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数字信号处理器 (DSP)

TMS320C6713B

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C67x 浮点 DSP- 高达 300MHz、McBSP、16 位 EMIFA

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C67x 浮点 DSP- 高达 300MHz、McBSP、16 位 EMIFA

TMS320C6713B

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产品详细信息

DSP 1 C67x DSP MHz (Max) 167, 200, 200, 225, 300 CPU 32-/64-bit Operating system DSP/BIOS Rating Catalog Operating temperature range (C) -40 to 105, 0 to 90
DSP 1 C67x DSP MHz (Max) 167, 200, 200, 225, 300 CPU 32-/64-bit Operating system DSP/BIOS Rating Catalog Operating temperature range (C) -40 to 105, 0 to 90
open-in-new 查找其它 数字信号处理器 (DSP)
BGA (GDP) 272 729 mm² 27 x 27 BGA (ZDP) 272 729 mm² 27 x 27
open-in-new 查找其它 数字信号处理器 (DSP)
  • Highest-Performance Floating-Point Digital Signal Processor (DSP): TMS320C6713B
    • Eight 32-Bit Instructions/Cycle
    • 32/64-Bit Data Word
    • 300-, 225-, 200-MHz (GDP and ZDP), and 225-, 200-, 167-MHz (PYP) Clock Rates
    • 3.3-, 4.4-, 5-, 6-Instruction Cycle Times
    • 2400/1800, 1800/1350, 1600/1200, and 1336/1000 MIPS/MFLOPS
    • Rich Peripheral Set, Optimized for Audio
    • Highly Optimized C/C++ Compiler
    • Extended Temperature Devices Available
  • Advanced Very Long Instruction Word (VLIW) TMS320C67x™ DSP Core
    • Eight Independent Functional Units:
      • 2 ALUs (Fixed-Point)
      • 4 ALUs (Floating-/Fixed-Point)
      • 2 Multipliers (Floating-/Fixed-Point)
    • Load-Store Architecture With 32 32-Bit General-Purpose Registers
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
  • Instruction Set Features
    • Native Instructions for IEEE 754
      • Single- and Double-Precision
    • Byte-Addressable (8-, 16-, 32-Bit Data)
    • 8-Bit Overflow Protection
    • Saturation; Bit-Field Extract, Set, Clear; Bit-Counting; Normalization
  • L1/L2 Memory Architecture
    • 4K-Byte L1P Program Cache (Direct-Mapped)
    • 4K-Byte L1D Data Cache (2-Way)
    • 256K-Byte L2 Memory Total: 64K-Byte L2 Unified Cache/Mapped RAM, and 192K-Byte Additional L2 Mapped RAM
  • Device Configuration
    • Boot Mode: HPI, 8-, 16-, 32-Bit ROM Boot
    • Endianness: Little Endian, Big Endian
  • 32-Bit External Memory Interface (EMIF)
    • Glueless Interface to SRAM, EPROM, Flash, SBSRAM, and SDRAM
    • 512M-Byte Total Addressable External Memory Space
  • Enhanced Direct-Memory-Access (EDMA) Controller (16 Independent Channels)
  • 16-Bit Host-Port Interface (HPI)
  • Two McASPs
    • Two Independent Clock Zones Each (1 TX and 1 RX)
    • Eight Serial Data Pins Per Port: Individually Assignable to any of the Clock Zones
    • Each Clock Zone Includes:
      • Programmable Clock Generator
      • Programmable Frame Sync Generator
      • TDM Streams From 2-32 Time Slots
      • Support for Slot Size:
          8, 12, 16, 20, 24, 28, 32 Bits
      • Data Formatter for Bit Manipulation
    • Wide Variety of I2S and Similar Bit Stream Formats
    • Integrated Digital Audio Interface Transmitter (DIT) Supports:
      • S/PDIF, IEC60958-1, AES-3, CP-430 Formats
      • Up to 16 transmit pins
      • Enhanced Channel Status/User Data
    • Extensive Error Checking and Recovery
  • Two Inter-Integrated Circuit Bus (I2C Bus™) Multi-Master and Slave Interfaces
  • Two Multichannel Buffered Serial Ports:
    • Serial-Peripheral-Interface (SPI)
    • High-Speed TDM Interface
    • AC97 Interface
  • Two 32-Bit General-Purpose Timers
  • Dedicated GPIO Module With 16 pins (External Interrupt Capable)
  • Flexible Phase-Locked-Loop (PLL) Based Clock Generator Module
  • IEEE-1149.1 (JTAG) Boundary-Scan-Compatible
  • 208-Pin PowerPAD™ PQFP (PYP)
  • 272-BGA Packages (GDP and ZDP)
  • 0.13-µm/6-Level Copper Metal Process
    • CMOS Technology
  • 3.3-V I/Os, 1.2-V Internal (GDP/ZDP/ PYP)
  • 3.3-V I/Os, 1.4-V Internal (GDP/ZDP) [300 MHz]

