产品详情

Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 8 IOL (max) (mA) 64 IOH (max) (mA) -50 Input type TTL-Compatible CMOS Output type 3-State Features Partial power down (Ioff), Very high speed (tpd 5-10ns) Technology family BCT Rating Catalog Operating temperature range (°C) 0 to 70
Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 8 IOL (max) (mA) 64 IOH (max) (mA) -50 Input type TTL-Compatible CMOS Output type 3-State Features Partial power down (Ioff), Very high speed (tpd 5-10ns) Technology family BCT Rating Catalog Operating temperature range (°C) 0 to 70
SOIC (DW) 24 159.65 mm² 15.5 x 10.3
  • Members of the Texas Instruments SCOPETM Family of Testability Products
  • Octal Test-Integrated Circuits
  • Functionally Equivalent to 'F240 and 'BCT240 in the Normal-Function Mode
  • Compatible With the IEEE Standard 1149.1-1990 (JTAG) Test Access Port and Boundary-Scan Architecture
  • Test Operation Synchronous to Test Access Port (TAP)
  • Implement Optional Test Reset Signal by Recognizing a Double-High-Level Voltage (10 V) on TMS Pin
  • SCOPETM Instruction Set
    • IEEE Standard 1149.1-1990 Required Instructions, Optional INTEST, CLAMP, and HIGHZ
    • Parallel-Signature Analysis at Inputs
    • Pseudo-Random Pattern Generation From Outputs
    • Sample Inputs/Toggle Outputs
  • Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), and Standard Plastic and Ceramic 300-mil DIPs (JT, NT)

    SCOPE is a trademark of Texas Instruments Incorporated.


  • Members of the Texas Instruments SCOPETM Family of Testability Products
  • Octal Test-Integrated Circuits
  • Functionally Equivalent to 'F240 and 'BCT240 in the Normal-Function Mode
  • Compatible With the IEEE Standard 1149.1-1990 (JTAG) Test Access Port and Boundary-Scan Architecture
  • Test Operation Synchronous to Test Access Port (TAP)
  • Implement Optional Test Reset Signal by Recognizing a Double-High-Level Voltage (10 V) on TMS Pin
  • SCOPETM Instruction Set
    • IEEE Standard 1149.1-1990 Required Instructions, Optional INTEST, CLAMP, and HIGHZ
    • Parallel-Signature Analysis at Inputs
    • Pseudo-Random Pattern Generation From Outputs
    • Sample Inputs/Toggle Outputs
  • Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), and Standard Plastic and Ceramic 300-mil DIPs (JT, NT)

    SCOPE is a trademark of Texas Instruments Incorporated.


The 'BCT8240A scan test devices with octal buffers are members of the Texas Instruments SCOPETM testability integrated-circuit family. This family of devices supports IEEE Standard 1149.1-1990 boundary scan to facilitate testing of complex circuit-board assemblies. Scan access to the test circuitry is accomplished via the 4-wire test access port (TAP) interface.

In the normal mode, these devices are functionally equivalent to the 'F240 and 'BCT240 octal buffers. The test circuitry can be activated by the TAP to take snapshot samples of the data appearing at the device terminals or to perform a self test on the boundary-test cells. Activating the TAP in normal mode does not affect the functional operation of the SCOPETM octal buffers.

In the test mode, the normal operation of the SCOPETM octal buffers is inhibited and the test circuitry is enabled to observe and control the I/O boundary of the device. When enabled, the test circuitry can perform boundary-scan test operations, as described in IEEE Standard 1149.1-1990.

 

Four dedicated test terminals control the operation of the test circuitry: test data input (TDI), test data output (TDO), test mode select (TMS), and test clock (TCK). Additionally, the test circuitry performs other testing functions such as parallel-signature analysis (PSA) on data inputs and pseudo-random pattern generation (PRPG) from data outputs. All testing and scan operations are synchronized to the TAP interface.

The SN54BCT8240A is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74BCT8240A is characterized for operation from 0°C to 70°C.

 

 

The 'BCT8240A scan test devices with octal buffers are members of the Texas Instruments SCOPETM testability integrated-circuit family. This family of devices supports IEEE Standard 1149.1-1990 boundary scan to facilitate testing of complex circuit-board assemblies. Scan access to the test circuitry is accomplished via the 4-wire test access port (TAP) interface.

In the normal mode, these devices are functionally equivalent to the 'F240 and 'BCT240 octal buffers. The test circuitry can be activated by the TAP to take snapshot samples of the data appearing at the device terminals or to perform a self test on the boundary-test cells. Activating the TAP in normal mode does not affect the functional operation of the SCOPETM octal buffers.

In the test mode, the normal operation of the SCOPETM octal buffers is inhibited and the test circuitry is enabled to observe and control the I/O boundary of the device. When enabled, the test circuitry can perform boundary-scan test operations, as described in IEEE Standard 1149.1-1990.

 

Four dedicated test terminals control the operation of the test circuitry: test data input (TDI), test data output (TDO), test mode select (TMS), and test clock (TCK). Additionally, the test circuitry performs other testing functions such as parallel-signature analysis (PSA) on data inputs and pseudo-random pattern generation (PRPG) from data outputs. All testing and scan operations are synchronized to the TAP interface.

The SN54BCT8240A is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74BCT8240A is characterized for operation from 0°C to 70°C.

 

 

下载 观看带字幕的视频 视频

您可能感兴趣的相似产品

open-in-new 比较替代产品
功能与比较器件相同且具有相同引脚
SN74AHCT245 正在供货 具有三态输出的八通道总线收发器 Larger voltage range (2V to 5.5V)

技术文档

star =有关此产品的 TI 精选热门文档
未找到结果。请清除搜索并重试。
查看全部 14
类型 标题 下载最新的英语版本 日期
* 数据表 Scan Test Devices With Octal Inverting Buffers 数据表 (Rev. E) 1996年 12月 1日
应用手册 Implications of Slow or Floating CMOS Inputs (Rev. E) 2021年 7月 26日
选择指南 Logic Guide (Rev. AB) 2017年 6月 12日
应用手册 Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
选择指南 逻辑器件指南 2014 (Rev. AA) 最新英语版本 (Rev.AB) 2014年 11月 17日
用户指南 LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
EVM 用户指南 LASP Demo Board User's Guide 2005年 11月 1日
应用手册 Programming CPLDs Via the 'LVT8986 LASP 2005年 11月 1日
应用手册 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
应用手册 TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
应用手册 Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997年 8月 1日
应用手册 使用逻辑器件进行设计 (Rev. C) 1997年 6月 1日
应用手册 Input and Output Characteristics of Digital Integrated Circuits 1996年 10月 1日
应用手册 Live Insertion 1996年 10月 1日

设计和开发

如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。

评估板

14-24-LOGIC-EVM — 采用 14 引脚至 24 引脚 D、DB、DGV、DW、DYY、NS 和 PW 封装的逻辑产品通用评估模块

14-24-LOGIC-EVM 评估模块 (EVM) 旨在支持采用 14 引脚至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。

用户指南: PDF | HTML
英语版 (Rev.B): PDF | HTML
TI.com 上无现货
仿真模型

BSDL Model of SN74BCT8240A

SCTM001.ZIP (2 KB) - BSDL Model
封装 引脚 下载
SOIC (DW) 24 查看选项

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

支持和培训

视频