361-pin (ZWT) package image

TMS320C6424ZWT5 正在供货

C64x+ 定点 DSP- 高达 600MHz、16/8 位 EMIFA、32/16 位 DDR2、SDRAM

定价

数量 价格
+

质量信息

等级 Catalog
RoHS
REACH
引脚镀层/焊球材料 SNAGCU
MSL 等级/回流焊峰值温度 Level-3-260C-168 HR
质量、可靠性
和封装信息

包含信息:

  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
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更多制造信息

包含信息:

  • 制造厂地点
  • 封装厂地点
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出口管制分类

*仅供参考

  • 美国 ECCN:3A991A2

封装信息

封装 | 引脚 NFBGA (ZWT) | 361
工作温度范围 (°C) 0 to 0
包装数量 | 包装 90 | JEDEC TRAY (5+1)

TMS320C6424 的特性

  • High-Performance Digital Signal Processor (C6424)
    • 2.5-, 2-, 1.67, 1.43-ns Instruction Cycle Time
    • 400-, 500-, 600-MHz C64x+™ Clock Rate
    • Eight 32-Bit C64x+ Instructions/Cycle
    • 3200, 4000, 4800, 5600 MIPS
    • Fully Software-Compatible With C64x
    • Commercial and Automotive (Q or S suffix)Grades
    • Low-Power Device (L suffix)
  • VelociTI.2™ Extensions to VelociTI™ Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
    • Eight Highly Independent Functional Units With VelociTI.2 Extensions:
      • Six ALUs (32-/40-Bit), Each Supports Single 32-Bit, Dual 16-Bit, or Quad 8-Bit Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-Bit Multiplies (16-Bit Results) per Clock Cycle
    • Load-Store Architecture With Non-Aligned Support
    • 64 32-Bit General-Purpose Registers
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
    • Additional C64x+™ Enhancements
      • Protected Mode Operation
      • Exceptions Support for Error Detection and Program Redirection
      • Hardware Support for Modulo Loop Auto-Focus Module Operation
  • C64x+ Instruction Set Features
    • Byte-Addressable (8-/16-/32-/64-Bit Data)
    • 8-Bit Overflow Protection
    • Bit-Field Extract, Set, Clear
    • Normalization, Saturation, Bit-Counting
    • VelociTI.2 Increased Orthogonality
    • C64x+ Extensions
      • Compact 16-bit Instructions
      • Additional Instructions to Support Complex Multiplies
  • C64x+ L1/L2 Memory Architecture
    • 256K-Bit (32K-Byte) L1P Program RAM/Cache [Flexible Allocation]
    • 640K-Bit (80K-Byte) L1D Data RAM/Cache [Flexible Allocation]
    • 1M-Bit (128K-Byte) L2 Unified Mapped RAM/Cache [Flexible Allocation]
  • Endianess: Supports Both Little Endian and Big Endian
  • External Memory Interfaces (EMIFs)
    • 32-Bit DDR2 SDRAM Memory Controller With 256M-Byte Address Space (1.8-V I/O)
      • Supports up to 333-MHz (data rate) bus and interfaces to DDR2-400 SDRAM
    • Asynchronous 16-Bit Wide EMIF (EMIFA) With up to 128M-Byte Address Reach
      • Flash Memory Interfaces
        • NOR (8-/16-Bit-Wide Data)
        • NAND (8-/16-Bit-Wide Data)
  • Enhanced Direct-Memory-Access (EDMA) Controller (64 Independent Channels)
  • Two 64-Bit General-Purpose Timers (Each Configurable as Two 32-Bit Timers)
  • One 64-Bit Watch Dog Timer
  • Two UARTs (One with RTS and CTS Flow Control)
  • Master/Slave Inter-Integrated Circuit (I2C Bus™)
  • Two Multichannel Buffered Serial Ports (McBSPs)
    • I2S and TDM
    • AC97 Audio Codec Interface
    • SPI
    • Standard Voice Codec Interface (AIC12)
    • Telecom Interfaces - ST-Bus, H-100
    • 128 Channel Mode
  • Multichannel Audio Serial Port (McASP0)
    • Four Serializers and SPDIF (DIT) Mode
  • 16-Bit Host-Port Interface (HPI)
  • 32-Bit 33-MHz, 3.3-V Peripheral Component Interconnect (PCI) Master/Slave Interface
  • 10/100 Mb/s Ethernet MAC (EMAC)
    • IEEE 802.3 Compliant
    • Supports Multiple Media Independent Interfaces (MII, RMII)
    • Management Data Input/Output (MDIO) Module
  • VLYNQ™ Interface (FPGA Interface)
  • Three Pulse Width Modulator (PWM) Outputs
  • On-Chip ROM Bootloader
  • Individual Power-Savings Modes
  • Flexible PLL Clock Generators
  • IEEE-1149.1 (JTAG™) Boundary-Scan-Compatible
  • Up to 111 General-Purpose I/O (GPIO) Pins (Multiplexed With Other Device Functions)
  • Packages:
    • 361-Pin Pb-Free PBGA Package (ZWT Suffix), 0.8-mm Ball Pitch
    • 376-Pin Plastic BGA Package (ZDU Suffix), 1.0-mm Ball Pitch
  • 0.09-µm/6-Level Cu Metal Process (CMOS)
  • 3.3-V and 1.8-V I/O, 1.2-V Internal (-7/-6/-5/-4/-Q6/-Q5/-Q4)
  • 3.3-V and 1.8-V I/O, 1.05-V Internal (-7/-6/-5/-4/-L/-Q5)
  • APPLICATIONS
    • Telecom
    • Audio
    • Industrial Applications
  • Community Reesources