TMS320C67x and PowerPAD are trademarks of Texas Instruments.
I2C Bus is a trademark of Philips Electronics N.V. Corporation
All trademarks are the property of their respective owners.
IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
These values are compatible with existing 1.26-V designs.
TMS320C6000, eXpressDSP, Code Composer Studio, and DSP/BIOS are trademarks of Texas Instruments.
Throughout the remainder of this document, TMS320C6713B shall be referred to as C6713B or 13B.
  • Highest-Performance Floating-Point Digital Signal Processor (DSP): TMS320C6713B
    • Eight 32-Bit Instructions/Cycle
    • 32/64-Bit Data Word
    • 300-, 225-, 200-MHz (GDP and ZDP), and 225-, 200-, 167-MHz (PYP) Clock Rates
    • 3.3-, 4.4-, 5-, 6-Instruction Cycle Times
    • 2400/1800, 1800/1350, 1600/1200, and 1336/1000 MIPS/MFLOPS
    • Rich Peripheral Set, Optimized for Audio
    • Highly Optimized C/C++ Compiler
    • Extended Temperature Devices Available
  • Advanced Very Long Instruction Word (VLIW) TMS320C67x™ DSP Core
    • Eight Independent Functional Units:
      • 2 ALUs (Fixed-Point)
      • 4 ALUs (Floating-/Fixed-Point)
      • 2 Multipliers (Floating-/Fixed-Point)
    • Load-Store Architecture With 32 32-Bit General-Purpose Registers
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
  • Instruction Set Features
    • Native Instructions for IEEE 754
      • Single- and Double-Precision
    • Byte-Addressable (8-, 16-, 32-Bit Data)
    • 8-Bit Overflow Protection
    • Saturation; Bit-Field Extract, Set, Clear; Bit-Counting; Normalization
  • L1/L2 Memory Architecture
    • 4K-Byte L1P Program Cache (Direct-Mapped)
    • 4K-Byte L1D Data Cache (2-Way)
    • 256K-Byte L2 Memory Total: 64K-Byte L2 Unified Cache/Mapped RAM, and 192K-Byte Additional L2 Mapped RAM
  • Device Configuration
    • Boot Mode: HPI, 8-, 16-, 32-Bit ROM Boot
    • Endianness: Little Endian, Big Endian
  • 32-Bit External Memory Interface (EMIF)
    • Glueless Interface to SRAM, EPROM, Flash, SBSRAM, and SDRAM
    • 512M-Byte Total Addressable External Memory Space
  • Enhanced Direct-Memory-Access (EDMA) Controller (16 Independent Channels)
  • 16-Bit Host-Port Interface (HPI)
  • Two McASPs
    • Two Independent Clock Zones Each (1 TX and 1 RX)
    • Eight Serial Data Pins Per Port: Individually Assignable to any of the Clock Zones
    • Each Clock Zone Includes:
      • Programmable Clock Generator
      • Programmable Frame Sync Generator
      • TDM Streams From 2-32 Time Slots
      • Support for Slot Size:
          8, 12, 16, 20, 24, 28, 32 Bits
      • Data Formatter for Bit Manipulation
    • Wide Variety of I2S and Similar Bit Stream Formats
    • Integrated Digital Audio Interface Transmitter (DIT) Supports:
      • S/PDIF, IEC60958-1, AES-3, CP-430 Formats
      • Up to 16 transmit pins
      • Enhanced Channel Status/User Data
    • Extensive Error Checking and Recovery
  • Two Inter-Integrated Circuit Bus (I2C Bus™) Multi-Master and Slave Interfaces
  • Two Multichannel Buffered Serial Ports:
    • Serial-Peripheral-Interface (SPI)
    • High-Speed TDM Interface
    • AC97 Interface
  • Two 32-Bit General-Purpose Timers
  • Dedicated GPIO Module With 16 pins (External Interrupt Capable)
  • Flexible Phase-Locked-Loop (PLL) Based Clock Generator Module
  • IEEE-1149.1 (JTAG) Boundary-Scan-Compatible
  • 208-Pin PowerPAD™ PQFP (PYP)
  • 272-BGA Packages (GDP and ZDP)
  • 0.13-µm/6-Level Copper Metal Process
    • CMOS Technology
  • 3.3-V I/Os, 1.2-V Internal (GDP/ZDP/ PYP)
  • 3.3-V I/Os, 1.4-V Internal (GDP/ZDP) [300 MHz]

