DRV103
- HIGH OUTPUT DRIVE: 1.5A and 3A Versions
- WIDE SUPPLY RANGE: +8V to +32V
- COMPLETE FUNCTION
- Digitally Controlled Input
- PWM Output
- Adjustable Internal Oscillator:500Hz to 100kHz
- Adjustable Delay and Duty Cycle
- FULLY PROTECTED
- Thermal and Current Limit Shutdown with Status OK Indicator Flag
- PACKAGES: SO-8 and PowerPAD™ SO--8
- APPLICATIONS
- ELECTROMECHANICAL DRIVER:
- Solenoids,Valves,Positioners,Actuators, Relays,Power Contactor Coils,Heaters,Lamps
- HYDRAULIC AND PNEUMATICS SYSTEMS
- PART HANDLERS AND SORTERS
- CHEMICAL PROCESSING
- ENVIRONMENTAL MONITORING AND HVAC
- THERMOELECTRIC COOLERS
- DC MOTOR SPEED CONTROLS
- MEDICAL AND SCIENTIFIC ANALYZERS
- FUEL INJECTOR DRIVERS
- ELECTROMECHANICAL DRIVER:
PowerPAD is a trademark of Texas Instruments.
The DRV103 is a low-side DMOS power switch employing a pulse-width modulated (PWM) output. Its rugged design is optimized for driving electromechanical devices such as valves, solenoids, relays, actuators, motors, and positioners. The DRV103 is also ideal for driving thermal devices such as heaters, coolers, and lamps. PWM operation conserves power and reduces heat rise, resulting in higher reliability. In addition, adjustable PWM allows fine control of the power delivered to the load. DC-to-PWM output delay time and oscillator frequency are also externally adjustable.
The DRV103 can be set to provide a strong initial closure, automatically switching to a "soft" hold mode for power savings. A resistor, analog voltage, or Digital-to-Analog (D/A) converter can control the duty cycle. An output OK flag indicates when thermal shutdown or over current occurs.
Two packages provide a choice of output current: 1.5A (SO-8) or 3A (PowerPAD SO-8 with exposed metal heat sink).
The DRV103 is specified for \x9640°C to +85°C.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | DRV103: PMW Low-Side Driver for Solenoids, Coils, Valves, Heaters, Lamps 数据表 (Rev. A) | 2001年 6月 19日 | |||
电子书 | 11 Ways to Protect Your Power Path | 2019年 7月 3日 | ||||
应用手册 | 所选封装材料的热学和电学性质 | 2008年 10月 16日 |
设计和开发
如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。
封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
HSOIC (DDA) | 8 | Ultra Librarian |
SOIC (D) | 8 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点
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