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Technology family S Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 1 Inputs per channel 11 IOL (max) (mA) -0.4 IOH (max) (mA) 16 Input type Bipolar Output type TTL Features High speed (tpd 10-50ns) Data rate (max) (Mbps) 50 Rating Military Operating temperature range (°C) -55 to 125
Technology family S Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 1 Inputs per channel 11 IOL (max) (mA) -0.4 IOH (max) (mA) 16 Input type Bipolar Output type TTL Features High speed (tpd 10-50ns) Data rate (max) (Mbps) 50 Rating Military Operating temperature range (°C) -55 to 125
CDIP (J) 14 130.4652 mm² 19.56 x 6.67 CFP (W) 14 58.023 mm² 9.21 x 6.3
  • Package Options Include Plastic “Small Outline" Packages, Ceramic Chip Carriers and Flat Packages, and Plastic and Ceramic DIPs
  • Dependable Texas Instruments Quality and Reliability

 

  • Package Options Include Plastic “Small Outline" Packages, Ceramic Chip Carriers and Flat Packages, and Plastic and Ceramic DIPs
  • Dependable Texas Instruments Quality and Reliability

 

These devices contain 4-2-3-2 input AND-OR-INVERT gates. They perform the Boolean function Y = ABCD + EF + GHI + JK\. The 'S64 has totem-pole outputs and the 'S65 has open-collector outputs.

The SN54S64 and the SN54S65 are characterized for operation over the full military temperature range of -55°C to 125°C. The SN74S64 and the SN74S65 are characterized for operation from 0°C to 70°C.

 

These devices contain 4-2-3-2 input AND-OR-INVERT gates. They perform the Boolean function Y = ABCD + EF + GHI + JK\. The 'S64 has totem-pole outputs and the 'S65 has open-collector outputs.

The SN54S64 and the SN54S65 are characterized for operation over the full military temperature range of -55°C to 125°C. The SN74S64 and the SN74S65 are characterized for operation from 0°C to 70°C.

 

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* 数据表 4-2-3-2 Input AND-OR-Invert Gates 数据表 1988年 3月 1日

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包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

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