TLV2332

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双路、8V、525kHz 运算放大器

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open-in-new 比较替代产品
功能优于比较器件,可直接替换。
OPA2990 正在供货 双路、40V、1.1MHz、低功耗运算放大器 Rail-to-rail I/O, higher GBW (1.1 MHz), faster slew rate (4.5 V/μs), lower offset voltage (1.5 mV), lower noise (30 nV/√Hz), higher output current (80 mA)
TLV9102 正在供货 双路、16V、1.1MHz、低功耗运算放大器 Rail-to-rail I/O, wider supply range (2.7 V to 16 V), higher GBW (1.1 MHz), faster slew rate (4.5 V/us), lower offset voltage (1.5 mV), lower noise (30 nV/√Hz)

产品详情

Number of channels 2 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 8 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 2 Rail-to-rail In to V-, Out GBW (typ) (MHz) 0.525 Slew rate (typ) (V/µs) 0.43 Vos (offset voltage at 25°C) (max) (mV) 9 Iq per channel (typ) (mA) 0.105 Vn at 1 kHz (typ) (nV√Hz) 32 Rating Catalog Operating temperature range (°C) -40 to 85 Offset drift (typ) (µV/°C) 1.7 Input bias current (max) (pA) 200 CMRR (typ) (dB) 91 Iout (typ) (A) 0.009 Architecture CMOS Input common mode headroom (to negative supply) (typ) (V) -0.3 Input common mode headroom (to positive supply) (typ) (V) -0.8 Output swing headroom (to negative supply) (typ) (V) 0.095 Output swing headroom (to positive supply) (typ) (V) -1.2
Number of channels 2 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 8 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 2 Rail-to-rail In to V-, Out GBW (typ) (MHz) 0.525 Slew rate (typ) (V/µs) 0.43 Vos (offset voltage at 25°C) (max) (mV) 9 Iq per channel (typ) (mA) 0.105 Vn at 1 kHz (typ) (nV√Hz) 32 Rating Catalog Operating temperature range (°C) -40 to 85 Offset drift (typ) (µV/°C) 1.7 Input bias current (max) (pA) 200 CMRR (typ) (dB) 91 Iout (typ) (A) 0.009 Architecture CMOS Input common mode headroom (to negative supply) (typ) (V) -0.3 Input common mode headroom (to positive supply) (typ) (V) -0.8 Output swing headroom (to negative supply) (typ) (V) 0.095 Output swing headroom (to positive supply) (typ) (V) -1.2
SOIC (D) 8 29.4 mm² (4.9 mm × 6 mm) TSSOP (PW) 8 19.2 mm² (3 mm × 6.4 mm) PDIP (P) 8 92.5083 mm² (9.81 mm × 9.43 mm)
  • Wide Range of Supply Voltages Over Specified Temperature Range:
  • TA = -40°C to 85°C...2 V to 8 V
  • Fully Characterized at 3 V and 5 V
  • Single-Supply Operation
  • Common-Mode Input-Voltage Range
    Extends Below the Negative Rail and up to
    VDD -1 V at TA = 25°C
  • Output Voltage Range Includes Negative Rail
  • High Input Impedance...1012 Typ
  • ESD-Protection Circuitry
  • Designed-In Latch-Up Immunity
  • LinCMOS is a trademark of Texas Instruments Incorporated.

  • Wide Range of Supply Voltages Over Specified Temperature Range:
  • TA = -40°C to 85°C...2 V to 8 V
  • Fully Characterized at 3 V and 5 V
  • Single-Supply Operation
  • Common-Mode Input-Voltage Range
    Extends Below the Negative Rail and up to
    VDD -1 V at TA = 25°C
  • Output Voltage Range Includes Negative Rail
  • High Input Impedance...1012 Typ
  • ESD-Protection Circuitry
  • Designed-In Latch-Up Immunity
  • LinCMOS is a trademark of Texas Instruments Incorporated.

The TLV233x operational amplifiers are in a family of devices that has been specifically designed for use in low-voltage single-supply applications. Unlike the TLV2322 which is optimized for ultra-low power, the TLV233x is designed to provide a combination of low power and good ac performance. Each amplifier is fully functional down to a minimum supply voltage of 2 V, is fully characterized, tested, and specified at both 3-V and 5-V power supplies. The common-mode input-voltage range includes the negative rail and extends to within 1 V of the positive rail.

Having a maximum supply current of only 310 uA per amplifier over full temperature range, the TLV233x devices offer a combination of good ac performance and microampere supply currents. From a 3-V power supply, the amplifier's typical slew rate is 0.38 V/us and its bandwidth is 300 kHz.

These amplifiers offer a level of ac performance greater than that of many other devices operating at comparable power levels. The TLV233x operational amplifiers are especially well suited for use in low-current or battery-powered applications.

Low-voltage and low-power operation has been made possible by using the Texas Instruments silicon-gate LinCMOSTM technology. The LinCMOS process also features extremely high input impedance and ultra-low bias currents making these amplifiers ideal for interfacing to high-impedance sources such as sensor circuits or filter applications.

To facilitate the design of small portable equipment, the TLV233x is made available in a wide range of package options, including the small-outline and thin-shrink small-outline package (TSSOP). The TSSOP package has significantly reduced dimensions compared to a standard surface-mount package. Its maximum height of only 1.1 mm makes it particularly attractive when space is critical.

