulatory Certification Reports

Are you looking for CC256x module certification support? CC256x-CERTIFCATION provides the relevant information and support for successful certification of your product. Within this page you will find the latest certification reports of our Modules as well as our evaluation boards.
支援產品和硬體

支援產品和硬體

產品
Wi-Fi 產品
CC2564 — 具強化資料率 (EDR)、低功耗 LE 和 ANT 的 Bluetooth® 4.0 CC2564C — 符合 Bluetooth 核心 5.1 標準的 Bluetooth® 雙模式收發器 CC2564MODA — 具有整合式天線的 Bluetooth® 雙模式收發器模組 CC2564MODN — Bluetooth® 雙模式收發器模組
硬體開發
開發板
BOOST-CC2564MODA — TMP107 溫度感測器菊鏈式 BoosterPack™ 插入式模組 CC2564MODAEM — 具有整合式天線的雙模式 Bluetooth® CC2564 模組評估板 CC2564MODNEM — 雙模式 Bluetooth® CC2564 模組評估板 CC256XCQFN-EM — CC2564C 雙模式 Bluetooth® 控制器評估模組
下載選項
設計工具

DUALMODE-BT-DESIGN-REVIEWS — 適用於 CC256x 裝置的硬體設計審查

若要開始進行雙模式 Bluetooth® 硬體設計審查程序，請執行以下步驟：
  • 步驟 1：申請審查之前，請務必檢閱技術文件與相關產品頁的設計與開發資源（請參閱下方的 CC256x 產品頁連結）。
  • 步驟 2：下載並填寫硬體設計審查申請表。
  • 步驟 3：請將填好的硬體設計審查申請表及所需文件以電子郵件傳送至：dualmode-bt-hw-review@list.ti.com

雙模式 Bluetooth 硬體設計審查流程提供一對一接觸的方式，並由主題內容專家協助審查您的設計，提供您寶貴的意見。在要求審查之前，請務必檢閱技術文件及相應產品頁上提供的設計與開發資源。產品頁資源可能不再需要進行設計審查。< /p>

(...)

使用指南: PDF
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Gerber 檔案

CC256XCQFN-EM Design Files

SWRC329.ZIP (1375 KB)
下載
封裝 針腳 CAD 符號、佔位空間與 3D 模型
VQFNP-MR (RVM) 76 Ultra Librarian
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  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
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  • 晶圓廠位置
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