LM4991
- Available in Space-Saving WSON and SOIC Packages
- Ultra Low Current Shutdown Mode
- Can Drive Capacitive Loads up to 500pF
- Improved Click and Pop Circuitry Reduces Noises During Turn-On and Turn-Off Transitions
- 2.2 - 5.5V Operation
- No Output Coupling Capacitors, Snubber Networks, Bootstrap Capacitors or Gain-Setting Resistors Required
- Unity-Gain Stable
Key Specifications
- Improved PSRR at 217kHz and 1kHz: 64 dB (typ)
- PO at VDD = 5.0V, 10% THD, 1kHz
- LM4991LD (only), 3Ω, 4Ω: 3W (typ), 2.5 W (typ)
- All packages, 8Ω load: 1.5 W (typ)
- Shutdown current: 0.1µA (typ)
All trademarks are the property of their respective owners.
The LM4991 is a mono bridged audio power amplifier capable of delivering 3W of continuous average power into a 3Ω load with less than 10% THD when powered by a 5V power supply (see Note below). To conserve power in portable applications, the LM4991's micropower shutdown mode (ISD = 0.1µA, typ) is activated when VDD is applied to the SHUTDOWN pin.
Boomer audio power amplifiers are designed specifically to provide high power, high fidelity audio output. They require few external components and operate on low supply voltages from 2.2V to 5.5V. Since the LM4991 does not require output coupling capacitors, bootstrap capacitors, or snubber networks, it is ideally suited for low-power portable systems that require minimum volume and weight.
Additional LM4991 features include thermal shutdown protection, unity-gain stability, and external gain set.
Note: An LM4991LD that has been properly mounted to a circuit board will deliver 3W into 3Ω (at 10% THD). The other package options for the LM4991 will deliver 1.5W into 8Ω (at 10% THD). See the sections for further information concerning the LM4991LD and LM4991M.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | LM4991 3W Audio Power Amplifier with Shutdown Mode 数据表 (Rev. A) | 2013年 4月 5日 |
设计和开发
如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。
PSPICE-FOR-TI — 适用于 TI 设计和模拟工具的 PSpice®
借助 PSpice for TI 的设计和仿真环境及其内置的模型库,您可对复杂的混合信号设计进行仿真。创建完整的终端设备设计和原型解决方案,然后再进行布局和制造,可缩短产品上市时间并降低开发成本。
在 PSpice for TI 设计和仿真工具中,您可以搜索 TI (...)
封装 | 引脚 | 下载 |
---|---|---|
SOIC (D) | 8 | 查看选项 |
WSON (NGN) | 8 | 查看选项 |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点
推荐产品可能包含与 TI 此产品相关的参数、评估模块或参考设计。