产品详情

Product type Amplifiers Rating Military Operating temperature range (°C) -40 to 85
Product type Amplifiers Rating Military Operating temperature range (°C) -40 to 85
WAFERSALE (YS) See data sheet
  • Low Input Bias Current...50 pA Typ
  • Low Input Noise Current
    0.01 pA/ Hz\ Typ
  • Low Supply Current...4.5 mA Typ
  • High Input impedance...1012 Typ
  • Internally Trimmed Offset Voltage
  • Wide Gain Bandwidth...3 MHz Typ
  • High Slew Rate...13 V/us Typ
  • Low Input Bias Current...50 pA Typ
  • Low Input Noise Current
    0.01 pA/ Hz\ Typ
  • Low Supply Current...4.5 mA Typ
  • High Input impedance...1012 Typ
  • Internally Trimmed Offset Voltage
  • Wide Gain Bandwidth...3 MHz Typ
  • High Slew Rate...13 V/us Typ

This device is a low-cost, high-speed, JFET-input operational amplifier with very low input offset voltage and a specified maximum input offset voltage drift. It requires low supply current yet maintains a large gain bandwidth product and a fast slew rate. In addition, the matched high-voltage JFET input provides very low input bias and offset currents.

The LF412C can be used in applications such as high-speed integrators, digital-to-analog converters, sample-and-hold circuits, and many other circuits.

The LF412C is characterized for operation from 0°C to 70°C.

This device is a low-cost, high-speed, JFET-input operational amplifier with very low input offset voltage and a specified maximum input offset voltage drift. It requires low supply current yet maintains a large gain bandwidth product and a fast slew rate. In addition, the matched high-voltage JFET input provides very low input bias and offset currents.

The LF412C can be used in applications such as high-speed integrators, digital-to-analog converters, sample-and-hold circuits, and many other circuits.

The LF412C is characterized for operation from 0°C to 70°C.

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类型 标题 下载最新的英语版本 日期
* 数据表 Dual JFET-Input Operational Amplifier 数据表 (Rev. B) 1994年 8月 1日

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

支持和培训