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TLV2314-Q1

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汽车级、双路、5.5V、3MHz、RRIO 运算放大器

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TSV912A-Q1 正在供货 汽车级、双路、5.5V、8MHz、RRIO 运算放大器 Higher GBW (8 MHz), faster slew rate (6.5 V/us), lower offset voltage (1.5 mV), higher output current (50 mA)

TLV2314-Q1

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产品详情

Number of channels 2 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 5.5 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 1.8 Rail-to-rail In, Out GBW (typ) (MHz) 3 Slew rate (typ) (V/µs) 1.5 Vos (offset voltage at 25°C) (max) (mV) 3 Iq per channel (typ) (mA) 0.15 Vn at 1 kHz (typ) (nV√Hz) 16 Rating Automotive Operating temperature range (°C) -40 to 125 Offset drift (typ) (µV/°C) 2 Features Cost Optimized, EMI Hardened CMRR (typ) (dB) 96 Iout (typ) (A) 0.02 Architecture CMOS Input common mode headroom (to negative supply) (typ) (V) 0 Input common mode headroom (to positive supply) (typ) (V) 0 Output swing headroom (to negative supply) (typ) (V) 0 Output swing headroom (to positive supply) (typ) (V) -0.025
Number of channels 2 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 5.5 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 1.8 Rail-to-rail In, Out GBW (typ) (MHz) 3 Slew rate (typ) (V/µs) 1.5 Vos (offset voltage at 25°C) (max) (mV) 3 Iq per channel (typ) (mA) 0.15 Vn at 1 kHz (typ) (nV√Hz) 16 Rating Automotive Operating temperature range (°C) -40 to 125 Offset drift (typ) (µV/°C) 2 Features Cost Optimized, EMI Hardened CMRR (typ) (dB) 96 Iout (typ) (A) 0.02 Architecture CMOS Input common mode headroom (to negative supply) (typ) (V) 0 Input common mode headroom (to positive supply) (typ) (V) 0 Output swing headroom (to negative supply) (typ) (V) 0 Output swing headroom (to positive supply) (typ) (V) -0.025
SOIC (D) 8 29.4 mm² (4.9 mm × 6 mm)
  • Qualified for Automotive Applications
  • AEC-Q100 Qualified With the Following Results:
    • Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature Range
    • Device HBM ESD Classification Level 3A
    • Device CDM ESD Classification Level C6
  • Low Offset Voltage: 0.75 mV (Typical)
  • Low Input Bias Current: 1 pA (Typical)
  • Wide Supply Range: 1.8 V to 5.5 V
  • Rail-to-Rail Input and Output
  • Gain Bandwidth: 3 MHz
  • Low IQ: 250 µA/Ch (Maximum)
  • Low Noise: 16 nV/√Hz at 1 kHz
  • Internal RF and EMI Filter
  • Number of Channels:
    • TLV314-Q1: 1
    • TLV2314-Q1: 2
    • TLV4314-Q1: 4
  • Extended Temperature Range:
    –40°C to +125°C
  • Qualified for Automotive Applications
  • AEC-Q100 Qualified With the Following Results:
    • Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature Range
    • Device HBM ESD Classification Level 3A
    • Device CDM ESD Classification Level C6
  • Low Offset Voltage: 0.75 mV (Typical)
  • Low Input Bias Current: 1 pA (Typical)
  • Wide Supply Range: 1.8 V to 5.5 V
  • Rail-to-Rail Input and Output
  • Gain Bandwidth: 3 MHz
  • Low IQ: 250 µA/Ch (Maximum)
  • Low Noise: 16 nV/√Hz at 1 kHz
  • Internal RF and EMI Filter
  • Number of Channels:
    • TLV314-Q1: 1
    • TLV2314-Q1: 2
    • TLV4314-Q1: 4
  • Extended Temperature Range:
    –40°C to +125°C

The TLVx314-Q1 family of single-, dual-, and quad-channel operational amplifiers represents a new generation of low-power, general-purpose operational amplifiers. Rail-to-rail input and output swings (RRIO), low quiescent current (150 µA typically at 5 V) combine with a wide bandwidth of 3 MHz to make this family very attractive for a variety of battery-powered applications that require a good balance between cost and performance. The TLVx314-Q1 family achieves a low-input bias current of 1 pA, making it an excellent choice for high impedance sensors.

The robust design of the TLVx314-Q1 devices provides ease-of-use to the circuit designer: unity-gain stability, RRIO, capacitive loads of up to 300-pF, an integrated RF and EMI rejection filter, no phase reversal in overdrive conditions, and high electrostatic discharge (ESD) protection (4-kV HBM).

These devices are optimized for low-voltage operation as low as 1.8 V (±0.9 V) and up to 5.5 V (±2.75 V), and are specified over the extended industrial temperature range of –40°C to +125°C.

The TLV314-Q1 (single) is available in both 5-pin SC70 and SOT-23 packages. The TLV2314-Q1 (dual) is offered in 8-pin SOIC and VSSOP packages. The quad-channel TLV4314-Q1 is offered in a 14-pin TSSOP package.

