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SN74AHCT16374

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具有三态输出的 16 位边沿 D 类触发器

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数据表

SN74AHCT16374

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产品详情

Number of channels 16 Technology family AHCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type TTL-Compatible CMOS Output type 3-State Clock frequency (max) (MHz) 70 IOL (max) (mA) 8 IOH (max) (mA) -8 Supply current (max) (µA) 40 Features Balanced outputs, Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 85 Rating Catalog
Number of channels 16 Technology family AHCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type TTL-Compatible CMOS Output type 3-State Clock frequency (max) (MHz) 70 IOL (max) (mA) 8 IOH (max) (mA) -8 Supply current (max) (µA) 40 Features Balanced outputs, Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 85 Rating Catalog
SSOP (DL) 48 164.358 mm² 15.88 x 10.35 TSSOP (DGG) 48 101.25 mm² 12.5 x 8.1 TVSOP (DGV) 48 62.08 mm² 9.7 x 6.4
  • Members of the Texas Instruments WidebusTM Family
  • EPICTM (Enhanced-Performance Implanted CMOS) Process
  • Inputs Are TTL-Voltage Compatible
  • Distributed VCC and GND Pins Minimize High-Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

EPIC and Widebus are trademarks of Texas Instruments Incorporated.
  • Members of the Texas Instruments WidebusTM Family
  • EPICTM (Enhanced-Performance Implanted CMOS) Process
  • Inputs Are TTL-Voltage Compatible
  • Distributed VCC and GND Pins Minimize High-Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

EPIC and Widebus are trademarks of Texas Instruments Incorporated.

The 'AHCT16374 devices are 16-bit edge-triggered D-type flip-flops with 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

These devices can be used as two 8-bit flip-flops or one 16-bit flip-flop. On the positive transition of the clock (CLK) input, the Q outputs of the flip-flop take on the logic levels at the data (D) inputs.

A buffered output-enable (OE\) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines without need for interface or pullup components.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

OE\ does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

The SN54AHCT16374 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74AHCT16374 is characterized for operation from -40°C to 85°C.

The 'AHCT16374 devices are 16-bit edge-triggered D-type flip-flops with 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

These devices can be used as two 8-bit flip-flops or one 16-bit flip-flop. On the positive transition of the clock (CLK) input, the Q outputs of the flip-flop take on the logic levels at the data (D) inputs.

A buffered output-enable (OE\) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines without need for interface or pullup components.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

OE\ does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

The SN54AHCT16374 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74AHCT16374 is characterized for operation from -40°C to 85°C.

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类型 标题 下载最新的英语版本 日期
* 数据表 SNX4AHCT1637416-Bit Edge-Triggered D-Type Flip-Flops With 3-State Outputs 数据表 (Rev. I) 2000年 2月 21日
应用手册 Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 2022年 12月 15日
应用手册 Implications of Slow or Floating CMOS Inputs (Rev. E) 2021年 7月 26日
选择指南 Little Logic Guide 2018 (Rev. G) 2018年 7月 6日
选择指南 Logic Guide (Rev. AB) 2017年 6月 12日
应用手册 How to Select Little Logic (Rev. A) 2016年 7月 26日
应用手册 Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
选择指南 逻辑器件指南 2014 (Rev. AA) 最新英语版本 (Rev.AB) 2014年 11月 17日
选择指南 小尺寸逻辑器件指南 (Rev. E) 最新英语版本 (Rev.G) 2012年 7月 16日
用户指南 LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
应用手册 选择正确的电平转换解决方案 (Rev. A) 英语版 (Rev.A) 2006年 3月 23日
产品概述 Design Summary for WCSP Little Logic (Rev. B) 2004年 11月 4日
应用手册 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
应用手册 Advanced High-Speed CMOS (AHC) Logic Family (Rev. C) 2002年 12月 2日
应用手册 Texas Instruments Little Logic Application Report 2002年 11月 1日
应用手册 TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
设计指南 AHC/AHCT Designer's Guide February 2000 (Rev. D) 2000年 2月 24日
产品概述 Military Advanced High-Speed CMOS Logic (AHC/AHCT) (Rev. C) 1998年 4月 1日
应用手册 Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 1997年 12月 1日
应用手册 Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997年 8月 1日
应用手册 CMOS Power Consumption and CPD Calculation (Rev. B) 1997年 6月 1日
应用手册 Live Insertion 1996年 10月 1日

设计和开发

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封装 引脚 下载
SSOP (DL) 48 查看选项
TSSOP (DGG) 48 查看选项
TVSOP (DGV) 48 查看选项
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订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

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