SN75LBC031
- SN75LBC031 Meets Standard ISO/DIS 11898 (up to 500 k Baud)
- Driver Output Capability at 50 mA
- Wide Positive and Negative Input/output Bus Voltage Range
- Bus Outputs Short-Circuit-Protected to Battery Voltage and Ground
- Thermal Shutdown
- Available in Q-Temp Automotive
- HighRel Automotive Applications
- Configuration Control/Print Support
- Qualification to Automotive Standards
The SN75LBC031 is a CAN transceiver used as an interface between a CAN controller and the physical bus for high speed applications of up to 500 kBaud. The device provides transmit capability to the differential bus and differential receive capability to the controller. The transmitter outputs (CANH and CANL), feature internal transition regulation to provide controlled symmetry resulting in low EMI emissions. Both transmitter outputs are fully protected against battery short circuits and electrical transients that can occur on the bus lines. In the event of excessive device power dissipation the output drivers are disabled by the thermal shutdown circuitry at a junction temperature of approximately 160°C. The inclusion of an internal pullup resistor on the transmitter input ensures a defined output during power up and protocol controller reset. For normal operation at 500 kBaud the ASC terminal is open or tied to GND. For slower speed operation at 125 kBaud the bus output transition times can be increased to reduce EMI by connecting the ASC terminal to VCC. The receiver includes an integrated filter that suppresses the signal into pulses less than 30 ns wide.
The SN75LBC031 is characterized for operation from -40°C to 85°C. The SN65LBC031 is characterized for operation from -40°C to 125°C. The SN65LBC031Q is characterized for operation over the automotive temperature range of -40°C to 125°C.
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技术文档
| 类型 | 标题 | 下载最新的英语版本 | 日期 | |||
|---|---|---|---|---|---|---|
| * | 数据表 | High Speed Controller Area Network (CAN) Transceivers 数据表 (Rev. A) | 2000年 4月 25日 |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点