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CD4011A

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军用 4 通道、双输入、3V 至 12V 与非门

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数据表

CD4011A

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数据表 立即订购

产品详情

Technology family CD4000 Supply voltage (min) (V) 3 Supply voltage (max) (V) 12 Number of channels 4 Inputs per channel 2 IOL (max) (mA) 0.62 IOH (max) (mA) -0.75 Input type Standard CMOS Output type Push-Pull Features High speed (tpd 10- 50ns) Data rate (max) (Mbps) 20 Rating Military Operating temperature range (°C) -55 to 125
Technology family CD4000 Supply voltage (min) (V) 3 Supply voltage (max) (V) 12 Number of channels 4 Inputs per channel 2 IOL (max) (mA) 0.62 IOH (max) (mA) -0.75 Input type Standard CMOS Output type Push-Pull Features High speed (tpd 10- 50ns) Data rate (max) (Mbps) 20 Rating Military Operating temperature range (°C) -55 to 125
CDIP (J) 14 130.4652 mm² 19.56 x 6.67 CDIP_SB (JD) 14 138.9395 mm² 18.55 x 7.49
  • Quiescent current specified to 15V
  • Maximum input leakage of 1 uA at 15 V (full package-temperature range)
  • 1-V noise margin (full package-temperature range)
  • Quiescent current specified to 15V
  • Maximum input leakage of 1 uA at 15 V (full package-temperature range)
  • 1-V noise margin (full package-temperature range)

The TI-CD4011A, CD4012A, and CD4023A NAND gates provide the system designer with direct implementation of the NAND function and supplement the existing family of CMOS gates

These types are supplied in 14-lead hermetic dual-in-line ceramic packages (D and F suffixes), 14-lead dual-in-line plastic packages (E suffix), 14-lead ceramic flat packages (K suffix), and in chip form (H suffix).

The TI-CD4011A, CD4012A, and CD4023A NAND gates provide the system designer with direct implementation of the NAND function and supplement the existing family of CMOS gates

These types are supplied in 14-lead hermetic dual-in-line ceramic packages (D and F suffixes), 14-lead dual-in-line plastic packages (E suffix), 14-lead ceramic flat packages (K suffix), and in chip form (H suffix).
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* 数据表 CMOS NAND Gates 数据表 2001年 11月 15日

订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

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