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电池认证 IC

BQ26100

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具有 SDQ 接口、基于 SHA-1/HMAC 的安全和认证 IC

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TMP1827 正在供货 SHA-256 认证器和 2Kbit EEPROM，集成 ±0.2°C 温度传感器，兼容 1-Wire® 协议 Authentication IC (SHA-256-HMAC) with 1-Wire® interface, 2-Kbit EEPROM, integrated temperature sensor (±0.2°C or ±0.9°C), and 1.8/2.5/3.3/5V VCC support

BQ26100

正在供货
数据表 立即订购

产品详情

Communication interface SDQ Features SHA-1 Authentication Vin (typ) (V) 5 Vin (max) (V) 7.7 Power consumption (typ) (mW) 50 Operating temperature range (°C) -40 to 85 Rating Catalog
Communication interface SDQ Features SHA-1 Authentication Vin (typ) (V) 5 Vin (max) (V) 7.7 Power consumption (typ) (mW) 50 Operating temperature range (°C) -40 to 85 Rating Catalog
VSON (DRP) 6 9 mm² 3 x 3
  • Provides authentication of battery packs through SHA-1 engine based HMAC
  • 160-byte one-time programmable (OTP), 16-bytes EEPROM
  • Internal time-base eliminates external crystal oscillator
  • Low-power operating modes:
    • Active: < 50 µA
    • Sleep: 8 µA typical
  • Single-wire SDQ interface
  • Powers directly from the communication bus
  • 6-lead VSON package
  • Provides authentication of battery packs through SHA-1 engine based HMAC
  • 160-byte one-time programmable (OTP), 16-bytes EEPROM
  • Internal time-base eliminates external crystal oscillator
  • Low-power operating modes:
    • Active: < 50 µA
    • Sleep: 8 µA typical
  • Single-wire SDQ interface
  • Powers directly from the communication bus
  • 6-lead VSON package

The bq26100 device provides a method to authenticate battery packs, ensuring that only packs manufactured by authorized sub-contractors are used in the end application. The security is achieved using the SHA-1 hash function inside the widely adopted keyed-hash message authentication code (HMAC) construction. A unique 128-bit key is stored in each bq26100 device, allowing the host to authenticate each pack.

The bq26100 device communicates to the system over a simple one-wire bi-directional serial interface. The 5-kbits/s SDQ bus interface reduces communications overhead in the external microcontroller. The bq26100 device also derives power over the SDQ bus line via an external capacitor.

The bq26100 device provides a method to authenticate battery packs, ensuring that only packs manufactured by authorized sub-contractors are used in the end application. The security is achieved using the SHA-1 hash function inside the widely adopted keyed-hash message authentication code (HMAC) construction. A unique 128-bit key is stored in each bq26100 device, allowing the host to authenticate each pack.

The bq26100 device communicates to the system over a simple one-wire bi-directional serial interface. The 5-kbits/s SDQ bus interface reduces communications overhead in the external microcontroller. The bq26100 device also derives power over the SDQ bus line via an external capacitor.
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类型 标题 下载最新的英语版本 日期
* 数据表 bq26100 SHA-1/HMAC-based security and authentication IC with an SDQ interface 数据表 (Rev. C) PDF | HTML 2019年 2月 17日
应用手册 Method to Enhance Authentication Security of BQ26100 PDF | HTML 2022年 9月 6日
选择指南 电源管理指南 2018 (Rev. K) 2018年 7月 31日
用户指南 bq26100 Evaluation Software User's Guide (Rev. A) 2013年 10月 4日
模拟设计期刊 Improving Battery Safety, Charging, and Fuel Gauging in Portable Media Apps 2009年 3月 11日
应用手册 Single-Cell Impedance Track Gas Gauge for Novices 2007年 6月 16日
应用手册 How to Implement SHA-1/HMAC Authentication for bq26100 (Rev. A) 2006年 10月 9日

设计和开发

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评估板

BQ26100EVM — 基于 SHA-1/HMAC 的安全和认证 IC

The bq26100 provides a method to authenticate battery packs and other peripherals. The bq26100 uses a 128 bit unique device key and a 160 bit SHA-1/HMAC response to provide authentication. The device key is stored securely in each bq26100 device, allowing the host to authenticate each (...)

用户指南: PDF
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支持软件

SLUC074 — EVSW for bq26100 and bq26100EVM

支持的产品和硬件

支持的产品和硬件

产品
电池认证 IC
  • BQ26100 — 具有 SDQ 接口、基于 SHA-1/HMAC 的安全和认证 IC
硬件开发
评估板
  • BQ26100EVM — 基于 SHA-1/HMAC 的安全和认证 IC
下载
封装 引脚 CAD 符号、封装和 3D 模型
VSON (DRP) 6 Ultra Librarian
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订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

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