产品详情

Iout (typ) (A) 0.05 Vs (min) (V) 4 Vs (max) (V) 40 Operating temperature range (°C) -55 to 125 Rating Automotive, Catalog
Iout (typ) (A) 0.05 Vs (min) (V) 4 Vs (max) (V) 40 Operating temperature range (°C) -55 to 125 Rating Automotive, Catalog
SOIC (D) 8 29.4 mm² 4.9 x 6 SOP (PS) 8 48.36 mm² 6.2 x 7.8 TO-92 (LP) 3 19.136 mm² 5.2 x 3.68
  • 2.5-V Virtual Ground for 5-V/GND Analog Systems
  • High Output-Current Capability Sink or Source . . . 20 mA Typ
  • Micropower Operation . . . 170 uA Typ
  • Excellent Regulation Characteristics
    • Output Regulation
         –45 uV Typ at IO = 0 to –10 mA
         +15 uV Typ at IO = 0 to +10 mA
    • Input Regulation = 1.5 uV/V Typ
  • Low-Impedance Output . . . 0.0075 Typ
  • Macromodel Included

  • 2.5-V Virtual Ground for 5-V/GND Analog Systems
  • High Output-Current Capability Sink or Source . . . 20 mA Typ
  • Micropower Operation . . . 170 uA Typ
  • Excellent Regulation Characteristics
    • Output Regulation
         –45 uV Typ at IO = 0 to –10 mA
         +15 uV Typ at IO = 0 to +10 mA
    • Input Regulation = 1.5 uV/V Typ
  • Low-Impedance Output . . . 0.0075 Typ
  • Macromodel Included

In signal-conditioning applications using a single power source, a reference voltage is required for termination of all signal grounds. To accomplish this, engineers have typically used solutions consisting of resistors, capacitors, operational amplifiers, and voltage references. Texas Instruments has eliminated all of those components with one easy-to-use 3-terminal device. That device is the TLE2425 precision virtual ground.

Use of the TLE2425 over other typical circuit solutions gives the designer increased dynamic signal range, improved signal-to-noise ratio, lower distortion, improved signal accuracy, and easier interfacing to ADCs and DACs. These benefits are the result of combining a precision micropower voltage reference and a high-performance precision operational amplifier in a single silicon chip. It is the precision and performance of these two circuit functions together that yield such dramatic system-level performance.

The TLE2425 improves input regulation as well as output regulation and, in addition, reduces output impedance and power dissipation in a majority of virtual-ground-generation circuits. Both input regulation and load regulation exceed 12 bits of accuracy on a single 5-V system. Signal-conditioning front ends of data acquisition systems that push 12 bits and beyond can use the TLE2425 to eliminate a major source of system error.

In signal-conditioning applications using a single power source, a reference voltage is required for termination of all signal grounds. To accomplish this, engineers have typically used solutions consisting of resistors, capacitors, operational amplifiers, and voltage references. Texas Instruments has eliminated all of those components with one easy-to-use 3-terminal device. That device is the TLE2425 precision virtual ground.

Use of the TLE2425 over other typical circuit solutions gives the designer increased dynamic signal range, improved signal-to-noise ratio, lower distortion, improved signal accuracy, and easier interfacing to ADCs and DACs. These benefits are the result of combining a precision micropower voltage reference and a high-performance precision operational amplifier in a single silicon chip. It is the precision and performance of these two circuit functions together that yield such dramatic system-level performance.

The TLE2425 improves input regulation as well as output regulation and, in addition, reduces output impedance and power dissipation in a majority of virtual-ground-generation circuits. Both input regulation and load regulation exceed 12 bits of accuracy on a single 5-V system. Signal-conditioning front ends of data acquisition systems that push 12 bits and beyond can use the TLE2425 to eliminate a major source of system error.

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* 数据表 Precision Virtual Grounds 数据表 (Rev. D) 2002年 4月 30日

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包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

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