产品详细信息
参数
封装|引脚|尺寸
特性
- WSON, SOIC, and VSSOP Surface Mount Packaging
- Switch On/Off Click Suppression
- Unity-Gain Stable
- Minimum External Components
Key Specifications
- THD+N at 1kHz, 350mW Continuous Average Output Power into 16Ω: 10% (max)
- THD+N at 1kHz, 300mW Continuous Average Output Power into 8Ω: 10% (max)
- Shutdown Current: 0.7μA (typ)
All trademarks are the property of their respective owners.
描述
The LM4819 is a mono bridged power amplifier that is capable of delivering 350mWRMS output power into a 16Ω load or 300mWRMS output power into an 8Ω load with 10% THD+N from a 5V power supply.
The LM4819 Boomer audio power amplifier is designed specifically to provide high quality output power and minimize PCB area with surface mount packaging and a minimal amount of external components. Since the LM4819 does not require output coupling capacitors, bootstrap capacitors or snubber networks, it is optimally suited for low-power portable applications.
The closed loop response of the unity-gain stable LM4819 can be configured using external gain-setting resistors. The device is available in WSON, VSSOP, and SOIC package types to suit various applications.
技术文档
类型 | 标题 | 下载最新的英文版本 | 日期 | |
---|---|---|---|---|
* | 数据表 | LM4819 350mW Audio Power Amplifier with Shutdown Mode 数据表 | 2013年 3月 21日 |
设计与开发
有关其他条款或所需资源,请点击下面的任何链接来查看详情页面。硬件开发
说明
The LM4819 is a mono bridged power amplifier that is capable of delivering 350mWRMS output power into a 16Ω load or 300mWRMS output power into an 8Ω load with 10% THD+N from a 5V power supply.
This LM4819MBD is an evaluation board designed to ease the evaluation and effort during the development of a (...)
特性
- Available in SOP surface mount package.
- Switch on/off click suppression.
- Unity-gain stable.
- Minimum external components.
Applications:
- General purpose audio
- Portable electronic devices
- Information Appliances (IA)
设计工具和仿真
借助 PSpice for TI 的设计和仿真环境及其内置的模型库,您可对复杂的混合信号设计进行仿真。创建完整的终端设备设计和原型解决方案,然后再进行布局和制造,可缩短产品上市时间并降低开发成本。
在 PSpice for TI 设计和仿真工具中,您可以搜索 TI 器件、了解产品系列、打开测试台并对您的设计进行仿真,从而进一步分析选定的器件。您还可对多个 TI 器件进行联合仿真,以更好地展现您的系统。
除了一个完整的预加载模型库之外,您还可以在 PSPICE-FOR-TI 工具中轻松访问 TI 器件的全新技术资料。在您确认找到适合您应用的器件后,可访问 TI store 购买产品。
借助 PSpice for TI,您可使用合适的工具来满足您在整个设计周期(从电路探索到设计开发和验证)的仿真需求。免费获取、轻松入门。立即下载 PSpice 设计和仿真套件,开始您的设计。
入门
- 申请使用 PSPICE-FOR-TI 仿真器
- 下载并安装
- 观看有关仿真入门的培训
特性
- 利用 Cadence PSpice 技术
- 带有一套数字模型的预装库可在最坏情形下进行时序分析
- 动态更新确保您可以使用全新的器件型号
- 针对仿真速度进行了优化,且不会降低精度
- 支持对多个产品进行同步分析
- 基于 OrCAD Capture 框架,提供对业界广泛使用的原理图捕获和仿真环境的访问权限
- 可离线使用
- 在各种工作条件和器件容许范围内验证设计,包括
- 自动测量和后处理
- Monte Carlo 分析
- 最坏情形分析
- 热分析
参考设计
设计文件
-
download Camera Reference Design for ARM ® Cortex®-M Microcontrollers (MCUs) BOM.pdf (108KB) -
download Camera Reference Design for ARM ® Cortex®-M Microcontrollers Assembly Drawing.pdf (181KB) -
download Camera Reference Design for ARM ® Cortex®-M Microcontrollers (MCUs) PCB.pdf (1047KB) -
download Camera Reference Design for ARM ® Cortex®-M Microcontrollers (MCUs) CAD Files.zip (1796KB) -
download Camera Reference Design for ARM ® Cortex®-M Microcontrollers (MCUs) Gerber.zip (45KB)
设计文件
-
download Audio Communication with Power over Ethernet (PoE) BOM.pdf (199KB) -
download Audio Communication with Power over Ethernet (PoE) Assembly Files.zip (215KB) -
download Audio Communication with Power over Ethernet (PoE) Layer Plots.zip (1849KB) -
download Audio Communication with Power over Ethernet (PoE) CAD Files.zip (25038KB) -
download Audio Communication with Power over Ethernet (PoE) Gerber.zip (286KB)
CAD/CAE 符号
封装 | 引脚 | 下载 |
---|---|---|
SOIC (D) | 8 | 了解详情 |
VSSOP (DGK) | 8 | 了解详情 |
WSON (NGL) | 8 | 了解详情 |
订购与质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/FIT 估算
- 材料成分
- 认证摘要
- 持续可靠性监测
推荐产品的参数、评估模块或参考设计可能与此 TI 产品相关