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TPA4411

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80mW 立体声模拟输入耳机放大器

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TPA4411

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产品详情

Output power (W) 0.08 Analog supply (min) (V) 1.8 Analog supply voltage (max) (V) 4.5 Load (min) (Ω) 16 PSRR (dB) 80 Rating Catalog Operating temperature range (°C) -40 to 85 Headphone channels Stereo Volume control No Shutdown current (ISD) (µA) 1 Architecture Class-AB Iq per channel (typ) (mA) 3.7
Output power (W) 0.08 Analog supply (min) (V) 1.8 Analog supply voltage (max) (V) 4.5 Load (min) (Ω) 16 PSRR (dB) 80 Rating Catalog Operating temperature range (°C) -40 to 85 Headphone channels Stereo Volume control No Shutdown current (ISD) (µA) 1 Architecture Class-AB Iq per channel (typ) (mA) 3.7
DSBGA (YZH) 16 5.0625 mm² 2.25 x 2.25 WQFN (RTJ) 20 16 mm² 4 x 4
  • Space Saving Packages
    • 20-Pin, 4 mm × 4 mm Thin QFN
      • PA4411 — Thermally Optimized PowerPAD™ Package
      • TTPA4411M — Thermally Enhanced PowerPAD™ Package
    • 16-Ball, 2.18 mm × 2.18 mm WCSP
  • Ground-Referenced Outputs Eliminate
    DC-Bias Voltages on Headphone Ground Pin
    • No Output DC-Blocking Capacitors
      • Reduced Board Area
      • Reduced Component Cost
      • Improved THD+N Performance
      • No Degradation of Low-Frequency Response Due to Output Capacitors
    • Wide Power Supply Range: 1.8 V to 4.5 V
    • 80-mW/Ch Output Power into 16- at 4.5 V
    • Independent Right and Left Channel
      Shutdown Control
    • Short-Circuit and Thermal Protection
    • Pop Reduction Circuitry
  • APPLICATIONS
    • Notebook Computers
    • CD / MP3 Players
    • Smart Phones
    • Cellular Phones
    • PDAs
  • Space Saving Packages
    • 20-Pin, 4 mm × 4 mm Thin QFN
      • PA4411 — Thermally Optimized PowerPAD™ Package
      • TTPA4411M — Thermally Enhanced PowerPAD™ Package
    • 16-Ball, 2.18 mm × 2.18 mm WCSP
  • Ground-Referenced Outputs Eliminate
    DC-Bias Voltages on Headphone Ground Pin
    • No Output DC-Blocking Capacitors
      • Reduced Board Area
      • Reduced Component Cost
      • Improved THD+N Performance
      • No Degradation of Low-Frequency Response Due to Output Capacitors
    • Wide Power Supply Range: 1.8 V to 4.5 V
    • 80-mW/Ch Output Power into 16- at 4.5 V
    • Independent Right and Left Channel
      Shutdown Control
    • Short-Circuit and Thermal Protection
    • Pop Reduction Circuitry
  • APPLICATIONS
    • Notebook Computers
    • CD / MP3 Players
    • Smart Phones
    • Cellular Phones
    • PDAs

The TPA4411 and TPA4411M are stereo headphone drivers designed to allow the removal of the output DC-blocking capacitors for reduced component count and cost. The TPA4411 and TPA4411M are ideal for small portable electronics where size and cost are critical design parameters.

The TPA4411 and TPA4411M are capable of driving 80 mW into a 16- load at 4.5 V. Both TPA4411 and TPA4411M have a fixed gain of 1.5 V/V and headphone outputs that have ±8-kV IEC ESD protection. The TPA4411 and TPA4411M have independent shutdown control for the right and left audio channels.

The TPA4411 is available in a 2.18 mm × 2.18 mm WCSP and 4 mm × 4 mm Thin QFN packages. The TPA4411M is available in a 4 mm × 4 mm Thin QFN package. The TPA4411RTJ package is a thermally optimized PowerPAD™ package allowing the maximum amount of thermal dissipation and the TPA4411MRTJ is a thermally enhanced PowerPAD package designed to match competitive package footprints.

The TPA4411 and TPA4411M are stereo headphone drivers designed to allow the removal of the output DC-blocking capacitors for reduced component count and cost. The TPA4411 and TPA4411M are ideal for small portable electronics where size and cost are critical design parameters.

The TPA4411 and TPA4411M are capable of driving 80 mW into a 16- load at 4.5 V. Both TPA4411 and TPA4411M have a fixed gain of 1.5 V/V and headphone outputs that have ±8-kV IEC ESD protection. The TPA4411 and TPA4411M have independent shutdown control for the right and left audio channels.

The TPA4411 is available in a 2.18 mm × 2.18 mm WCSP and 4 mm × 4 mm Thin QFN packages. The TPA4411M is available in a 4 mm × 4 mm Thin QFN package. The TPA4411RTJ package is a thermally optimized PowerPAD™ package allowing the maximum amount of thermal dissipation and the TPA4411MRTJ is a thermally enhanced PowerPAD package designed to match competitive package footprints.
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类型 标题 下载最新的英语版本 日期
* 数据表 80-mW DirectPath(TM) Stereo Headphone Driver 数据表 (Rev. E) 2008年 3月 4日
应用手册 Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) 2019年 8月 26日
应用手册 AN-1849 An Audio Amplifier Power Supply Design (Rev. C) 2019年 6月 27日
更多文献资料 Журнал по применению аналоговых компонентов 2кв. 2010 2011年 8月 8日
模拟设计期刊 用于将 APA 输出连接至其它器件的预防措施 英语版 2011年 4月 5日
模拟设计期刊 2Q 2010 Issue Analog Applications Journal 2010年 5月 6日
EVM 用户指南 TPA4411EVM - User Guide (Rev. A) 2008年 1月 9日
更多文献资料 TPA4411_NanoEVM_ Schematic 2007年 2月 13日
更多文献资料 TPA4411_NanoEVM_OV 2007年 1月 29日

设计和开发

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评估板

TPA4411EVM — TPA4411 评估模块 (EVM)

The TPA4411 is a stereo headphone driver evaluation module. The TPA4411 device is designed to allow the removal of the output DC-blocking capacitors for reduced component count and cost. The evaluation module consists of a TI TPA4411 80-mW audio power amplifier in a small QFN package. It is ideal (...)

用户指南: PDF
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光绘文件

TPA4411 Gerber Files

SLVC074.ZIP (87 KB)
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封装 引脚 下载
DSBGA (YZH) 16 查看选项
WQFN (RTJ) 20 查看选项
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订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

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