64-pin (DGG) package image

SN65LVDS117DGGR 正在供货

双路 8 端口 LVDS 中继器

正在供货 custom-reels 定制 可提供定制卷带

定价

数量 价格
+

其他包装数量 | 包装选项 这些产品完全相同,仅包装类型不同

SN65LVDS117DGG 正在供货
包装数量 | 包装 25 | TUBE
库存
数量 | 价格 1ku | +

质量信息

等级 Catalog
RoHS
REACH
引脚镀层/焊球材料 NIPDAU
MSL 等级/回流焊峰值温度 Level-2-260C-1 YEAR
质量、可靠性
和封装信息

包含信息:

  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
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更多制造信息

包含信息:

  • 制造厂地点
  • 封装厂地点
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出口管制分类

*仅供参考

  • 美国 ECCN:EAR99

封装信息

封装 | 引脚 TSSOP (DGG) | 64
工作温度范围 (°C) -40 to 85
包装数量 | 包装 2,000 | LARGE T&R

SN65LVDS117 的特性

  • Two Line Receivers and Eight ('109) or Sixteen ('117) Line Drivers Meet or Exceed the Requirements of ANSI EIA/TIA-644 Standard
  • Typical Data Signaling Rates to 400 Mbps or Clock Frequencies to 400 MHz
  • Outputs Arranged in Pairs From Each Bank
  • Enabling Logic Allows Individual Control of Each Driver Output Pair, Plus All Outputs
  • Low-Voltage Differential Signaling With Typical Output Voltage of 350 mV and a 100-Ω Load
  • Electrically Compatible With LVDS, PECL, LVPECL, LVTTL, LVCMOS, GTL, BTL, CTT, SSTL, or HSTL Outputs With External Termination Networks
  • Propagation Delay Times < 4.5 ns
  • Output Skew Less Than 550 ps Bank Skew Less Than150 ps Part-to-Part Skew Less Than 1.5 ns
  • Total Power Dissipation Typically <500 mW With All Ports Enabled and at 200 MHz
  • Driver Outputs or Receiver Input Equals High Impedance When Disabled or With VCC < 1.5 V
  • Bus-Pin ESD Protection Exceeds 12 kV
  • Packaged in Thin Shrink Small-Outline Package With 20-Mil Terminal Pitch

SN65LVDS117 的说明

The SN65LVDS109 and SN65LVDS117 are configured as two identical banks, each bank having one differential line receiver connected to either four ('109) or eight ('117) differential line drivers. The outputs are arranged in pairs having one output from each of the two banks. Individual output enables are provided for each pair of outputs and an additional enable is provided for all outputs.

The line receivers and line drivers implement the electrical characteristics of low-voltage differential signaling (LVDS). LVDS, as specified in EIA/TIA-644, is a data signaling technique that offers low power, low noise emission, high noise immunity, and high switching speeds. (Note: The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media, the noise coupling to the environment, and other system characteristics.)

The intended application of these devices, and the LVDS signaling technique, is for point-to-point or point-to-multipoint (distributed simplex) baseband data transmission on controlled impedance media of approximately 100 Ω. The transmission media may be printed-circuit board traces, backplanes, or cables. The large number of drivers integrated into the same silicon substrate, along with the low pulse skew of balanced signaling, provides extremely precise timing alignment of the signals being repeated from the inputs. This is particularly advantageous for implementing system clock and data distribution trees.

The SN65LVDS109 and SN65LVDS117 are characterized for operation from –40°C to 85°C.

定价

数量 价格
+

其他包装数量 | 包装选项 这些产品完全相同,仅包装类型不同

SN65LVDS117DGG 正在供货
包装数量 | 包装 25 | TUBE
库存
数量 | 价格 1ku | +

包装方式

您可以根据器件数量选择不同的包装方式,包括完整卷带、定制卷带、剪切带、管装或托盘。

定制卷带是从整盘卷带上剪下来的具有连续长度的剪切带,是一种可以对特定数量提供产品批次及生产日期跟踪的包装方式。根据行业标准,使用黄铜垫片在剪切带两端各连接一个 18 英寸的引带和尾带,以直接送入自动组装机。涉及定制卷带的 TI 订单将包含卷带费用。

剪切带是从整盘卷带上剪下来的特定长度的编带。根据所申请器件数量的不同,TI 可能会使用多条剪切带或多个盒子进行包装。

TI 通常会根据库存情况选择将管装托盘器件以盒装或者管装或托盘形式发货。所有器件均会按照 TI 内部规定的静电放电和湿敏等级保护要求进行包装。

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可提供批次和生产日期代码选项

您可在购物车中添加器件数量以开始结算流程,并查看现有库存中可选择批次或生产日期代码的选项。

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