TMS320C67x and PowerPAD are trademarks of Texas Instruments.
I2C Bus is a trademark of Philips Electronics N.V. Corporation
All trademarks are the property of their respective owners.
IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
These values are compatible with existing 1.26-V designs.
TMS320C6000, eXpressDSP, Code Composer Studio, and DSP/BIOS are trademarks of Texas Instruments.
Throughout the remainder of this document, TMS320C6713B shall be referred to as C6713B or 13B.

open-in-new 查找其它 数字信号处理器 (DSP)

The TMS320C67x™ DSPs (including the TMS320C6713B device) compose the floating-point DSP generation in the TMS320C6000™ DSP platform. The C6713B device is based on the high-performance, advanced very-long-instruction-word (VLIW) architecture developed by Texas Instruments (TI), making this DSP an excellent choice for multichannel and multifunction applications.

Operating at 225 MHz, the C6713B delivers up to 1350 million floating-point operations per second (MFLOPS), 1800 million instructions per second (MIPS), and with dual fixed-/floating-point multipliers up to 450 million multiply-accumulate operations per second (MMACS).

Operating at 300 MHz, the C6713B delivers up to 1800 million floating-point operations per second (MFLOPS), 2400 million instructions per second (MIPS), and with dual fixed-/floating-point multipliers up to 600 million multiply-accumulate operations per second (MMACS).

The C6713B uses a two-level cache-based architecture and has a powerful and diverse set of peripherals. The Level 1 program cache (L1P) is a 4K-byte direct-mapped cache and the Level 1 data cache (L1D) is a 4K-byte 2-way set-associative cache. The Level 2 memory/cache (L2) consists of a 256K-byte memory space that is shared between program and data space. 64K bytes of the 256K bytes in L2 memory can be configured as mapped memory, cache, or combinations of the two. The remaining 192K bytes in L2 serves as mapped SRAM.

The C6713B has a rich peripheral set that includes two Multichannel Audio Serial Ports (McASPs), two Multichannel Buffered Serial Ports (McBSPs), two Inter-Integrated Circuit (I2C) buses, one dedicated General-Purpose Input/Output (GPIO) module, two general-purpose timers, a host-port interface (HPI), and a glueless external memory interface (EMIF) capable of interfacing to SDRAM, SBSRAM, and asynchronous peripherals.

The two McASP interface modules each support one transmit and one receive clock zone. Each of the McASP has eight serial data pins which can be individually allocated to any of the two zones. The serial port supports time-division multiplexing on each pin from 2 to 32 time slots. The C6713B has sufficient bandwidth to support all 16 serial data pins transmitting a 192 kHz stereo signal. Serial data in each zone may be transmitted and received on multiple serial data pins simultaneously and formatted in a multitude of variations on the Philips Inter-IC Sound (I2S) format.

In addition, the McASP transmitter may be programmed to output multiple S/PDIF, IEC60958, AES-3, CP-430 encoded data channels simultaneously, with a single RAM containing the full implementation of user data and channel status fields.

The McASP also provides extensive error-checking and recovery features, such as the bad clock detection circuit for each high-frequency master clock which verifies that the master clock is within a programmed frequency range.

The two I2C ports on the TMS320C6713B allow the DSP to easily control peripheral devices and communicate with a host processor. In addition, the standard multichannel buffered serial port (McBSP) may be used to communicate with serial peripheral interface (SPI) mode peripheral devices.

The TMS320C6713B device has two bootmodes: from the HPI or from external asynchronous ROM. For more detailed information, see the bootmode section of this data sheet.

The TMS320C67x DSP generation is supported by the TI eXpressDSP™ set of industry benchmark development tools, including a highly optimizing C/C++ Compiler, the Code Composer Studio™ Integrated Development Environment (IDE), JTAG-based emulation and real-time debugging, and the DSP/BIOS™ kernel.

