产品详细信息

Audio input type Analog Input Architecture Class-D Speaker channels (Max) Stereo Power stage supply (Max) (V) 5.5 Power stage supply (Min) (V) 2.5 Load (Min) (ohms) 4 Output power (W) 2.1 SNR (dB) 95 THD + N @ 1 kHz (%) 0.14 Iq (Typ) (mA) 6 Control interface GPIO Closed/open loop Open Analog supply (Min) (V) 2.5 Analog supply (Max) (V) 5.5 PSRR (dB) 71 Operating temperature range (C) -40 to 85
Audio input type Analog Input Architecture Class-D Speaker channels (Max) Stereo Power stage supply (Max) (V) 5.5 Power stage supply (Min) (V) 2.5 Load (Min) (ohms) 4 Output power (W) 2.1 SNR (dB) 95 THD + N @ 1 kHz (%) 0.14 Iq (Typ) (mA) 6 Control interface GPIO Closed/open loop Open Analog supply (Min) (V) 2.5 Analog supply (Max) (V) 5.5 PSRR (dB) 71 Operating temperature range (C) -40 to 85
DSBGA (YZH) 16 5 mm² 2.016 x 2.016 WQFN (RTJ) 20 16 mm² 4 x 4
  • Output Power By Package:
    • WQFN:
      • 2.1 W/Ch Into 4 Ω at 5 V
      • 1.4 W/Ch Into 8 Ω at 5 V
      • 720 mW/Ch Into 8 Ω at 3.6 V
    • DSBGA:
      • 1.2 W/Ch Into 4 Ω at 5 V
        (Thermally Limited)
      • 1.3 W/Ch Into 8 Ω at 5 V
      • 720 mW/Ch Into 8 Ω at 3.6 V
  • Only Two External Components Required
  • Power Supply Range: 2.5 V to 5.5 V
  • Independent Shutdown Control for Each Channel
  • Selectable Gain of 6, 12, 18, and 24 dB
  • Internal Pulldown Resistor on Shutdown Pins
  • High PSRR: 77 dB at 217 Hz
  • Fast Start-Up Time (3.5 ms)
  • Low Supply Current
  • Low Shutdown Current
  • Short-Circuit and Thermal Protection
  • Space-Saving Packages
    • 2.01-mm × 2.01-mm NanoFree™ DSBGA (YZH)
    • 4-mm × 4-mm Thin WQFN (RTJ) With PowerPAD™
  • Output Power By Package:
    • WQFN:
      • 2.1 W/Ch Into 4 Ω at 5 V
      • 1.4 W/Ch Into 8 Ω at 5 V
      • 720 mW/Ch Into 8 Ω at 3.6 V
    • DSBGA:
      • 1.2 W/Ch Into 4 Ω at 5 V
        (Thermally Limited)
      • 1.3 W/Ch Into 8 Ω at 5 V
      • 720 mW/Ch Into 8 Ω at 3.6 V
  • Only Two External Components Required
  • Power Supply Range: 2.5 V to 5.5 V
  • Independent Shutdown Control for Each Channel
  • Selectable Gain of 6, 12, 18, and 24 dB
  • Internal Pulldown Resistor on Shutdown Pins
  • High PSRR: 77 dB at 217 Hz
  • Fast Start-Up Time (3.5 ms)
  • Low Supply Current
  • Low Shutdown Current
  • Short-Circuit and Thermal Protection
  • Space-Saving Packages
    • 2.01-mm × 2.01-mm NanoFree™ DSBGA (YZH)
    • 4-mm × 4-mm Thin WQFN (RTJ) With PowerPAD™

The TPA2012D2 is a stereo, filter-free, Class-D audio amplifier (Class-D amp) available in a DSBGA or WQFN package. The TPA2012D2 only requires two external components for operation.

The TPA2012D2 features independent shutdown controls for each channel. The gain can be selected to 6, 12, 18, or 24 dB using the G0 and G1 gain select pins. High PSRR and differential architecture provide increased immunity to noise and RF rectification. In addition to these features, a fast start-up time and small package size make the TPA2012D2 class-D amp an ideal choice for both cellular handsets and PDAs.

The TPA2012D2 is capable of driving 1.4 W/Ch at
5 V or 720 mW/Ch at 3.6 V into 8 Ω. The TPA2012D2 is also capable of driving 4 Ω. The TPA2012D2 is thermally limited in DSBGA and may not achieve
2.1 W/Ch for 4 Ω. The maximum output power in the DSBGA is determined by the ability of the circuit board to remove heat. Figure 33 shows thermally limited region of the DSBGA in relation to the WQFN package. The TPA2012D2 provides thermal and short-circuit protection.

The TPA2012D2 is a stereo, filter-free, Class-D audio amplifier (Class-D amp) available in a DSBGA or WQFN package. The TPA2012D2 only requires two external components for operation.

The TPA2012D2 features independent shutdown controls for each channel. The gain can be selected to 6, 12, 18, or 24 dB using the G0 and G1 gain select pins. High PSRR and differential architecture provide increased immunity to noise and RF rectification. In addition to these features, a fast start-up time and small package size make the TPA2012D2 class-D amp an ideal choice for both cellular handsets and PDAs.

