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Technology family AHCT Number of channels 4 IOL (max) (mA) 8 Supply current (max) (µA) 20 IOH (max) (mA) -8 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Rating HiRel Enhanced Product Operating temperature range (°C) -40 to 125
Technology family AHCT Number of channels 4 IOL (max) (mA) 8 Supply current (max) (µA) 20 IOH (max) (mA) -8 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Rating HiRel Enhanced Product Operating temperature range (°C) -40 to 125
TSSOP (PW) 14 32 mm² (5 mm × 6.4 mm) SOIC (D) 14 51.9 mm² (8.65 mm × 6 mm)
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –40°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Inputs Are TTL-Voltage Compatible

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –40°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Inputs Are TTL-Voltage Compatible

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

The SN74AHCT126 device is a quadruple bus buffer gate featuring independent line drivers with 3-state outputs. Each output is disabled when the associated output-enable (OE) input is low. When OE is high, the respective gate passes the data from the A input to its Y output.

To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

The SN74AHCT126 device is a quadruple bus buffer gate featuring independent line drivers with 3-state outputs. Each output is disabled when the associated output-enable (OE) input is low. When OE is high, the respective gate passes the data from the A input to its Y output.

To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

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顶层文档 类型 标题 格式选项 下载最新的英语版本 日期
* 数据表 SN74AHCT126-EP 数据表 2003-12-5
* VID SN74AHCT126-EP VID V6204684 2016-6-21

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封装 引脚 CAD 符号、封装和 3D 模型
TSSOP (PW) 14 Ultra Librarian
SOIC (D) 14 Ultra Librarian

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