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TMS320C6424 的说明

The TMS320C64x+™ DSPs (including the TMS320C6424 device) are the highest-performance fixed-point DSP generation in the TMS320C6000™ DSP platform. The C6424 device is based on the third-generation high-performance, advanced VelociTI™ very-long-instruction-word (VLIW) architecture developed by Texas Instruments (TI), making these DSPs an excellent choice for digital signal processor applications. The C64x+™ devices are upward code-compatible from previous devices that are part of the C6000™ DSP platform. The C64x™ DSPs support added functionality and have an expanded instruction set from previous devices.

Any reference to the C64x DSP or C64x CPU also applies, unless otherwise noted, to the C64x+ DSP and C64x+ CPU, respectively.

With performance of up to 4800 million instructions per second (MIPS) at a clock rate of 600 MHz, the C64x+ core offers solutions to high-performance DSP programming challenges. The DSP core possesses the operational flexibility of high-speed controllers and the numerical capability of array processors. The C64x+ DSP core processor has 64 general-purpose registers of 32-bit word length and eight highly independent functional units-two multipliers for a 32-bit result and six arithmetic logic units (ALUs). The eight functional units include instructions to accelerate the performance in telecom, audio, and industrial applications. The DSP core can produce four 16-bit multiply-accumulates (MACs) per cycle for a total of 2400 million MACs per second (MMACS), or eight 8-bit MACs per cycle for a total of 4800 MMACS. For more details on the C64x+ DSP, see the TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide (literature number SPRU732).

The C6424 also has application-specific hardware logic, on-chip memory, and additional on-chip peripherals similar to the other C6000 DSP platform devices. The C6424 core uses a two-level cache-based architecture. The Level 1 program memory/cache (L1P) consists of a 256K-bit memory space that can be configured as mapped memory or direct mapped cache, and the Level 1 data (L1D) consists of a 640K-bit memory space–384K-bit of which is mapped memory and 256K-bit of which can be configured as mapped memory or 2-way set-associative cache. The Level 2 memory/cache (L2) consists of a 1M-bit memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two.

The peripheral set includes: a 10/100 Mb/s Ethernet MAC (EMAC) with a management data input/output (MDIO) module; a 4-bit transmit, 4-bit receive VLYNQ interface; an inter-integrated circuit (I2C) Bus interface; two multichannel buffered serial ports (McBSPs); a multichannel audio serial port (McASP0) with 4 serializers; 2 64-bit general-purpose timers each configurable as 2 independent 32-bit timers; 1 64-bit watchdog timer; a user-configurable 16-bit host-port interface (HPI); up to 111-pins of general-purposeinput/output (GPIO) with programmable interrupt/event generation modes, multiplexed with other peripherals; 2 UARTs with hardware handshaking support on 1 UART; 3 pulse width modulator (PWM) peripherals; 1 peripheral component interconnect (PCI) [33 MHz]; and 2 glueless external memory interfaces: an asynchronous external memory interface (EMIFA) for slower memories/peripherals, and a higher speed synchronous memory interface for DDR2.

The Ethernet Media Access Controller (EMAC) provides an efficient interface between the C6424 and the network. The C6424 EMAC supports 10Base-T and 100Base-TX, or 10 Mbits/second (Mbps) and 100 Mbps in either half- or full-duplex mode, with hardware flow control and quality of service (QOS) support.

The Management Data Input/Output (MDIO) module continuously polls all 32 MDIO addresses in order to enumerate all PHY devices in the system.

The I2C and VLYNQ ports allow C6424 to easily control peripheral devices and/or communicate with host processors.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each of the peripherals, see the related sections later in this document and the associated peripheral reference guides.

The C6424 has a complete set of development tools. These include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows™ debugger interface for visibility into source code execution.

定价

数量 价格
+

包装方式

您可以根据器件数量选择不同的包装方式,包括完整卷带、定制卷带、剪切带、管装或托盘。

定制卷带是从整盘卷带上剪下来的具有连续长度的剪切带,是一种可以对特定数量提供产品批次及生产日期跟踪的包装方式。根据行业标准,使用黄铜垫片在剪切带两端各连接一个 18 英寸的引带和尾带,以直接送入自动组装机。涉及定制卷带的 TI 订单将包含卷带费用。

剪切带是从整盘卷带上剪下来的特定长度的编带。根据所申请器件数量的不同,TI 可能会使用多条剪切带或多个盒子进行包装。

TI 通常会根据库存情况选择将管装托盘器件以盒装或者管装或托盘形式发货。所有器件均会按照 TI 内部规定的静电放电和湿敏等级保护要求进行包装。

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可提供批次和生产日期代码选项

您可在购物车中添加器件数量以开始结算流程,并查看现有库存中可选择批次或生产日期代码的选项。

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