The TMS320C67x™ DSPs (including the TMS320C6713B device) compose the floating-point DSP generation in the TMS320C6000™ DSP platform. The C6713B device is based on the high-performance, advanced very-long-instruction-word (VLIW) architecture developed by Texas Instruments (TI), making this DSP an excellent choice for multichannel and multifunction applications.

Operating at 225 MHz, the C6713B delivers up to 1350 million floating-point operations per second (MFLOPS), 1800 million instructions per second (MIPS), and with dual fixed-/floating-point multipliers up to 450 million multiply-accumulate operations per second (MMACS).

Operating at 300 MHz, the C6713B delivers up to 1800 million floating-point operations per second (MFLOPS), 2400 million instructions per second (MIPS), and with dual fixed-/floating-point multipliers up to 600 million multiply-accumulate operations per second (MMACS).

The C6713B uses a two-level cache-based architecture and has a powerful and diverse set of peripherals. The Level 1 program cache (L1P) is a 4K-byte direct-mapped cache and the Level 1 data cache (L1D) is a 4K-byte 2-way set-associative cache. The Level 2 memory/cache (L2) consists of a 256K-byte memory space that is shared between program and data space. 64K bytes of the 256K bytes in L2 memory can be configured as mapped memory, cache, or combinations of the two. The remaining 192K bytes in L2 serves as mapped SRAM.

The C6713B has a rich peripheral set that includes two Multichannel Audio Serial Ports (McASPs), two Multichannel Buffered Serial Ports (McBSPs), two Inter-Integrated Circuit (I2C) buses, one dedicated General-Purpose Input/Output (GPIO) module, two general-purpose timers, a host-port interface (HPI), and a glueless external memory interface (EMIF) capable of interfacing to SDRAM, SBSRAM, and asynchronous peripherals.

The two McASP interface modules each support one transmit and one receive clock zone. Each of the McASP has eight serial data pins which can be individually allocated to any of the two zones. The serial port supports time-division multiplexing on each pin from 2 to 32 time slots. The C6713B has sufficient bandwidth to support all 16 serial data pins transmitting a 192 kHz stereo signal. Serial data in each zone may be transmitted and received on multiple serial data pins simultaneously and formatted in a multitude of variations on the Philips Inter-IC Sound (I2S) format.

In addition, the McASP transmitter may be programmed to output multiple S/PDIF, IEC60958, AES-3, CP-430 encoded data channels simultaneously, with a single RAM containing the full implementation of user data and channel status fields.

The McASP also provides extensive error-checking and recovery features, such as the bad clock detection circuit for each high-frequency master clock which verifies that the master clock is within a programmed frequency range.

The two I2C ports on the TMS320C6713B allow the DSP to easily control peripheral devices and communicate with a host processor. In addition, the standard multichannel buffered serial port (McBSP) may be used to communicate with serial peripheral interface (SPI) mode peripheral devices.

The TMS320C6713B device has two bootmodes: from the HPI or from external asynchronous ROM. For more detailed information, see the bootmode section of this data sheet.

The TMS320C67x DSP generation is supported by the TI eXpressDSP™ set of industry benchmark development tools, including a highly optimizing C/C++ Compiler, the Code Composer Studio™ Integrated Development Environment (IDE), JTAG-based emulation and real-time debugging, and the DSP/BIOS™ kernel.

open-in-new 查找其它 数字信号处理器 (DSP)
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Limited design support from TI available

This product has limited design support from TI for existing projects. If available, you will find relevant collateral, software and tools in the product folder. For existing designs using this product, you can request support in the TI E2ETM support forums, but limited support is available for this product.

