LMV1031
- (Typical LMV1031-20, 2V Supply; Unless Otherwise Noted)
- Signal to Noise Ratio 62 dB
- Output Voltage Noise (A-Weighted) −86 dBV
- Low Supply Current 72 μA
- Supply Voltage 2V to 5V
- Input Impedance >100 MΩ
- Max Input Signal 108 mVPP
- Output Voltage 1.09V
- Temperature Range −40°C to 85°C
- Large Dome 4-Bump DSBGA Package with Improved Adhesion Technology
All trademarks are the property of their respective owners.
The LMV1031 audio amplifier is an ideal replacement for the JFET preamplifier that is currently used in the electret microphones. The LMV1031 is optimized for applications that require extended battery life, such as Bluetooth communication links. The supply current for the LMV1031 is only 72 μA. This is a dramatic reduction from that required for a JFET equipped microphone. The LMV1031, with its separate output and supply pins, offers a higher PSRR and eliminates the need for additional external components.
The LMV1031 is ensured to operate from 2V to 5V supply voltage over the full temperature range, has a fixed voltage gain of 20 dB and enhanced SNR performance. The LMV1031 is optimized for an output biasing of 1.09V.
The LMV1031 has less than 200Ω of output impedance over the full audio bandwidth. The gain response of the LMV1031 is flat within the audio band and is stable over the temperature range.
The LMV1031 is available in a large dome 4-bump ultra thin DSBGA package that can easily fit on the PCB inside the miniature microphone metal can (package). This package is designed for microphone PCBs requiring 1 kg adhesion criteria.
技术文档
| 类型 | 标题 | 下载最新的英语版本 | 日期 | |||
|---|---|---|---|---|---|---|
| * | 数据表 | LMV1031-20 Amp for Internal 3-Wire Analog Microphones & External Preamp 数据表 (Rev. B) | 2013年 5月 2日 |
设计和开发
如需其他信息或资源，请点击以下任一标题进入详情页面查看（如有）。
PSPICE-FOR-TI — 适用于 TI 设计和模拟工具的 PSpice®
借助 PSpice for TI 的设计和仿真环境及其内置的模型库，您可对复杂的混合信号设计进行仿真。创建完整的终端设备设计和原型解决方案，然后再进行布局和制造，可缩短产品上市时间并降低开发成本。
在 PSpice for TI 设计和仿真工具中，您可以搜索 TI (...)
| 封装 | 引脚 | 下载 |
|---|---|---|
| DSBGA (YPD) | 4 | 查看选项 |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点
推荐产品可能包含与 TI 此产品相关的参数、评估模块或参考设计。