SN74ABT16543
- Members of the Texas Instruments WidebusTM Family
- State-of-the-Art EPIC-IIBTM BiCMOS Design Significantly Reduces Power Dissipation
- Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
- Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
- Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
- Flow-Through Architecture Optimizes PCB Layout
- High-Drive Outputs (-32-mA IOH, 64-mA IOL)
- Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings
Widebus and EPIC-IIB are trademarks of Texas Instruments Incorporated.
The 'ABT16543 16-bit registered transceivers contain two sets of
D-type latches for temporary storage of data flowing in either
direction. The 'ABT16543 can be used as two 8-bit transceivers or one
16-bit transceiver. Separate latch-enable (
or
) and output-enable (
or
) inputs are
provided for each register to permit independent control in either
direction of data flow.
The A-to-B enable (
)
input must be low to enter data from A or to output data from B. If
is low and
is low, the A-to-B latches are
transparent; a subsequent low-to-high transition of
puts the A latches in the storage
mode. With
and
both low, the 3-state B outputs are
active and reflect the data present at the output of the A latches.
Data flow from B to A is similar but requires using the
,
, and
inputs.
To ensure the high-impedance state during power up or power down,
should be tied
to VCC through a pullup resistor; the minimum value of the
resistor is determined by the current-sinking capability of the
driver.
The SN54ABT16543 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT16543 is characterized for operation from -40°C to 85°C.
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| 封装 | 引脚 | CAD 符号、封装和 3D 模型 |
|---|---|---|
| SSOP (DL) | 56 | Ultra Librarian |
| TSSOP (DGG) | 56 | Ultra Librarian |
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- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点