TAS5352
- Total Power Output (Bridge Tied Load)
- 2 × 125 W at 10% THD+N Into 4
- Total Power Output (Single Ended)
- 4 × 45 W at 10% THD+N Into 3
- Total Power Output (Parallel Mode)
- 1 × 250 W at 10% THD+N Into 2
- >110 dB SNR (A-Weighted With TAS5518 Modulator)
- <0.1% THD+N (1 W, 1 kHz)
- Supports PWM Frame Rates of 192 kHz to 432 kHz
- Resistor-Programmable Current Limit
- Integrated Self-Protection Circuitry, Including:
- Under Voltage Protection
- Overtemperature Warning and Error
- Overload Protection
- Short-Circuit Protection
- PWM Activity Detector
- Standalone Protection Recovery
- Power-On Reset (POR) to Eliminate System Power-Supply Sequencing
- High-Efficiency Power Stage (>90%) With 80-m Output MOSFETs
- Thermally Enhanced 44-Pin HTSSOP Package (DDV)
- Error Reporting, 3.3-V and 5.0-V Compliant
- EMI Compliant When Used With Recommended System Design
- APPLICATIONS
- Mini/Micro Audio System
- DVD Receiver
- Home Theater
PurePath Digital, PowerPad are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
The TAS5352 is a high-performance, integrated stereo digital amplifier power stage designed to drive a 4- bridge-tied load (BTL) at up to 125 W per channel with low harmonic distortion, low integrated noise, and low idle current.
The TAS5352 has a complete protection system integrated on-chip, safeguarding the device against a wide range of fault conditions that could damage the system. These protection features are short-circuit protection, over-current protection, under voltage protection, over temperature protection, and a loss of PWM signal (PWM activity detector).
A power-on-reset (POR) circuit is used to eliminate power-supply sequencing that is required for most power-stage designs.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | 125 W STEREO DIGITAL AMPLIFIER POWER STAGE 数据表 (Rev. A) | 2007年 10月 18日 |
设计和开发
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封装 | 引脚 | 下载 |
---|---|---|
HTSSOP (DDV) | 44 | 查看选项 |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点