SN54BCT623
- State-of-the-Art BiCMOS Design Significantly Reduces ICCZ
- ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015
- Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK) and Flatpacks (W), and Plastic and Ceramic 300-mil DIPs (J, N)
The ´BCT623 bus transceiver is designed for asynchronous communication between data buses. The control function implementation allows for maximum flexibility in timing. The ´BCT623 provides true data at its outputs.
This device allows data transmission from the A bus to the B bus or from the B bus to the A bus depending upon the logic levels at the output-enable (OEAB and ) inputs.
The output-enable inputs can be used to disable the device so that the buses are effectively isolated. The dual-enable configuration gives the transceivers the capability of storing data by simultaneously enabling OEAB and . Each output reinforces its input in this configuration. When both OEAB and are enabled and all other data sources to the two sets of bus lines are at high impedance, both sets of bus lines (16 in all) will remain at their last states.
The SN54BCT623 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74BCT623 is characterized for operation from 0°C to 70°C.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | Octal Bus Transceivers With 3-State Outputs 数据表 (Rev. A) | 1993年 11月 1日 | |||
* | SMD | SN54BCT623 SMD 5962-90940 | 2016年 6月 21日 | |||
应用手册 | Implications of Slow or Floating CMOS Inputs (Rev. E) | 2021年 7月 26日 | ||||
选择指南 | Logic Guide (Rev. AB) | 2017年 6月 12日 | ||||
应用手册 | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015年 12月 2日 | ||||
选择指南 | 逻辑器件指南 2014 (Rev. AA) | 最新英语版本 (Rev.AB) | 2014年 11月 17日 | |||
用户指南 | LOGIC Pocket Data Book (Rev. B) | 2007年 1月 16日 | ||||
应用手册 | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 | ||||
应用手册 | TI IBIS File Creation, Validation, and Distribution Processes | 2002年 8月 29日 | ||||
应用手册 | Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) | 1997年 8月 1日 | ||||
应用手册 | 使用逻辑器件进行设计 (Rev. C) | 1997年 6月 1日 | ||||
应用手册 | Input and Output Characteristics of Digital Integrated Circuits | 1996年 10月 1日 | ||||
应用手册 | Live Insertion | 1996年 10月 1日 |
设计和开发
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订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点