主页 数据转换器 数模转换器 (DAC) 高速 DAC (> 10MSPS)
主页
数据转换器
数模转换器 (DAC)
高速 DAC (> 10MSPS)

DAC5675A-SP

正在供货

QMLV、150krad、陶瓷、14 位、单通道、400MSPS DAC

立即订购
数据表

DAC5675A-SP

正在供货
数据表 立即订购

产品详情

Resolution (Bits) 14 Number of DAC channels 1 Interface type Parallel LVDS Sample/update rate (Msps) 400 Features Low Power Rating Space Interpolation 1x Power consumption (typ) (mW) 660 SFDR (dB) 82 Architecture Current Sink Operating temperature range (°C) -55 to 125 Reference type Int
Resolution (Bits) 14 Number of DAC channels 1 Interface type Parallel LVDS Sample/update rate (Msps) 400 Features Low Power Rating Space Interpolation 1x Power consumption (typ) (mW) 660 SFDR (dB) 82 Architecture Current Sink Operating temperature range (°C) -55 to 125 Reference type Int
CFP (HFG) 52 363.474225 mm² 19.065 x 19.065
  • QMLV (QML Class V) MIL-PRF-38535 Qualified, SMD 5962-07204
    • 5962-0720401VXC – Qualified over the Military Temperature Range (–55°C to 125°C)
    • 5962-0720402VXC – Qualified over Reduced Temperature Range (–55°C to 115°C) for Improved Dynamic Performance
  • High-Performance 52-Pin Ceramic Quad Flat Pack (HFG)
  • 400-MSPS Update Rate
  • LVDS-Compatible Input Interface
  • Spurious-Free Dynamic Range (SFDR) to Nyquist
    • 69 dBc at 70 MHz IF, 400 MSPS
  • W-CDMA Adjacent Channel Power Ratio (ACPR)
    • 73 dBc at 30.72 MHz IF, 122.88 MSPS
    • 71 dBc at 61.44 MHz IF, 245.76 MSPS
  • Differential Scalable Current Outputs: 2 to 20 mA
  • On-Chip 1.2-V Reference
  • Single 3.3-V Supply Operation
  • Power Dissipation: 660 mW at ƒCLK = 400 MSPS, ƒOUT = 20 MHz
  • APPLICATIONS
    • Radiation Hardened Digital to Analog (DAC) Applications
    • Space Satellite RF Data Transmission
    • Cellular Base Transceiver Station Transmit Channel:
      • CDMA: WCDMA, CDMA2000, IS-95
      • TDMA: GSM, IS-136, EDGE/GPRS
      • Supports Single-Carrier and Multicarrier Applications
    • Engineering Evaluation (/EM) Samples are Available(1)

(1) These units are intended for engineering evaluation only. They are processed to a non-compliant flow (for example, no burn-in) and are tested to temperature rating of 25°C only. These units are not suitable for qualification, production, radiation testing or flight use. Parts are not warranted for performance on full MIL specified temperature range of –55°C to 125°C or operating life.
All other trademarks are the property of their respective owners
  • QMLV (QML Class V) MIL-PRF-38535 Qualified, SMD 5962-07204
    • 5962-0720401VXC – Qualified over the Military Temperature Range (–55°C to 125°C)
    • 5962-0720402VXC – Qualified over Reduced Temperature Range (–55°C to 115°C) for Improved Dynamic Performance
  • High-Performance 52-Pin Ceramic Quad Flat Pack (HFG)
  • 400-MSPS Update Rate
  • LVDS-Compatible Input Interface
  • Spurious-Free Dynamic Range (SFDR) to Nyquist
    • 69 dBc at 70 MHz IF, 400 MSPS
  • W-CDMA Adjacent Channel Power Ratio (ACPR)
    • 73 dBc at 30.72 MHz IF, 122.88 MSPS
    • 71 dBc at 61.44 MHz IF, 245.76 MSPS
  • Differential Scalable Current Outputs: 2 to 20 mA
  • On-Chip 1.2-V Reference
  • Single 3.3-V Supply Operation
  • Power Dissipation: 660 mW at ƒCLK = 400 MSPS, ƒOUT = 20 MHz
  • APPLICATIONS
    • Radiation Hardened Digital to Analog (DAC) Applications
    • Space Satellite RF Data Transmission
    • Cellular Base Transceiver Station Transmit Channel:
      • CDMA: WCDMA, CDMA2000, IS-95
      • TDMA: GSM, IS-136, EDGE/GPRS
      • Supports Single-Carrier and Multicarrier Applications
    • Engineering Evaluation (/EM) Samples are Available(1)

