TIBPAL16R8-7M
- High-Performance Operation:
- fmax (no feedback)
TIBPAL16R' -5C Series . . . 125 MHz Min
TIBPAL16R' - 7M Series . . . 100 MHz Min - fmax (internal feedback)
TIBPAL16R' -5C Series . . . 125 MHz Min
TIBPAL16R' -7M Series . . . 100 MHz Min - fmax (external feedback)
TIBPAL16R' -5C Series . . . 117 MHz Min
TIBPAL16R' - 7M Series . . . 74 MHz Min - Propagation Delay
TIBPAL16L8-5C Series . . . 5 ns Max
TIBPAL16L8-7M Series . . . 7 ns Max
TIBPAL16R' -5C Series (CLK-to-Q) . . . 4 ns Max
TIBPAL16R' -7M Series (CLK-to-Q) . . . 6.5 ns Max
- fmax (no feedback)
- Functionally Equivalent, but Faster than, Existing 20-Pin PLDs
- Preload Capability on Output Registers Simplifies Testing
- Power-Up Clear on Registered Devices (All Register Outputs are Set Low, but Voltage Levels at the Output Pins Go High)
- Package Options Include Both Plastic and Ceramic Chip Carriers in Addition to Plastic and Ceramic DIPs
- Security Fuse Prevents Duplication
DEVICE | I INPUTS | 3-STATE O OUTPUTS | REGISTERED Q OUTPUTS | I/O PORT S | |||||
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These devices are covered by U.S. Patent 4,410,987.
IMPACT-X is a trademark of Texas Instruments Incorporated.
PAL is a registered trademark of Advanced Micro Devices Inc.
These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACT-XTM circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board.
The TIBPAL16' C series is characterized from 0°C to 75°C. The TIBPAL16' M series is characterized for operation over the full military temperature range of -55°C to 125°C.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | High-Performance Impact-X Programmable Array Logic Circuits 数据表 (Rev. D) | 1992年 9月 1日 | |||
* | SMD | TIBPAL16R8-7M SMD 5962-85155 | 2016年 6月 21日 |
设计和开发
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订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点