TS3DDR3812

Name: TS3DDR3812
Brand: TI
SKU: TS3DDR3812
Price: 2.211 USD

활성

DDR3 애플리케이션용 3.3V, 2:1(SPDT), 12채널 스위치

지금 주문

데이터 시트

document-pdfAcrobat 12-CHANNEL, 1:2 MUX/DEMUX SWITCH FOR DDR3 APPLICATIONS datasheet (Rev. B) (영어)

TS3DDR3812

활성

데이터 시트

지금 주문

제품 상세 정보

Protocols

DDR3

Configuration

2:1 SPDT

Number of channels

12

Bandwidth (MHz)

1675

Supply voltage (max) (V)

3.6

Supply voltage (min) (V)

3

Ron (typ) (mΩ)

8000

Input/output voltage (min) (V)

0

Input/output voltage (max) (V)

3.6

Supply current (typ) (µA)

300

ESD HBM (typ) (kV)

2

Operating temperature range (°C)

-40 to 85

Crosstalk (dB)

-71

ESD CDM (kV)

1

Input/output continuous current (max) (mA)

128

COFF (typ) (pF)

5.6

CON (typ) (pF)

2

Off isolation (typ) (dB)

-42

OFF-state leakage current (max) (µA)

1

Propagation delay time (µs)

0.00004

Ron (max) (mΩ)

12000

Ron channel match (max) (Ω)

1

RON flatness (typ) (Ω)

1.5

Turnoff time (disable) (max) (ns)

5

Turnon time (enable) (max) (ns)

7

VIH (min) (V)

2

VIL (max) (V)

0.8

Rating

Catalog

Protocols

DDR3

Configuration

2:1 SPDT

Number of channels

12

Bandwidth (MHz)

1675

Supply voltage (max) (V)

3.6

Supply voltage (min) (V)

3

Ron (typ) (mΩ)

8000

Input/output voltage (min) (V)

0

Input/output voltage (max) (V)

3.6

Supply current (typ) (µA)

300

ESD HBM (typ) (kV)

2

Operating temperature range (°C)

-40 to 85

Crosstalk (dB)

-71

ESD CDM (kV)

1

Input/output continuous current (max) (mA)

128

COFF (typ) (pF)

5.6

CON (typ) (pF)

2

Off isolation (typ) (dB)

-42

OFF-state leakage current (max) (µA)

1

Propagation delay time (µs)

0.00004

Ron (max) (mΩ)

12000

Ron channel match (max) (Ω)

1

RON flatness (typ) (Ω)

1.5

Turnoff time (disable) (max) (ns)

5

Turnon time (enable) (max) (ns)

7

VIH (min) (V)

2

VIL (max) (V)

0.8

Rating

Catalog

WQFN (RUA)

42

31.5 mm² 9 x 3.5

Compatible with DDR3 SDRAM Standard (JESD79-3D)
Wide Bandwidth of 1.675 GHz
Low Propagation Delay (t_pd= 40 ps Typ)
Low Bit-to-Bit Skew (t_sk(o) = 6 ps Typ)
Low and Flat ON-State Resistance
(r_ON = 8 Ω Typ)
Low Input/Output Capacitance
(C_ON = 5.6 pF Typ)
Low Crosstalk (X_TALK = –43 dB,
Typ at 250 MHz)
V_CC Operating Range from 3 V to 3.6 V
Rail-to-Rail Switching on Data I/O Ports
(0 to V_CC)
Separate Switch Control Logic for Upper and Lower 6-Channels
Dedicated Enable Logic Supports Hi-Z Mode
I_OFF Protection Prevents Current Leakage in Powered Down State (V_CC = 0 V)
ESD Performance Tested Per JESD22
- 2000 V Human Body Model
  (A114B, Class II)
- 1000 V Charged Device Model (C101)
42-pin RUA Package (9 × 3.5 mm, 0.5 mm Pitch)

Compatible with DDR3 SDRAM Standard (JESD79-3D)
Wide Bandwidth of 1.675 GHz
Low Propagation Delay (t_pd= 40 ps Typ)
Low Bit-to-Bit Skew (t_sk(o) = 6 ps Typ)
Low and Flat ON-State Resistance
(r_ON = 8 Ω Typ)
Low Input/Output Capacitance
(C_ON = 5.6 pF Typ)
Low Crosstalk (X_TALK = –43 dB,
Typ at 250 MHz)
V_CC Operating Range from 3 V to 3.6 V
Rail-to-Rail Switching on Data I/O Ports
(0 to V_CC)
Separate Switch Control Logic for Upper and Lower 6-Channels
Dedicated Enable Logic Supports Hi-Z Mode
I_OFF Protection Prevents Current Leakage in Powered Down State (V_CC = 0 V)
ESD Performance Tested Per JESD22
- 2000 V Human Body Model
  (A114B, Class II)
- 1000 V Charged Device Model (C101)
42-pin RUA Package (9 × 3.5 mm, 0.5 mm Pitch)

The TS3DDR3812 is a 12-channel, 1:2 multiplexer/demultiplexer switch designed for DDR3 applications. It operates from a 3 to 3.6 V supply and offers low and flat ON-state resistance as well as low I/O capacitance which allow it to achieve a typical bandwidth of 1.675 GHz.

