ONET1101L

已停产

11.3Gbps 激光二极管驱动器

产品详情

Type Laser driver Data rate (max) (Mbps) 11300 Features 2-wire interface, Automatic power control loop, Bias current digital select, Modulation current digital select Supply current (typ) (µA) 66000 Imod (A) 0.085 Supply current (max) (µA) 118000 Deterministic jitter (typ) (ps) 5 Operating temperature range (°C) -25 to 100
Type Laser driver Data rate (max) (Mbps) 11300 Features 2-wire interface, Automatic power control loop, Bias current digital select, Modulation current digital select Supply current (typ) (µA) 66000 Imod (A) 0.085 Supply current (max) (µA) 118000 Deterministic jitter (typ) (ps) 5 Operating temperature range (°C) -25 to 100
VQFN (RGE) 24 16 mm² 4 x 4
  • Up to 11.3 Gbps Operation
  • Two-Wire Digital Interface
  • Digitally Selectable Modulation Current up to 80 mA
  • Digitally Selectable Bias Current up to 100 mA Source or Sink
  • Automatic Power Control (APC) Loop
  • Supports Transceiver Management System (TMS)
  • Programmable Input Equalizer
  • Cross-point Control
  • Includes Laser Safety Features
  • Adjustable Coupling Ratio
  • Single +3.3 V Supply
  • Case Temperature -25°C to 100°C
  • Small Surface Mount Footprint 4mm × 4mm
    24-Pin, RoHS-compliant QFN Package
  • APPLICATIONS
    • 10 Gigabit Ethernet Optical Transmitters
    • 8x and 10x Fibre Channel Optical Transmitters
    • SONET OC-192/SDH STM-64 Optical Transmitters
    • XFP and SFP+ Transceiver Modules
    • XENPAK, XPAK, X2 and 300-pin MSA Transponder Modules

  • Up to 11.3 Gbps Operation
  • Two-Wire Digital Interface
  • Digitally Selectable Modulation Current up to 80 mA
  • Digitally Selectable Bias Current up to 100 mA Source or Sink
  • Automatic Power Control (APC) Loop
  • Supports Transceiver Management System (TMS)
  • Programmable Input Equalizer
  • Cross-point Control
  • Includes Laser Safety Features
  • Adjustable Coupling Ratio
  • Single +3.3 V Supply
  • Case Temperature -25°C to 100°C
  • Small Surface Mount Footprint 4mm × 4mm
    24-Pin, RoHS-compliant QFN Package
  • APPLICATIONS
    • 10 Gigabit Ethernet Optical Transmitters
    • 8x and 10x Fibre Channel Optical Transmitters
    • SONET OC-192/SDH STM-64 Optical Transmitters
    • XFP and SFP+ Transceiver Modules
    • XENPAK, XPAK, X2 and 300-pin MSA Transponder Modules

The ONET1101L is a high-speed, 3.3-V laser driver designed to directly modulate a laser at data rates from 2 Gbps to 11.3 Gbps.

The device provides a two-wire serial interface that helps digital control of the modulation, plus bias currents and cross point, eliminating the need for external components. An optional input equalizer can be used for equalization of up to 300 mm (12") of microstrip or stripline transmission line on FR4 printed circuit boards.

The ONET1101L includes an integrated automatic power control (APC) loop, plus circuitry to support laser safety and transceiver management systems.

The laser driver is characterized for operation from -25°C to 100°C case temperature and is available in a small footprint using a 4mm × 4mm, 24-pin RoHS-compliant QFN package.

The ONET1101L is a high-speed, 3.3-V laser driver designed to directly modulate a laser at data rates from 2 Gbps to 11.3 Gbps.

The device provides a two-wire serial interface that helps digital control of the modulation, plus bias currents and cross point, eliminating the need for external components. An optional input equalizer can be used for equalization of up to 300 mm (12") of microstrip or stripline transmission line on FR4 printed circuit boards.

The ONET1101L includes an integrated automatic power control (APC) loop, plus circuitry to support laser safety and transceiver management systems.

The laser driver is characterized for operation from -25°C to 100°C case temperature and is available in a small footprint using a 4mm × 4mm, 24-pin RoHS-compliant QFN package.

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类型 标题 下载最新的英语版本 日期
* 数据表 11.3 Gbps Laser Diode Driver 数据表 2008年 3月 17日

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点