TPA4411
- Space Saving Packages
- 20-Pin, 4 mm × 4 mm Thin QFN
- PA4411 — Thermally Optimized PowerPAD™ Package
- TTPA4411M — Thermally Enhanced PowerPAD™ Package
- 16-Ball, 2.18 mm × 2.18 mm WCSP
- 20-Pin, 4 mm × 4 mm Thin QFN
- Ground-Referenced Outputs Eliminate
DC-Bias Voltages on Headphone Ground Pin- No Output DC-Blocking Capacitors
- Reduced Board Area
- Reduced Component Cost
- Improved THD+N Performance
- No Degradation of Low-Frequency Response Due to Output Capacitors
- Wide Power Supply Range: 1.8 V to 4.5 V
- 80-mW/Ch Output Power into 16-
at 4.5 V - Independent Right and Left Channel
Shutdown Control - Short-Circuit and Thermal Protection
- Pop Reduction Circuitry
- No Output DC-Blocking Capacitors
- APPLICATIONS
- Notebook Computers
- CD / MP3 Players
- Smart Phones
- Cellular Phones
- PDAs
The TPA4411 and TPA4411M are stereo headphone drivers designed to allow the removal of the output DC-blocking capacitors for reduced component count and cost. The TPA4411 and TPA4411M are ideal for small portable electronics where size and cost are critical design parameters.
The TPA4411 and TPA4411M are capable of driving 80 mW into a 16-
load
at 4.5 V. Both TPA4411 and TPA4411M have a fixed gain of 1.5 V/V and headphone outputs that have
±8-kV IEC ESD protection. The TPA4411 and TPA4411M have independent shutdown control for the
right and left audio channels.
The TPA4411 is available in a 2.18 mm × 2.18 mm WCSP and 4 mm × 4 mm Thin QFN packages. The TPA4411M is available in a 4 mm × 4 mm Thin QFN package. The TPA4411RTJ package is a thermally optimized PowerPAD package allowing the maximum amount of thermal dissipation and the TPA4411MRTJ is a thermally enhanced PowerPAD package designed to match competitive package footprints.
技术文档
| 类型 | 标题 | 下载最新的英语版本 | 日期 | |||
|---|---|---|---|---|---|---|
| * | 数据表 | 80-mW DirectPath(TM) Stereo Headphone Driver 数据表 (Rev. E) | 2008年 3月 4日 | |||
| 应用手册 | Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) | 2019年 8月 26日 | ||||
| 应用手册 | AN-1849 An Audio Amplifier Power Supply Design (Rev. C) | 2019年 6月 27日 | ||||
| 模拟设计期刊 | 用于将 APA 输出连接至其它器件的预防措施 | 英语版 | 2011年 4月 5日 | |||
| 模拟设计期刊 | 2Q 2010 Issue Analog Applications Journal | 2010年 5月 6日 | ||||
| EVM 用户指南 | TPA4411EVM - User Guide (Rev. A) | 2008年 1月 9日 | ||||
| 更多文献资料 | TPA4411_NanoEVM_ Schematic | 2007年 2月 13日 | ||||
| 更多文献资料 | TPA4411_NanoEVM_OV | 2007年 1月 29日 |
设计和开发
如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。
TPA4411EVM — TPA4411 评估模块 (EVM)
TPA4411 是一种立体声耳机驱动评估板模块。TPA4411 在设计上支持移除输出隔直电容,精简元件数量与成本。该评估模块集成 TI TPA4411 80mW 音频功放,采用小型 QFN 封装。非常适合便携式电池供电音频设备,包括手机/智能终端、MP3 播放器、笔记本电脑和 PDA。
PSPICE-FOR-TI — PSpice® for TI 设计和仿真工具
借助 PSpice for TI 的设计和仿真环境及其内置的模型库,您可对复杂的混合信号设计进行仿真。创建完整的终端设备设计和原型解决方案,然后再进行布局和制造,可缩短产品上市时间并降低开发成本。
在 PSpice for TI 设计和仿真工具中,您可以搜索 TI (...)
| 封装 | 引脚 | CAD 符号、封装和 3D 模型 |
|---|---|---|
| DSBGA (YZH) | 16 | Ultra Librarian |
| WQFN (RTJ) | 20 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点
推荐产品可能包含与 TI 此产品相关的参数、评估模块或参考设计。