The device inputs and outputs are designed to withstand -100-mA currents without sustaining latch-up. The TLV233x incorporates internal ESD-protection circuits that prevents functional failures at voltages up to 2000 V as tested under MIL-STD 883C, Method 3015.2; however, care should be exercised in handling these devices as exposure to ESD may result in the degradation of the device parametric performance.

The TLV233x operational amplifiers are in a family of devices that has been specifically designed for use in low-voltage single-supply applications. Unlike the TLV2322 which is optimized for ultra-low power, the TLV233x is designed to provide a combination of low power and good ac performance. Each amplifier is fully functional down to a minimum supply voltage of 2 V, is fully characterized, tested, and specified at both 3-V and 5-V power supplies. The common-mode input-voltage range includes the negative rail and extends to within 1 V of the positive rail.

Having a maximum supply current of only 310 uA per amplifier over full temperature range, the TLV233x devices offer a combination of good ac performance and microampere supply currents. From a 3-V power supply, the amplifier's typical slew rate is 0.38 V/us and its bandwidth is 300 kHz.

These amplifiers offer a level of ac performance greater than that of many other devices operating at comparable power levels. The TLV233x operational amplifiers are especially well suited for use in low-current or battery-powered applications.

Low-voltage and low-power operation has been made possible by using the Texas Instruments silicon-gate LinCMOSTM technology. The LinCMOS process also features extremely high input impedance and ultra-low bias currents making these amplifiers ideal for interfacing to high-impedance sources such as sensor circuits or filter applications.

To facilitate the design of small portable equipment, the TLV233x is made available in a wide range of package options, including the small-outline and thin-shrink small-outline package (TSSOP). The TSSOP package has significantly reduced dimensions compared to a standard surface-mount package. Its maximum height of only 1.1 mm makes it particularly attractive when space is critical.

The device inputs and outputs are designed to withstand -100-mA currents without sustaining latch-up. The TLV233x incorporates internal ESD-protection circuits that prevents functional failures at voltages up to 2000 V as tested under MIL-STD 883C, Method 3015.2; however, care should be exercised in handling these devices as exposure to ESD may result in the degradation of the device parametric performance.

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顶层文档 类型 标题 格式选项 下载最新的英语版本 日期
* 数据表 LinCMOS Low-Voltage Medium-Power Operational Amplifiers 数据表 1997-2-1
电子书 An Engineer’s Guide to Designing with Precision Amplifiers 2021-4-29
电子书 The Signal e-book: 有关运算放大器设计主题的博客文章汇编 PDF | HTML 英语版 PDF | HTML 2018-1-31

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评估板

AMP-PDK-EVM — 放大器高性能开发套件评估模块

放大器高性能开发套件 (PDK) 是一款用于测试常见运算放大器参数的评估模块 (EVM) 套件,与大多数运算放大器和比较器均兼容。该 EVM 套件提供了一个主板,主板上具有多个插槽式子卡选项以满足封装需求,使工程师能够快速评估和验证器件性能。

AMP-PDK-EVM 套件支持五种常用的业界通用封装,包括:

  • D(SOIC-8 和 SOIC-14)
  • PW (TSSOP-14)
  • DGK (VSSOP-8)
  • DBV(SOT23-5 和 SOT23-6)
  • DCK(SC70-5 和 SC70-6)
用户指南: PDF | HTML
支持的产品和硬件
评估板

DIP-ADAPTER-EVM — DIP 适配器评估模块

借助 DIP-Adapter-EVM 加快运算放大器的原型设计和测试,该 EVM 有助于快速轻松地连接小型表面贴装 IC 并且价格低廉。您可以使用随附的 Samtec 端子板连接任何受支持的运算放大器,或者将这些端子板直接连接至现有电路。

DIP-Adapter-EVM 套件支持六种常用的业界通用封装,包括:

  • D 和 U (SOIC-8)
  • PW (TSSOP-8)
  • DGK(MSOP-8、VSSOP-8)
  • DBV(SOT23-6、SOT23-5 和 SOT23-3)
  • DCK(SC70-6 和 SC70-5)
  • DRL (SOT563-6)
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评估板

DUAL-DIYAMP-EVM — Dual-channel universal do-it-yourself (DIY) amplifier circuit evaluation module for SOIC package

DIYAMP-EVM 是一个评估模块 (EVM) 系列,可为工程师和自制人员 (DIYer) 提供真实的放大器电路,使用户能够快速评估设计概念并验证仿真。该器件专为采用行业标准 SOIC-8 封装的双封装运算放大器而设计。它可实现各种电路配置,例如反相和同相放大器、Sallen Key 滤波器、多反馈滤波器、具有基准缓冲器的差动放大器、具有双反馈的 Riso、单端输入至差动输出、差动输入至差动输出、两个运算放大器仪表放大器和并联运算放大器。

DUAL-DIYAMP-EVM 让原型设计变得快速轻松,并使用常用的 0805 或 0603 表面贴装式元件。通过配置多种组合,此 EVM (...)

用户指南: PDF
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仿真模型

TLV2332 PSpice Model

SLOJ131.ZIP (1 KB) - PSpice 模型
支持的产品和硬件
封装 引脚 CAD 符号、封装和 3D 模型
SOIC (D) 8 Ultra Librarian
TSSOP (PW) 8 Ultra Librarian
PDIP (P) 8 Ultra Librarian

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支持和培训

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