产品详细信息

Array diagonal (in) 0.55 Display resolution (Max) 1152 x 576 Component type DMD Chipset family DLP5530S-Q1
Array diagonal (in) 0.55 Display resolution (Max) 1152 x 576 Component type DMD Chipset family DLP5530S-Q1
CPGA (FYS) 149 718 mm² 22.3 x 32.2
  • Qualified for automotive applications
    • –40°C to 105°C operating DMD array temperature range
  • Functional Safety Quality-Managed
    • Documentation available to aid ISO 26262 functional safety system design up to ASIL-B
  • The DLP5530S-Q1 automotive chipset includes:
    • DLP5530S-Q1 DMD
    • DLPC230S-Q1
    • TPS99000S-Q1 system management and illumination controller
  • 0.55-inch diagonal micromirror array
    • 7.6-µm micromirror pitch
    • ±12° micromirror tilt angle (relative to flat state)
    • Bottom illumination for optimal efficiency and optical engine size
    • Supports 1152 × 576 input resolution
    • Up to 2304 x 1152 resolution with external GPU based diamond pre-processing
    • Compatible with LED or laser illumination
  • 600-MHz sub-LVDS DMD interface for low power and emission
  • 10-kHz DMD refresh rate over temperature extremes
  • Built-in self test of DMD memory cells
  • Qualified for automotive applications
    • –40°C to 105°C operating DMD array temperature range
  • Functional Safety Quality-Managed
    • Documentation available to aid ISO 26262 functional safety system design up to ASIL-B
  • The DLP5530S-Q1 automotive chipset includes:
    • DLP5530S-Q1 DMD
    • DLPC230S-Q1
    • TPS99000S-Q1 system management and illumination controller
  • 0.55-inch diagonal micromirror array
    • 7.6-µm micromirror pitch
    • ±12° micromirror tilt angle (relative to flat state)
    • Bottom illumination for optimal efficiency and optical engine size
    • Supports 1152 × 576 input resolution
    • Up to 2304 x 1152 resolution with external GPU based diamond pre-processing
    • Compatible with LED or laser illumination
  • 600-MHz sub-LVDS DMD interface for low power and emission
  • 10-kHz DMD refresh rate over temperature extremes
  • Built-in self test of DMD memory cells

The DLP5530S-Q1 automotive DMD, combined with the DLPC230S-Q1 DMD controller and TPS99000S-Q1 system management and illumination controller, provides the capability to achieve a high performance augmented reality HUD. The 2:1 aspect ratio supports very wide aspect ratio designs, and the 1.3-MP resolution enables retinal limited displays to be achieved in HUD applications. The DLP5530S-Q1 has more than 3 times the optical throughput of the preceding DLP3030-Q1 automotive DMD enabling wider field of view and larger driver eye box for enhanced user experience. This chipset, coupled with LEDs and an optical system, enables deep saturated colors of 125% NTSC, extremely high brightness of more than 15,000 cd/m2, high dynamic dimming ratio more than 5000:1, and high solar load tolerance. The DLP5530S-Q1 automotive DMD micromirror array is configured for bottom illumination which enables highly efficient and more compact optical engine designs. The S450 package has low thermal resistance to the DMD array to enable more efficient thermal solutions.

The DLP5530S-Q1 automotive DMD, combined with the DLPC230S-Q1 DMD controller and TPS99000S-Q1 system management and illumination controller, provides the capability to achieve a high performance augmented reality HUD. The 2:1 aspect ratio supports very wide aspect ratio designs, and the 1.3-MP resolution enables retinal limited displays to be achieved in HUD applications. The DLP5530S-Q1 has more than 3 times the optical throughput of the preceding DLP3030-Q1 automotive DMD enabling wider field of view and larger driver eye box for enhanced user experience. This chipset, coupled with LEDs and an optical system, enables deep saturated colors of 125% NTSC, extremely high brightness of more than 15,000 cd/m2, high dynamic dimming ratio more than 5000:1, and high solar load tolerance. The DLP5530S-Q1 automotive DMD micromirror array is configured for bottom illumination which enables highly efficient and more compact optical engine designs. The S450 package has low thermal resistance to the DMD array to enable more efficient thermal solutions.

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设计和开发

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封装 引脚数 下载
CPGA (FYS) 149 了解详情

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  • 器件标识
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  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 认证摘要
  • 持续可靠性监测

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