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TPA3001D1

不推荐用于新设计

20W 单声道、8V 至 18V 电源、模拟输入 D 类音频放大器

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数据表
TPA3001D1 不推荐用于新设计
该产品会持续为现有客户提供。新设计应考虑替代产品。
open-in-new 比较替代产品
功能与比较器件相同，但引脚排列有所不同
TPA3112D1 正在供货 支持无滤波器操作、带有 SpeakerGuard™ 的 25W 单声道、8V 至 26V 电源电压、模拟输入 D 类音频放大器 Refreshed version of TPA3112

TPA3001D1

不推荐用于新设计
数据表 立即订购

产品详情

Audio input type Analog Input Speaker channels (max) Mono Control interface Hardware Power stage supply (max) (V) 18 Power stage supply (min) (V) 8 THD + N at 1 kHz (%) 0.2 Load (min) (Ω) 4 Analog supply voltage (min) (V) 8 Analog supply voltage (max) (V) 18 Rating Catalog Operating temperature range (°C) -40 to 85
Audio input type Analog Input Speaker channels (max) Mono Control interface Hardware Power stage supply (max) (V) 18 Power stage supply (min) (V) 8 THD + N at 1 kHz (%) 0.2 Load (min) (Ω) 4 Analog supply voltage (min) (V) 8 Analog supply voltage (max) (V) 18 Rating Catalog Operating temperature range (°C) -40 to 85
HTSSOP (PWP) 24 49.92 mm² 7.8 x 6.4
  • 20 W Into 8- Load From 18-V Supply (10% THD+N)
  • Short-Circuit Protection (Short to VCC, Short to GND,
    Short Between Outputs)
  • Third-Generation Modulation Technique:
    • Replaces Large LC Filter With Small, Low-Cost Ferrite
      Bead Filter in Most Applications
    • Improved Efficiency
    • Improved SNR
  • Low Supply Current: 8 mA Typ at 12 V
  • Shutdown Control: < 1 µA Typ
  • Space-Saving, Thermally-Enhanced PowerPAD™ Packaging
  • APPLICATIONS
    • LCD Monitors/TVs
    • Hands-Free Car Kits
    • Powered Speakers

PowerPAD Is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners
  • 20 W Into 8- Load From 18-V Supply (10% THD+N)
  • Short-Circuit Protection (Short to VCC, Short to GND,
    Short Between Outputs)
  • Third-Generation Modulation Technique:
    • Replaces Large LC Filter With Small, Low-Cost Ferrite
      Bead Filter in Most Applications
    • Improved Efficiency
    • Improved SNR
  • Low Supply Current: 8 mA Typ at 12 V
  • Shutdown Control: < 1 µA Typ
  • Space-Saving, Thermally-Enhanced PowerPAD™ Packaging
  • APPLICATIONS
    • LCD Monitors/TVs
    • Hands-Free Car Kits
    • Powered Speakers

PowerPAD Is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners

The TPA3001D1 (sometimes referred to as TPA3001) is a 20-W monaural bridge-tied load (BTL) class-D audio power amplifier (class-D amp) with high efficiency, eliminating the need for heat sinks. The TPA3001D1 can drive 4- or 8- speakers with only a ferrite bead filter required to reduce EMI.

The gain of the amplifier is controlled by two input terminals, GAIN1 and GAIN0. This allows the amplifier to be configured for a gain of 12, 18, 23.6, or 36 dB. The differential input stage provides high common-mode rejection and improved power-supply rejection.

The amplifier also includes depop circuitry to reduce the amount of pop at power-up and when cycling SHUTDOWN.

The TPA3001D1 (TPA3001) is available in the 24-pin thermally enhanced TSSOP package (PWP), which eliminates the need for an external heat sink.

The TPA3001D1 (sometimes referred to as TPA3001) is a 20-W monaural bridge-tied load (BTL) class-D audio power amplifier (class-D amp) with high efficiency, eliminating the need for heat sinks. The TPA3001D1 can drive 4- or 8- speakers with only a ferrite bead filter required to reduce EMI.

The gain of the amplifier is controlled by two input terminals, GAIN1 and GAIN0. This allows the amplifier to be configured for a gain of 12, 18, 23.6, or 36 dB. The differential input stage provides high common-mode rejection and improved power-supply rejection.

The amplifier also includes depop circuitry to reduce the amount of pop at power-up and when cycling SHUTDOWN.

The TPA3001D1 (TPA3001) is available in the 24-pin thermally enhanced TSSOP package (PWP), which eliminates the need for an external heat sink.
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类型 标题 下载最新的英语版本 日期
* 数据表 20W Mono Class-D Audio Power Amplifier 数据表 (Rev. E) 2010年 8月 23日

订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点