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SN54LS283-SP

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具有快速进位功能的 4 位二进制全加器

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SN54LS283-SP

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产品详情

Technology family LS Bits (#) 4 Rating Space Operating temperature range (°C) -55 to 125
Technology family LS Bits (#) 4 Rating Space Operating temperature range (°C) -55 to 125
CDIP (J) 16 135.3552 mm² 19.56 x 6.92
  • Full-Carry Look-Ahead Across the Four Bits
  • Systems Achieve Partial Look-Ahead Performance with the Economy of Ripple Carry
  • Supply Voltage and Ground on Corner Pins to Simplify P-C Board Layout
  • Full-Carry Look-Ahead Across the Four Bits
  • Systems Achieve Partial Look-Ahead Performance with the Economy of Ripple Carry
  • Supply Voltage and Ground on Corner Pins to Simplify P-C Board Layout

The '283 and 'LS283 adders are electrically and functionally identical to the '83A and 'LS83A, respectively; only the arrangement of the terminals has been changed. The 'S283 high performance versions are also functionally identical.

These improved full adders perform the addition of two 4-bit binary words. The sum () outputs are provided for each bit and the resultant carry (C4) is obtained from the fourth bit. These adders feature full internal look-ahead across all four bits generating the carry term in ten nanoseconds, typically, for the '283 and 'LS283, and 7.5 nanoseconds for the 'S283. This capability provides the system designer with partial look-ahead performance at the economy and reduced package count of a ripple-carry implementation.

The adder logic, including the carry, is implemented in its true form. End around carry can be accomplished without the need for logic or level inversion.

Series 54, Series 54LS, and Series 54S circuits are characterized for operation over the full temperature range of -55°C to 125°C. Series 74, Series 74LS, and Series 74S circuits are characterized for 0°C to 70°C operation.

The '283 and 'LS283 adders are electrically and functionally identical to the '83A and 'LS83A, respectively; only the arrangement of the terminals has been changed. The 'S283 high performance versions are also functionally identical.

These improved full adders perform the addition of two 4-bit binary words. The sum () outputs are provided for each bit and the resultant carry (C4) is obtained from the fourth bit. These adders feature full internal look-ahead across all four bits generating the carry term in ten nanoseconds, typically, for the '283 and 'LS283, and 7.5 nanoseconds for the 'S283. This capability provides the system designer with partial look-ahead performance at the economy and reduced package count of a ripple-carry implementation.

The adder logic, including the carry, is implemented in its true form. End around carry can be accomplished without the need for logic or level inversion.

Series 54, Series 54LS, and Series 54S circuits are characterized for operation over the full temperature range of -55°C to 125°C. Series 74, Series 74LS, and Series 74S circuits are characterized for 0°C to 70°C operation.
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类型 标题 下载最新的英语版本 日期
* 数据表 4-Bit Binary Full Adders With Fast Carry 数据表 (Rev. A) 2001年 3月 8日
* SMD SN54LS283-SP SMD 5962-76043 2016年 7月 8日
更多文献资料 TI Engineering Evaluation Units vs. MIL-PRF-38535 QML Class V Processing (Rev. A) 2023年 8月 31日
应用手册 单粒子效应置信区间计算 (Rev. A) PDF | HTML 英语版 (Rev.A) PDF | HTML 2022年 12月 2日
应用手册 重离子轨道环境单粒子效应估算 (Rev. A) PDF | HTML 英语版 (Rev.A) PDF | HTML 2022年 11月 30日
选择指南 TI Space Products (Rev. I) 2022年 3月 3日
选择指南 Logic Guide (Rev. AB) 2017年 6月 12日
应用手册 Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
选择指南 逻辑器件指南 2014 (Rev. AA) 最新英语版本 (Rev.AB) 2014年 11月 17日
用户指南 LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
应用手册 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
应用手册 TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
应用手册 使用逻辑器件进行设计 (Rev. C) 1997年 6月 1日
应用手册 Designing with the SN54/74LS123 (Rev. A) 1997年 3月 1日
应用手册 Input and Output Characteristics of Digital Integrated Circuits 1996年 10月 1日
应用手册 Live Insertion 1996年 10月 1日

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包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

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