(1) These units are intended for engineering evaluation only. They are processed to a non-compliant flow (for example, no burn-in) and are tested to temperature rating of 25°C only. These units are not suitable for qualification, production, radiation testing or flight use. Parts are not warranted for performance on full MIL specified temperature range of –55°C to 125°C or operating life.
All other trademarks are the property of their respective owners

The DAC5675A-SP is a radiation-tolerant, 14-bit resolution high-speed digital-to-analog converter (DAC) primarily suited for space satellite applications. The DAC5675A-SP is designed for high-speed digital data transmission in wired and wireless communication systems, high-frequency direct digital synthesis (DDS), and waveform reconstruction in test and measurement applications. The DAC5675A-SP has excellent SFDR at high intermediate frequencies, which makes it well suited for multicarrier transmission in TDMA and CDMA based cellular base transceiver stations (BTSs).

The DAC5675A-SP operates from a single supply voltage of 3.3 V. Power dissipation is 660 mW at ƒCLK = 400 MSPS, ƒOUT = 70 MHz. The DAC5675A-SP provides a nominal full-scale differential current output of 20 mA, supporting both single-ended and differential applications. The output current can be directly fed to the load with no additional external output buffer required. The output is referred to the analog supply voltage AVDD.

The DAC5675A-SP includes a low-voltage differential signaling (LVDS) interface for high-speed digital data input. LVDS features a low differential voltage swing with a low constant power consumption across frequency, allowing for high-speed data transmission with low noise levels (low electromagnetic interference (EMI)).

LVDS is typically implemented in low-voltage digital CMOS processes, making it the ideal technology for high-speed interfacing between the DAC5675A-SP and high-speed low-voltage CMOS ASICs or FPGAs.

The DAC5675A-SP current-source-array architecture supports update rates of up to 400 MSPS. On-chip edge-triggered input latches provide for minimum setup and hold times, thereby relaxing interface timing.

The DAC5675A-SP is specifically designed for a differential transformer-coupled output with a 50-Ω doubly-terminated load. With the 20-mA full-scale output current, both a 4:1 impedance ratio (resulting in an output power of 4 dBm) and 1:1 impedance ratio transformer (–2 dBm) is supported. The last configuration is preferred for optimum performance at high output frequencies and update rates. The outputs are terminated to AVDD and have voltage compliance ranges from AVDD – 1 to AVDD + 0.3 V.

An accurate on-chip 1.2-V temperature-compensated bandgap reference and control amplifier allows the user to adjust this output current from 20 to 2 mA. This provides 20-dB gain range control capabilities. Alternatively, an external reference voltage may be applied. The DAC5675A-SP features a SLEEP mode, which reduces the standby power to approximately 18 mW.

The DAC5675A-SP is available in a 52-pin ceramic nonconductive tie-bar package (HFG). The device is specified for operation over the military temperature range of –55°C to 125°C and W temperature range of –55°C to 115°C.

The DAC5675A-SP is a radiation-tolerant, 14-bit resolution high-speed digital-to-analog converter (DAC) primarily suited for space satellite applications. The DAC5675A-SP is designed for high-speed digital data transmission in wired and wireless communication systems, high-frequency direct digital synthesis (DDS), and waveform reconstruction in test and measurement applications. The DAC5675A-SP has excellent SFDR at high intermediate frequencies, which makes it well suited for multicarrier transmission in TDMA and CDMA based cellular base transceiver stations (BTSs).

The DAC5675A-SP operates from a single supply voltage of 3.3 V. Power dissipation is 660 mW at ƒCLK = 400 MSPS, ƒOUT = 70 MHz. The DAC5675A-SP provides a nominal full-scale differential current output of 20 mA, supporting both single-ended and differential applications. The output current can be directly fed to the load with no additional external output buffer required. The output is referred to the analog supply voltage AVDD.

The DAC5675A-SP includes a low-voltage differential signaling (LVDS) interface for high-speed digital data input. LVDS features a low differential voltage swing with a low constant power consumption across frequency, allowing for high-speed data transmission with low noise levels (low electromagnetic interference (EMI)).

LVDS is typically implemented in low-voltage digital CMOS processes, making it the ideal technology for high-speed interfacing between the DAC5675A-SP and high-speed low-voltage CMOS ASICs or FPGAs.