The TPA2012D2 is capable of driving 1.4 W/Ch at
5 V or 720 mW/Ch at 3.6 V into 8 Ω. The TPA2012D2 is also capable of driving 4 Ω. The TPA2012D2 is thermally limited in DSBGA and may not achieve
2.1 W/Ch for 4 Ω. The maximum output power in the DSBGA is determined by the ability of the circuit board to remove heat. Figure 33 shows thermally limited region of the DSBGA in relation to the WQFN package. The TPA2012D2 provides thermal and short-circuit protection.

下载

技术文档

star = TI 精选相关文档
未找到结果。请清除搜索,并重试。
显示全部 8 项
类型 标题 下载最新的英文版本 日期
* 数据表 TPA2012D2 2.1-W/Channel Stereo Filter-Free Class-D Audio Power Amplifier 数据表 (Rev. F) 2017年 3月 14日
应用手册 Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) 2019年 8月 26日
应用手册 AN-1849 An Audio Amplifier Power Supply Design (Rev. C) 2019年 6月 27日
应用手册 AN-1737 Managing EMI in Class D Audio Applications (Rev. A) 2013年 5月 1日
更多文献资料 TPA2012D2_NanoEVM_ Schematic 2007年 2月 13日
更多文献资料 TPA2012D2_NanoEVM_OV 2007年 1月 29日
应用手册 Measuring Class-D Amplifiers for Audio Speaker Overstress Testing 2005年 10月 28日
用户指南 TPA2012D2 Audio Power Amplifier EVM (Rev. A) 2005年 4月 7日

设计与开发

有关其他条款或所需资源,请点击下面的任何链接来查看详情页面。

评估板

CC3200AUDBOOST — SimpleLink Wi-Fi CC3200 音频·BoosterPack

SimpleLink™ Wi-Fi® CC3200 音频 BoosterPack 可借助 SimpleLink Wi-Fi CC3200 器件 上的数字音频外设 [I2S] 实现评估和开发。BoosterPack 可与 SimpleLink Wi-Fi CC3200 Launchpad (CC3200-LAUNCHXL) 配合使用。它包含 D 类功率放大器,可以驱动扬声器和超低功耗音频编解码器,即支持可编程音频处理的 TLV320AIC3254。扬声器、耳机和麦克风单独销售。SDK 中的示例应用需要两个 CC3200 LaunchPad 和 CC3200AUDBOOST (...)

现货
数量限制: 50
评估板

TPA2012D2EVM — TPA2012D2 评估模块 (EVM)

The TPA2012D2 EVM is a Pb-free, highly-efficient, filter-free stereo audio power amplifier evaluation module. It consists of the TI TPA2012D2 1.65 W low-voltage stereo Class-D audio power amplifier IC in a very small NanoFree™ wafer chip scale package (WCSP). All devices including the (...)

现货
数量限制: 1
仿真模型

TPA2012D2 TINA-TI Spice Model

SLOM159.ZIP (22 KB) - TINA-TI Spice Model
仿真模型

TPA2012D2 TINA-TI Reference Design

SLOM160.TSC (37 KB) - TINA-TI Reference Design
仿真模型

TPA2012D2 PSpice Model

SLOM162.ZIP (6 KB) - PSpice Model
仿真工具

PSPICE-FOR-TI — PSPICE® for TI design and simulation tool

PSpice® for TI 可提供帮助评估模拟电路功能的设计和仿真环境。此功能齐全的设计和仿真套件使用 Cadence® 的模拟分析引擎。PSpice for TI 可免费使用,包括业内超大的模型库之一,涵盖我们的模拟和电源产品系列以及精选的模拟行为模型。

借助 PSpice for TI 的设计和仿真环境及其内置的模型库,您可对复杂的混合信号设计进行仿真。创建完整的终端设备设计和原型解决方案,然后再进行布局和制造,可缩短产品上市时间并降低开发成本。 

在 PSpice for TI 设计和仿真工具中,您可以搜索 TI (...)
参考设计

TIDC-CC3200AUDBOOST — 用于 SimpleLink Wi-Fi CC3200 Launchpad 的 Wi-Fi 音频流应用

此 SimpleLink Wi-Fi CC3200 LaunchPad 和音频 BoosterPack 设计使新应用以及高清数字扬声器等现有应用实现 Wi-Fi 音频流功能。它可以实现从数字麦克风或立体声/单声道音频插口到另一个启用 Wi-Fi 的设备的音频采集、流处理和回放。接收到的 Wi-Fi 音频可以通过板载立体声音频插口或接线盒传输到立体声或数字扬声器。
封装 引脚 下载
DSBGA (YZH) 16 了解详情
QFN (RTJ) 20 了解详情

订购与质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/FIT 估算
  • 材料成分
  • 认证摘要
  • 持续可靠性监测

推荐产品的参数、评估模块或参考设计可能与此 TI 产品相关

支持与培训

视频