产品详情

Technology family HCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 8 IOL (max) (mA) 6 IOH (max) (mA) -6 Supply current (max) (µA) 80 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Input clamp diode, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 85
Technology family HCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 8 IOL (max) (mA) 6 IOH (max) (mA) -6 Supply current (max) (µA) 80 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Input clamp diode, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 85
PDIP (N) 20 228.702 mm² 24.33 x 9.4 SOIC (DW) 20 131.84 mm² 12.8 x 10.3
  • Operating Voltage Range of 4.5 V to 5.5 V
  • Low Power Consumption, 80-µA Max ICC
  • Typical tpd = 12 ns
  • ±6-mA Output Drive at 5 V
  • Low Input Current of 1 µA Max
  • Inputs Are TTL-Voltage Compatible
  • High-Current 3-State Outputs Interface Directly With System Bus or Can Drive Up To 15 LSTTL Loads
  • Data Flow-Through Pinout (All Inputs on Opposite Side From Outputs)

  • Operating Voltage Range of 4.5 V to 5.5 V
  • Low Power Consumption, 80-µA Max ICC
  • Typical tpd = 12 ns
  • ±6-mA Output Drive at 5 V
  • Low Input Current of 1 µA Max
  • Inputs Are TTL-Voltage Compatible
  • High-Current 3-State Outputs Interface Directly With System Bus or Can Drive Up To 15 LSTTL Loads
  • Data Flow-Through Pinout (All Inputs on Opposite Side From Outputs)

These octal buffers and line drivers are designed to have the performance of the ’HCT240 devices and a pinout with inputs and outputs on opposite sides of the package. This arrangement greatly facilitates printed circuit board layout.

The 3-state control gate is a 2-input NOR. If either output-enable (OE1\ or OE2\) input is high, all eight outputs are in the high-impedance state. The ’HCT540 devices provide inverted data at the outputs.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

These octal buffers and line drivers are designed to have the performance of the ’HCT240 devices and a pinout with inputs and outputs on opposite sides of the package. This arrangement greatly facilitates printed circuit board layout.

The 3-state control gate is a 2-input NOR. If either output-enable (OE1\ or OE2\) input is high, all eight outputs are in the high-impedance state. The ’HCT540 devices provide inverted data at the outputs.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

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CD74HCT240 正在供货 具有 TTL 兼容型 CMOS 输入和三态输出的 8 通道 4.5V 至 5.5V 反相器 Voltage range (4.5V to 5.5V), average drive strength (4mA), average propagation delay (22ns)

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类型 标题 下载最新的英语版本 日期
* 数据表 SN54HCT540, SN74HCT540 数据表 (Rev. C) 2003年 3月 18日
应用手册 Implications of Slow or Floating CMOS Inputs (Rev. E) 2021年 7月 26日
选择指南 Logic Guide (Rev. AB) 2017年 6月 12日
应用手册 Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
选择指南 逻辑器件指南 2014 (Rev. AA) 最新英语版本 (Rev.AB) 2014年 11月 17日
用户指南 LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
应用手册 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
用户指南 Signal Switch Data Book (Rev. A) 2003年 11月 14日
应用手册 TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
应用手册 CMOS Power Consumption and CPD Calculation (Rev. B) 1997年 6月 1日
应用手册 使用逻辑器件进行设计 (Rev. C) 1997年 6月 1日
应用手册 SN54/74HCT CMOS Logic Family Applications and Restrictions 1996年 5月 1日
应用手册 Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc 1996年 4月 1日

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用户指南: PDF | HTML
英语版 (Rev.B): PDF | HTML
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仿真模型

SN74HCT540 Behavioral SPICE Model

SCLM196.ZIP (7 KB) - PSpice Model
封装 引脚 下载
PDIP (N) 20 查看选项
SOIC (DW) 20 查看选项

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

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