The TLVx314-Q1 family of single-, dual-, and quad-channel operational amplifiers represents a new generation of low-power, general-purpose operational amplifiers. Rail-to-rail input and output swings (RRIO), low quiescent current (150 µA typically at 5 V) combine with a wide bandwidth of 3 MHz to make this family very attractive for a variety of battery-powered applications that require a good balance between cost and performance. The TLVx314-Q1 family achieves a low-input bias current of 1 pA, making it an excellent choice for high impedance sensors.

The robust design of the TLVx314-Q1 devices provides ease-of-use to the circuit designer: unity-gain stability, RRIO, capacitive loads of up to 300-pF, an integrated RF and EMI rejection filter, no phase reversal in overdrive conditions, and high electrostatic discharge (ESD) protection (4-kV HBM).

These devices are optimized for low-voltage operation as low as 1.8 V (±0.9 V) and up to 5.5 V (±2.75 V), and are specified over the extended industrial temperature range of –40°C to +125°C.

The TLV314-Q1 (single) is available in both 5-pin SC70 and SOT-23 packages. The TLV2314-Q1 (dual) is offered in 8-pin SOIC and VSSOP packages. The quad-channel TLV4314-Q1 is offered in a 14-pin TSSOP package.

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顶层文档 类型 标题 格式选项 下载最新的英语版本 日期
* 数据表 TLVx314-Q1 3-MHz, low-power, internal EMI filter, RRIO, operational amplifier 数据表 (Rev. A) PDF | HTML 2019-1-22
功能安全信息 TLV2314-Q1 Functional Safety FIT Rate, FMD, and Pin FMA PDF | HTML 2020-9-3
电子书 The Signal e-book: 有关运算放大器设计主题的博客文章汇编 PDF | HTML 英语版 PDF | HTML 2018-1-31

设计与开发

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评估板

AMP-PDK-EVM — 放大器高性能开发套件评估模块

放大器高性能开发套件 (PDK) 是一款用于测试常见运算放大器参数的评估模块 (EVM) 套件，与大多数运算放大器和比较器均兼容。该 EVM 套件提供了一个主板，主板上具有多个插槽式子卡选项以满足封装需求，使工程师能够快速评估和验证器件性能。

AMP-PDK-EVM 套件支持五种常用的业界通用封装，包括：

  • D（SOIC-8 和 SOIC-14）
  • PW (TSSOP-14)
  • DGK (VSSOP-8)
  • DBV（SOT23-5 和 SOT23-6）
  • DCK（SC70-5 和 SC70-6）
用户指南: PDF | HTML
支持的产品和硬件
评估板

DIP-ADAPTER-EVM — DIP 适配器评估模块

借助 DIP-Adapter-EVM 加快运算放大器的原型设计和测试，该 EVM 有助于快速轻松地连接小型表面贴装 IC 并且价格低廉。您可以使用随附的 Samtec 端子板连接任何受支持的运算放大器，或者将这些端子板直接连接至现有电路。

DIP-Adapter-EVM 套件支持六种常用的业界通用封装，包括：

  • D 和 U (SOIC-8)
  • PW (TSSOP-8)
  • DGK（MSOP-8、VSSOP-8）
  • DBV（SOT23-6、SOT23-5 和 SOT23-3）
  • DCK（SC70-6 和 SC70-5）
  • DRL (SOT563-6)
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评估板

DUAL-DIYAMP-EVM — 适用于 SOIC 封装的双通道通用自制 (DIY) 放大器电路评估模块

DIYAMP-EVM 是一个评估模块 (EVM) 系列，可为工程师和自制人员 (DIYer) 提供真实的放大器电路，使用户能够快速评估设计概念并验证仿真。该器件专为采用行业标准 SOIC-8 封装的双封装运算放大器而设计。它可实现各种电路配置，例如反相和同相放大器、Sallen Key 滤波器、多反馈滤波器、具有基准缓冲器的差动放大器、具有双反馈的 Riso、单端输入至差动输出、差动输入至差动输出、两个运算放大器仪表放大器和并联运算放大器。

DUAL-DIYAMP-EVM 让原型设计变得快速轻松，并使用常用的 0805 或 0603 表面贴装式元件。通过配置多种组合，此 EVM (...)

用户指南: PDF
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仿真模型

TLV314 PSpice Model (Rev. C)

SBOM974C.ZIP (23 KB) - PSpice 模型
支持的产品和硬件
仿真模型

TLV314 TINA-TI Reference Design (Rev. A)

SBOM973A.ZIP (21 KB) - TINA-TI 参考设计
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仿真模型

TLV314 TINA-TI Spice Model (Rev. A)

SBOM972A.ZIP (5 KB) - TINA-TI Spice 模型
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封装 引脚 CAD 符号、封装和 3D 模型
SOIC (D) 8 Ultra Librarian
适用于评估类项目的 TI 标准条款与条件。

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