产品详情

Technology family CD4000 Function Encoder Configuration 8:3 Number of channels 1 Operating temperature range (°C) -55 to 125 Rating Catalog
Technology family CD4000 Function Encoder Configuration 8:3 Number of channels 1 Operating temperature range (°C) -55 to 125 Rating Catalog
PDIP (N) 16 181.42 mm² 19.3 x 9.4 SOIC (D) 16 59.4 mm² 9.9 x 6 SOP (NS) 16 79.56 mm² 10.2 x 7.8 TSSOP (PW) 16 32 mm² 5 x 6.4
  • Converts from 1 of 8 to binary
  • Provides cascading feature to handle any number of inputs
  • Group select indicates one or more priority inputs
  • Standardized, symmetrical output characteristics
  • 100% tested for quiescent current at 20 V
  • Maximum input current of 1 µA at 18 V over full package temperature range; 100 nA at 18 V and 25°C
  • Noise margin (full package-temperature range):
         0.5 V at VDD = 5 V
         1.5 V at VDD = 10 V
         1.5 V at VDD = 15 V
  • 5-V, 10-V, and 15-V parametric ratings
  • Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of 'B' Series CMOS Devices"
  • Applications:
    • Priority encoder
    • Binary or BCD encoder (keyboard encoding)
    • Floating point arithmetic

Data sheet acquired from Harris Semiconductor

  • Converts from 1 of 8 to binary
  • Provides cascading feature to handle any number of inputs
  • Group select indicates one or more priority inputs
  • Standardized, symmetrical output characteristics
  • 100% tested for quiescent current at 20 V
  • Maximum input current of 1 µA at 18 V over full package temperature range; 100 nA at 18 V and 25°C
  • Noise margin (full package-temperature range):
         0.5 V at VDD = 5 V
         1.5 V at VDD = 10 V
         1.5 V at VDD = 15 V
  • 5-V, 10-V, and 15-V parametric ratings
  • Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of 'B' Series CMOS Devices"
  • Applications:
    • Priority encoder
    • Binary or BCD encoder (keyboard encoding)
    • Floating point arithmetic

Data sheet acquired from Harris Semiconductor

CD4532B consists of combinational logic that encodes the highest priority input (D7-D0) to a 3-bit binary code. The eight inputs, D7 through D0, each have an assigned priority; D7 is the highest priority and D0 is the lowest. The priority encoder is inhibited when the chip-enable input EI is low. When EI is high, the binary representation of the highest-priority input appears on output lines Q2-Q0, and the group select line GS is high to indicate that priority inputs are present. The enable-out (EO) is high when no priority inputs are present. If any one input is high, EO is low and all cascaded lower-order stages are disabled.

The CD4532B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT, and NSR suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes).

CD4532B consists of combinational logic that encodes the highest priority input (D7-D0) to a 3-bit binary code. The eight inputs, D7 through D0, each have an assigned priority; D7 is the highest priority and D0 is the lowest. The priority encoder is inhibited when the chip-enable input EI is low. When EI is high, the binary representation of the highest-priority input appears on output lines Q2-Q0, and the group select line GS is high to indicate that priority inputs are present. The enable-out (EO) is high when no priority inputs are present. If any one input is high, EO is low and all cascaded lower-order stages are disabled.

The CD4532B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT, and NSR suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes).

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类型 标题 下载最新的英语版本 日期
* 数据表 CD4532B TYPES 数据表 (Rev. C) 2003年 10月 13日

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

支持和培训