UC1611-SP
- Matched, Four-Diode Monolithic Array
- High Peak Current
- Low-Cost MINIDIP Package
- Low-Forward Voltage
- Parallelable for Lower VF or Higher IF
- Fast Recovery Time
- Military Temperature Range Available
This four-diode array is designed for general purpose use as individual diodes or as a high-speed, high-current bridge. It is particularly useful on the outputs of high-speed power MOSFET drivers where Schottky diodes are needed to clamp any negative excursions caused by ringing on the driven line.These diodes are also ideally suited for use as voltage clamps when driving inductive loads such as relays and solenoids, and to provide a path for current free-wheeling in motor drive applications.The use of Schottky diode technology features high efficiency through lowered forward voltage drop and decreased reverse recovery time.This single monolithic chip is fabricated in both hermetic CERDIP and copper-eaded plastic packages. The UC1611 in ceramic is designed for -55°C to 125°C environments but with reduced peak current capability: while the UC3611 in plastic has higher current rating over a 0°C to 70°C ambient temperature range.
TI 仅提供有限的设计支持
TI 仅为使用此产品的现有工程提供有限的设计支持。如可用，您将在此页面找到相关的配套资料、工具和软件。TI 仅为使用此产品的现有设计提供有限的设计支持。在 TI E2E™ 支持论坛申请有限的设计支持。
技术文档
| 顶层文档 | 类型 | 标题 | 格式选项 | 下载最新的英语版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 数据表 | Quad Schottky Diode Array 数据表 (Rev. A) | 2001-5-15 | |||
| * | SMD | UC1611-SP SMD 5962-90538 | 2016-7-8 | |||
| 选择指南 | TI Space Products (Rev. L) | 2026-3-27 | ||||
| 应用手册 | 气密性封装回流焊曲线、端接镀层以及引线裁切与成型 (Rev. A) | PDF | HTML | 英语版 (Rev.A) | PDF | HTML | 2025-11-20 | |
| 应用简报 | 经 DLA 批准的 QML 产品优化 (Rev. C) | PDF | HTML | 英语版 (Rev.C) | PDF | HTML | 2025-8-18 | |
| 应用手册 | 重离子轨道环境单粒子效应估算 (Rev. B) | PDF | HTML | 英语版 (Rev.B) | PDF | HTML | 2025-7-7 | |
| 更多文献资料 | TI Engineering Evaluation Units vs. MIL-PRF-38535 QML Class V Processing (Rev. B) | 2025-2-20 | ||||
| 应用手册 | 单粒子效应置信区间计算 (Rev. A) | PDF | HTML | 英语版 (Rev.A) | PDF | HTML | 2022-12-2 | |
| 应用手册 | ESD 包装和布局指南 (Rev. B) | PDF | HTML | 英语版 (Rev.B) | PDF | HTML | 2022-9-14 | |
| 电子书 | 电子产品辐射手册 | 2022-5-7 | ||||
| 用户指南 | Generic ESD Evaluation Module User's Guide (Rev. A) | PDF | HTML | 2021-9-27 | |||
| 应用手册 | DLA Standard Microcircuit Drawings (SMD) and JAN Part Numbers Primer | 2020-8-21 |
设计与开发
如需其他信息或资源，请点击以下任一标题进入详情页面查看（如有）。
ESDEVM — 适用于 ESD 二极管封装（包括 0402、0201 等）的通用评估模块
| 封装 | 引脚 | CAD 符号、封装和 3D 模型 |
|---|---|---|
| LCCC (FK) | 20 | Ultra Librarian |
| CDIP (JG) | 8 | Ultra Librarian |
订购和质量
推荐产品可能包含与 TI 此产品相关的参数、评估模块或参考设计。