技术文档

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类型 标题 下载最新的英文版本 日期
* 数据表 TMS320C6713B Floating-Point Digital Signal Processor 数据表 (Rev. B) 2006年 6月 30日
* 勘误表 TMS320C6713, TMS320C6713B DSPs Silicon Errata (Silicon Revisions 2.0, 1.1) (Rev. J) 2005年 8月 12日
应用手册 如何将 CCS 3.x 工程迁移至最新的 Code Composer Studio™ (CCS) (Rev. A) 下载英文版本 (Rev.A) 2021年 5月 19日
技术文章 Bringing the next evolution of machine learning to the edge 2018年 11月 27日
技术文章 How quality assurance on the Processor SDK can improve software scalability 2018年 8月 22日
更多文献资料 Chip support library 2016年 9月 9日
技术文章 Clove: Low-Power video solutions based on Sitara™ AM57x processors 2016年 7月 21日
技术文章 Spring has sprung. A sale has sprung. 2016年 4月 4日
应用手册 Power Consumption Guide for the C66x 2011年 10月 6日
用户指南 TMS320C6000 DSP Peripherals Overview Reference Guide (Rev. Q) 2009年 7月 2日
用户指南 TMS320C6000 DSP Multichannel Audio Serial Port (McASP) Reference Guide (Rev. J) 2008年 11月 20日
应用手册 Thermal Considerations Application Report 2007年 5月 20日
用户指南 TMS320C6000 DSP External Memory Interface (EMIF) Reference Guide (Rev. E) 2007年 4月 11日
用户指南 TMS320C6000 DSP Inter-Integrated Circuit (I2C) Module Reference Guide (Rev. D) 2007年 3月 26日
用户指南 TMS320C6000 DSP Multichannel Buffered Serial Port ( McBSP) Reference Guide (Rev. G) 2006年 12月 14日
用户指南 TMS320C6000 DSP Enhanced Direct Memory Access (EDMA) Controller Reference Guide (Rev. C) 2006年 11月 15日
用户指南 TMS320C67x/C67x+ DSP CPU and Instruction Set Reference Guide (Rev. A) 2006年 11月 7日
用户指南 TMS320C6000 DSP Host-Post Interface (HPI) Reference Guide (Rev. C) 2006年 1月 1日
应用手册 Migrating from TMS320C6211B/C6711/C6711B and C6713 to TMS320C6713B (Rev. H) 2005年 11月 11日
用户指南 TMS320C6000 DSP Power-Down Logic and Modes Reference Guide (Rev. C) 2005年 3月 1日
用户指南 TMS320C6000 DSP 32-bit Timer Reference Guide (Rev. B) 2005年 1月 25日
用户指南 TMS320C6000 DSP Software-Programmable Phase-Locked Loop (PLL) Controller RG (Rev. C) 2004年 8月 2日
用户指南 TMS320C621x/C671x DSP Two Level Internal Memory Reference Guide (Rev. B) 2004年 6月 8日
应用手册 TMS320C6711D, C6712D, C6713B Power Consumption Summary (Rev. A) 2004年 5月 31日
用户指南 TMS320C6000 DSP General-Purpose Input/Output (GPIO) Reference Guide (Rev. A) 2004年 3月 25日
应用手册 TMS320C6000 EDMA IO Scheduling and Performance 2004年 3月 5日
应用手册 TMS320C621x/671x EDMA Performance Data 2004年 3月 5日
应用手册 TMS320C621x/TMS320C671x EDMA Architecture 2004年 3月 5日

设计与开发

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Blackhawk XDS560v2 System Trace 通过 MIPI HSPT 60 引脚连接器（带有适合 TI 14 引脚、TI 20 引脚和 ARM 20 (...)

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Spectrum Digital XDS560v2 System Trace 通过 MIPI HSPT 60 引脚连接器（适合 TI 14 引脚、TI 20 引脚、ARM 20 引脚和 TI 60 (...)

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MATHLIB — 用于浮点器件的 DSP 数学函数库

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驱动程序或库

SPRC265 — TMS320C6000 DSP 库 (DSPLIB)

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仿真模型

C6713B GDP IBIS Model (Rev. B)

SPRM142B.ZIP (81 KB) - IBIS Model
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仿真模型

C6713B PYP IBIS Model (Rev. B)

SPRM143B.ZIP (80 KB) - IBIS Model
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仿真模型

C6713B GDP BSDL Model

SPRM214.ZIP (6 KB) - BSDL Model
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设计工具

PROCESSORS-3P-SEARCH — Arm-based MPU, arm-based MCU and DSP third-party search tool

TI has partnered with companies to offer a wide range of software, tools, and SOMs using TI processors to accelerate your path to production. Download this search tool to quickly browse our third-party solutions and find the right third-party to meet your needs. The software, tools and modules (...)
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(PYP) 208 了解详情
BGA (GDP) 272 了解详情
BGA (ZDP) 272 了解详情

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包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/FIT 估算
  • 材料成分
  • 认证摘要
  • 持续可靠性监测

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