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SN74ALVTH16244

已停产

具有总线保持、TTL 兼容型 CMOS 输入和三态输出的 16 通道、2.3V 至 3.6V 缓冲器

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SN74ALVTH16244 不再投入量产
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SN74ALVCH16244 正在供货 具有总线保持和三态输出的 16 通道、1.65V 至 3.6V 缓冲器 Replacement

SN74ALVTH16244

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产品详情

Technology family ALVT Supply voltage (min) (V) 2.3 Supply voltage (max) (V) 3.6 Number of channels 16 IOL (max) (mA) 24 Supply current (max) (µA) 5000 IOH (max) (mA) -24 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Bus-hold, Over-voltage tolerant inputs Rating Catalog Operating temperature range (°C) -40 to 85
Technology family ALVT Supply voltage (min) (V) 2.3 Supply voltage (max) (V) 3.6 Number of channels 16 IOL (max) (mA) 24 Supply current (max) (µA) 5000 IOH (max) (mA) -24 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Bus-hold, Over-voltage tolerant inputs Rating Catalog Operating temperature range (°C) -40 to 85
SSOP (DL) 48 164.358 mm² 15.88 x 10.35 TSSOP (DGG) 48 101.25 mm² 12.5 x 8.1 TVSOP (DGV) 48 62.08 mm² 9.7 x 6.4
  • Members of the Texas Instruments WidebusTM Family
  • State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low Static-Power Dissipation
  • 5-V I/O Compatible
  • High Drive Capability (-32 mA/64 mA)
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
  • Support Unregulated Battery Operation Down to 2.3 V
  • Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C
  • Auto3-State Eliminates Bus Current Loading When Voltage at the Output Exceeds VCC
  • Ioff and Power-Up 3-State Support Hot Insertion
  • Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Package Options Include Plastic 300-mil Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), Thin Very Small-Outline (DGV) Packages, and 380-mil Fine-Pitch Ceramic Flat (WD) Package

    • NOTE: For tape and reel order entry:
    The DGGR package is abbreviated to GR, and
    the DGVR package is abbreviated to VR.
    Widebus is a trademark of Texas Instruments Incorporated.
  • Members of the Texas Instruments WidebusTM Family
  • State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low Static-Power Dissipation
  • 5-V I/O Compatible
  • High Drive Capability (-32 mA/64 mA)
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
  • Support Unregulated Battery Operation Down to 2.3 V
  • Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C
  • Auto3-State Eliminates Bus Current Loading When Voltage at the Output Exceeds VCC
  • Ioff and Power-Up 3-State Support Hot Insertion
  • Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Package Options Include Plastic 300-mil Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), Thin Very Small-Outline (DGV) Packages, and 380-mil Fine-Pitch Ceramic Flat (WD) Package

    • NOTE: For tape and reel order entry:
    The DGGR package is abbreviated to GR, and
    the DGVR package is abbreviated to VR.
    Widebus is a trademark of Texas Instruments Incorporated.

The 'ALVTH16244 devices are 16-bit buffers/line drivers designed for 2.5-V or 3.3-V VCC operation, but with the capability to provide a TTL interface to a 5-V system environment. These devices can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

When VCC is between 0 and 1.2 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.2 V, the output-enable (OE\) input should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

The SN54ALVTH16244 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ALVTH16244 is characterized for operation from -40°C to 85°C.

The 'ALVTH16244 devices are 16-bit buffers/line drivers designed for 2.5-V or 3.3-V VCC operation, but with the capability to provide a TTL interface to a 5-V system environment. These devices can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

When VCC is between 0 and 1.2 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.2 V, the output-enable (OE\) input should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

The SN54ALVTH16244 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ALVTH16244 is characterized for operation from -40°C to 85°C.
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类型 标题 下载最新的英语版本 日期
* 数据表 2.5-V/3.3-V 16-Bit Buffers/Drivers With 3-State Outputs 数据表 (Rev. G) 1999年 5月 21日

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包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点