产品详情

Technology family AHCT Number of channels 16 IOL (max) (mA) 8 Supply current (max) (µA) 40 IOH (max) (mA) -8 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 125
Technology family AHCT Number of channels 16 IOL (max) (mA) 8 Supply current (max) (µA) 40 IOH (max) (mA) -8 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 125
TVSOP (DGV) 48 62.08 mm² (9.7 mm × 6.4 mm) SSOP (DL) 48 164.358 mm² (15.88 mm × 10.35 mm) TSSOP (DGG) 48 101.25 mm² (12.5 mm × 8.1 mm)
  • Members of the Texas Instruments Widebus™ Family
  • EPIC™ (Enhanced-Performance Implanted CMOS)
    Process
  • Inputs are TTL-Voltage Compatible
  • Distributed VCC and GND Pins Minimize
    High-Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 250 mA
    Per JESD 17
  • ESD Protection Exceeds 2000 V Per
    MIL-STD-883, Method 3015
  • Package Options Include:
    • Plastic Shrink Small Outline (DL) Package
    • Thin Shrink Small Outline (DGG) Package
    • Thin Very Small Outline (DGV) Package
    • 380-mil Fine-Pitch Ceramic Flat (WD)
      Package Using 25-mil Center-to-Center
      Spacings
  • Members of the Texas Instruments Widebus™ Family
  • EPIC™ (Enhanced-Performance Implanted CMOS)
    Process
  • Inputs are TTL-Voltage Compatible
  • Distributed VCC and GND Pins Minimize
    High-Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 250 mA
    Per JESD 17
  • ESD Protection Exceeds 2000 V Per
    MIL-STD-883, Method 3015
  • Package Options Include:
    • Plastic Shrink Small Outline (DL) Package
    • Thin Shrink Small Outline (DGG) Package
    • Thin Very Small Outline (DGV) Package
    • 380-mil Fine-Pitch Ceramic Flat (WD)
      Package Using 25-mil Center-to-Center
      Spacings

The SN74AHCT16244 device is a 16-bit buffer and line driver specifically designed to improve the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

The SN74AHCT16244 device is a 16-bit buffer and line driver specifically designed to improve the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

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SN74ABTH16244 正在供货 具有总线保持、TTL 兼容型 CMOS 输入和三态输出的 16 通道、4.5V 至 5.5V 缓冲器 Voltage range 4.5V to 5.5V, average propagation delay 4.6ns, average drive strength 64mA

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* 数据表 SN74AHCT16244 16-Bit Buffers/Drivers With 3-State Outputs 数据表 (Rev. J) PDF | HTML 2014-10-13

设计与开发

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仿真模型

SN74AHCT16244 Behavioral SPICE Model

SCLM251.ZIP (7 KB) - PSpice 模型
支持的产品和硬件
仿真模型

SN74AHCT16244 IBIS Model (Rev. A)

SCLM071 (99 KB) - IBIS 模型
支持的产品和硬件
封装 引脚 CAD 符号、封装和 3D 模型
TVSOP (DGV) 48 Ultra Librarian
SSOP (DL) 48 Ultra Librarian
TSSOP (DGG) 48 Ultra Librarian

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