TLV2460
- Rail-to-Rail Output Swing
- Gain Bandwidth Product...6.4 MHz
- ±80 mA Output Drive Capability
- Supply Current...500 µA/channel
- Input Offset Voltage...100 µV
- Input Noise Voltage...11 nV/
Hz - Slew Rate...1.6 V/µs
- Micropower Shutdown Mode (TLV2460/3/5)...0.3 µA/Channel
- Universal Operational Amplifier EVM
- Available in Q-Temp Automotive
HighRel Automotive Applications
Configuration Control/Print Support
Qualification to Automotive Standards
The TLV246x is a family of low-power rail-to-rail input/output operational amplifiers specifically designed for portable applications. The input common-mode voltage range extends beyond the supply rails for maximum dynamic range in low-voltage systems. The amplifier output has rail-to-rail performance with high-output-drive capability, solving one of the limitations of older rail-to-rail input/output operational amplifiers. This rail-to-rail dynamic range and high output drive make the TLV246x ideal for buffering analog-to-digital converters.
The operational amplifier has 6.4 MHz of bandwidth and 1.6 V/µs of slew rate with only 500 µA of supply current, providing good ac performance with low power consumption. Three members of the family offer a shutdown terminal, which places the amplifier in an ultralow supply current mode (IDD = 0.3 µA/ch). While in shutdown, the operational-amplifier output is placed in a high-impedance state. DC applications are also well served with an input noise voltage of 11 nV/Hz and input offset voltage of 100 µV.
This family is available in the low-profile SOT23, MSOP, and TSSOP packages. The TLV2460 is the first rail-to-rail input/output operational amplifier with shutdown available in the 6-pin SOT23, making it perfect for high-density circuits. The family is specified over an expanded temperature range (TA = –40°C to 125°C) for use in industrial control and automotive systems, and over the military temperature range (TA = –55°C to 125°C) for use in military systems.
技术文档
| 顶层文档 | 类型 | 标题 | 格式选项 | 下载最新的英语版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 数据表 | Rail-to-Rail Input/Output Operational Amplifiers w/ Shutdown 数据表 (Rev. J) | 2004-2-29 | |||
| 电子书 | The Signal e-book: 有关运算放大器设计主题的博客文章汇编 | PDF | HTML | 英语版 | PDF | HTML | 2018-1-31 | |
| 应用手册 | Amplifiers and Bits; An Introduction to Selecting Amplifiers for Data Converters (Rev. D) | 2015-5-18 | ||||
| 应用手册 | TLV2461/62/63/64/65 EMI Immunity Performance (Rev. A) | 2012-11-14 | ||||
| 应用手册 | Use of Rail-to-Rail Operational Amplifiers (Rev. A) | 1999-12-22 |
设计与开发
如需其他信息或资源，请点击以下任一标题进入详情页面查看（如有）。
AMP-PDK-EVM — 放大器高性能开发套件评估模块
放大器高性能开发套件 (PDK) 是一款用于测试常见运算放大器参数的评估模块 (EVM) 套件，与大多数运算放大器和比较器均兼容。该 EVM 套件提供了一个主板，主板上具有多个插槽式子卡选项以满足封装需求，使工程师能够快速评估和验证器件性能。
AMP-PDK-EVM 套件支持五种常用的业界通用封装，包括：
- D（SOIC-8 和 SOIC-14）
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV（SOT23-5 和 SOT23-6）
- DCK（SC70-5 和 SC70-6）
DIP-ADAPTER-EVM — DIP 适配器评估模块
借助 DIP-Adapter-EVM 加快运算放大器的原型设计和测试，该 EVM 有助于快速轻松地连接小型表面贴装 IC 并且价格低廉。您可以使用随附的 Samtec 端子板连接任何受支持的运算放大器，或者将这些端子板直接连接至现有电路。
DIP-Adapter-EVM 套件支持六种常用的业界通用封装，包括：
- D 和 U (SOIC-8)
- PW (TSSOP-8)
- DGK（MSOP-8、VSSOP-8）
- DBV（SOT23-6、SOT23-5 和 SOT23-3）
- DCK（SC70-6 和 SC70-5）
- DRL (SOT563-6)
| 封装 | 引脚 | CAD 符号、封装和 3D 模型 |
|---|---|---|
| SOIC (D) | 8 | Ultra Librarian |
| PDIP (P) | 8 | Ultra Librarian |
| SOT-23 (DBV) | 6 | Ultra Librarian |