The DAC5675A-SP current-source-array architecture supports update rates of up to 400 MSPS. On-chip edge-triggered input latches provide for minimum setup and hold times, thereby relaxing interface timing.

The DAC5675A-SP is specifically designed for a differential transformer-coupled output with a 50-Ω doubly-terminated load. With the 20-mA full-scale output current, both a 4:1 impedance ratio (resulting in an output power of 4 dBm) and 1:1 impedance ratio transformer (–2 dBm) is supported. The last configuration is preferred for optimum performance at high output frequencies and update rates. The outputs are terminated to AVDD and have voltage compliance ranges from AVDD – 1 to AVDD + 0.3 V.

An accurate on-chip 1.2-V temperature-compensated bandgap reference and control amplifier allows the user to adjust this output current from 20 to 2 mA. This provides 20-dB gain range control capabilities. Alternatively, an external reference voltage may be applied. The DAC5675A-SP features a SLEEP mode, which reduces the standby power to approximately 18 mW.

The DAC5675A-SP is available in a 52-pin ceramic nonconductive tie-bar package (HFG). The device is specified for operation over the military temperature range of –55°C to 125°C and W temperature range of –55°C to 115°C.
open-in-new 查找其他 高速 DAC (> 10MSPS)
下载 观看带字幕的视频 视频

技术文档

star =有关此产品的 TI 精选热门文档
未找到结果。请清除搜索并重试。
查看全部 15
类型 标题 下载最新的英语版本 日期
* 数据表 DAC5675A-SP Radiation-Tolerant, 14-Bit, 400-MSPS Digital-to-Analog Converter 数据表 (Rev. H) PDF | HTML 2016年 8月 4日
* 辐射与可靠性报告 ICS Radiation Test Results TI-DAC5675A-SP 14-Bit DAC 2021年 1月 7日
* SMD DAC5675A-SP SMD 5962-07204 2016年 7月 8日
* 辐射与可靠性报告 DAC5675A SEE Report 2015年 3月 31日
更多文献资料 TI Engineering Evaluation Units vs. MIL-PRF-38535 QML Class V Processing (Rev. A) 2023年 8月 31日
应用手册 单粒子效应置信区间计算 (Rev. A) PDF | HTML 英语版 (Rev.A) PDF | HTML 2022年 12月 2日
应用手册 重离子轨道环境单粒子效应估算 (Rev. A) PDF | HTML 英语版 (Rev.A) PDF | HTML 2022年 11月 30日
电子书 电子产品辐射手册 (Rev. B) 2022年 5月 7日
选择指南 TI Space Products (Rev. I) 2022年 3月 3日
电子书 电子产品辐射手册 (Rev. A) 2019年 5月 21日
应用手册 High Speed, Digital-to-Analog Converters Basics (Rev. A) 2012年 10月 23日
应用手册 所选封装材料的热学和电学性质 2008年 10月 16日
应用手册 高速数据转换 英语版 2008年 10月 16日
应用手册 CDCE72010 as a Clocking Solution for High-Speed Analog-to-Digital Converters 2008年 6月 8日
应用手册 Phase Noise Performance and Jitter Cleaning Ability of CDCE72010 2008年 6月 2日

设计和开发

如需其他信息或资源，请点击以下任一标题进入详情页面查看（如有）。

仿真模型

DAC5675A-SP IBIS MODEL (Rev. A)

SLAM279A.ZIP (4 KB) - IBIS Model
下载
模拟工具

PSPICE-FOR-TI — 适用于 TI 设计和模拟工具的 PSpice®

PSpice® for TI 可提供帮助评估模拟电路功能的设计和仿真环境。此功能齐全的设计和仿真套件使用 Cadence® 的模拟分析引擎。PSpice for TI 可免费使用，包括业内超大的模型库之一，涵盖我们的模拟和电源产品系列以及精选的模拟行为模型。

借助 PSpice for TI 的设计和仿真环境及其内置的模型库，您可对复杂的混合信号设计进行仿真。创建完整的终端设备设计和原型解决方案，然后再进行布局和制造，可缩短产品上市时间并降低开发成本。

在 PSpice for TI 设计和仿真工具中，您可以搜索 TI (...)
发送申请
封装 引脚 下载
CFP (HFG) 52 查看选项
应遵守 TI 评估类商品的标准条款与条件。

订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

推荐产品可能包含与 TI 此产品相关的参数、评估模块或参考设计。

支持和培训

视频