Channels A₀ through A₁₁ are divided into two banks of six bits and are independently controlled via two digital inputs called SEL1 and SEL2. These select inputs control the switch position of each 6-bit DDR3 source and allow them to be routed to one of two end-points. Alternatively, the switch can be used to connect a single endpoint to one of two 6-bit DDR3 sources. For switching 12-bit DDR3 sources, simply connect SEL1 and SEL2 together externally and control all 12 channels with a single GPIO input. An EN input allows the entire chip to be placed into a high-impedance (Hi-Z) state while not in use.

These characteristics make the TS3DDR3812 an excellent choice for use in memory, analog/digital video, LAN, and other high-speed signal switching applications.

The TS3DDR3812 is a 12-channel, 1:2 multiplexer/demultiplexer switch designed for DDR3 applications. It operates from a 3 to 3.6 V supply and offers low and flat ON-state resistance as well as low I/O capacitance which allow it to achieve a typical bandwidth of 1.675 GHz.

Channels A₀ through A₁₁ are divided into two banks of six bits and are independently controlled via two digital inputs called SEL1 and SEL2. These select inputs control the switch position of each 6-bit DDR3 source and allow them to be routed to one of two end-points. Alternatively, the switch can be used to connect a single endpoint to one of two 6-bit DDR3 sources. For switching 12-bit DDR3 sources, simply connect SEL1 and SEL2 together externally and control all 12 channels with a single GPIO input. An EN input allows the entire chip to be placed into a high-impedance (Hi-Z) state while not in use.

These characteristics make the TS3DDR3812 an excellent choice for use in memory, analog/digital video, LAN, and other high-speed signal switching applications.

filter

기타 프로토콜/버스 스위치 및 멀티플렉서 찾기

다운로드 스크립트와 함께 비디오 보기 동영상

관심 가지실만한 유사 제품

open-in-new

대안 비교

비교 대상 장치보다 업그레이드된 기능을 지원하는 드롭인 대체품

TS3DDR4000

활성

3.3V, 2:1(SPDT), 12채널 DDR2, DDR3 및 DDR4 스위치 Flipped logic polarity (normally closed)

기술 자료

star

=TI에서 선정한 이 제품의 인기 문서

검색된 결과가 없습니다. 검색어를 지우고 다시 시도하십시오.

1개 모두 보기

	유형	직함		날짜
*	Data sheet	12-CHANNEL, 1:2 MUX/DEMUX SWITCH FOR DDR3 APPLICATIONS datasheet (Rev. B)		2013/06/03

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

HSEC180ADAPEVM-AM2 — AM261x SOM(시스템 온 모듈) 평가 모듈(EVM)용 HSEC180 어댑터 보드

이 평가 모듈(EVM)은 TI AM261x SOM(시스템 온 모듈) 플랫폼용 180핀 HSEC(고속 에지 카드) 어댑터로, SOM 기반 플랫폼이 Sitara™/C2000™ HSEC 기반 EVM과 역호환성을 가질 수 있도록 합니다. HSEC180ADAPEVM-AM2은 TMDSHSECDOCK-AM263 및 TMDSHSECDOCK 같은 레거시 Sitara/C2000 HSEC 도킹 스테이션과 함께 사용할 수 있도록 SOM 보드의 180핀을 HSEC 핀에 연결합니다.

사용 설명서: PDF | HTML

TI.com에서 구매 불가

평가 보드

LP-AM263 — AM263x Arm® 기반 MCU 범용 LaunchPad™ 개발 키트

LP-AM263은 AM263x 시리즈의 Arm® 기반 애플리케이션 MCU를 위한 비용 최적화된 개발 보드입니다. 이 보드는 다음 애플리케이션을 개발할 수 있는 표준화되고 사용하기 쉬운 플랫폼을 제공하므로 초기 평가 및 프로토타이핑에 이상적입니다.

LP-AM263에는 AM2634 Arm® 기반 애플리케이션 MCU와 추가 부품이 포함되어 있어, 사용자가 IE(산업용 이더넷), 표준 이더넷, FSI(고속 직렬 인터페이스) 등을 포함한 다양한 장치 인터페이스를 사용하여 프로토타입을 쉽게 제작할 수 있습니다. AM2634는 (...)

사용 설명서: PDF | HTML